All Core i5 Models

The Core i5 is a CPU series manufactured by Intel aimed at mid-range computers. In this tutorial, we will present a series of quick reference tables for you to compare the main differences between all models released to date.
By the way, the correct name of this line of processors is “Core i5,” not “Intel i5.”
Currently, there are four different generations of Core i5 processors available. In the table below, we describe the main differences between these generations.

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Model	7xx	6xx	4xx and 5xx	2xxx	2xxx
Market	Desktop	Desktop	Mobile	Desktop	Mobile
Generation	First	First	First	Second	Second
Microarchitecture	Nehalem	Nehalem	Nehalem	Sandy Bridge	Sandy Bridge
Manufacturing Process	45 nm	32 nm	32 nm	32 nm	32 nm
Number of Cores	4	2	2	4†	2
Hyper-Threading	No	Yes	Yes	No†	Yes
L1 cache (per core)	32 kiB+32 kiB	32 kiB+32 kiB	32 kiB+32kB	32 kiB+32 kiB	32 kiB+32kB
L2 cache (per core)	256 kiB	256 kiB	256 kiB	256 kiB	256 kiB
L3 cache (total)	8 MiB	4 MiB	3 MiB	6 MiB†	3 MiB
DMI bus	1 GB/s	1 GB/s	1 GB/s	2 GB/s	2 GB/s
Memory (DDR3)	1066, 1333	1066, 1333	800, 1066	1066, 1333	1066, 1333, 1600
DDR3L and DDR3L-RS	No	No	No	No	No
Graphics Engine	No	HD Graphics	HD Graphics	HD 2000 or HD 3000‡	HD 3000
DirectX	No	10	10	10.1‡	10.1
Graphics Processors	No	12	6	6 or 12‡	12
Graphics Base Clock	No	733 MHz or 900 MHz	166 MHz or 500 MHz	650 MHz or 850 MHz‡	350 MHz or 650 MHz
Graphics Boost Clock	No	No	500 MHz or 766 MHz	1.25 GHz or 1.1 GHz‡	1.2 GHz or 1.3 GHz
Displays Supported	None	2	2	2‡	2
PCIe Controller	2.0	2.0	2.0	2.0	2.0
PCIe Configuration	1×16, 2×8	1×16, 2×8	1×16	1×16, 2×8, 1×8, 2×4	1×16, 2×8, 1×8, 2×4
Turbo Boost	1.0	1.0	1.0	2.0	2.0
EM64T	Yes	Yes	Yes	Yes	Yes
Virtualization	Yes	Yes	Yes	Yes	Yes
SSE4.2	Yes	Yes	Yes	Yes	Yes
AES-NI	No	Yes	Yes	Yes	Yes
AVX	No	No	No	Yes	Yes
AVX2	No	No	No	No	No
Base Clock	133 MHz	133 MHz	133 MHz	100 MHz	100 MHz
Pinout	LGA1156	LGA1156	G1 or BGA1288	LGA1155	G2 or BGA1023

Model	3xxx	3xxx	4xxx	4xxx
Market	Desktop	Mobile	Desktop	Portátil
Generation	Third	Third	Quarta	Quarta
Microarchitecture	Ivy Bridge	Ivy Bridge	Haswell	Haswell
Manufacturing Process	22 nm	22 nm	22 nm	22 nm
Number of Cores	4	2	4*	2
Hyper-Threading	No	Yes	No*	Yes
L1 cache (per core)	32 kiB+32kB	32 kiB+32 kiB	32 kiB+32 kiB	32 kiB+32 kiB
L2 cache (per core)	256 kiB	256 kiB	256 kiB	256 kiB
L3 cache (total)	6 MiB	3 MiB	4 MiB or 6 MiB	3 MiB
DMI bus	2 GB/s	2 GB/s	2 GB/s	2 GB/s
Memory (DDR3)	1333, 1600	1333, 1600	1333, 1600	1333, 1600
DDR3L and DDR3L-RS	No	Yes	Yes	Yes
Graphics Engine	HD 2500 or HD 4000‡	HD 4000	HD 4600 or Iris Pro 5200	HD 4200, HD 4400, HD 4600, HD 5000 or Iris 5100
DirectX	11‡	11	11.1	11.1
Graphics Processors	6 or 12‡	12	20 or 40	10, 20 or 40
Graphics Base Clock	650 MHz‡	350 MHz or 650 MHz	200 MHz or 350 MHz	200 MHz or 400 MHz
Graphics Boost Clock	1.05 GHz, 1.1 GHz or 1.15 GHz‡	1.05 GHz, 1.15 GHz or 1.2 GHz	1,1 GHz, 1,15 GHz, 1,2 GHz ou 1,3 GHz	850 GHz, 1 GHz, 1,1 GHz, 1,15 GHz ou 1,25 GHz
Displays Supported	3‡	3	3	3
PCIe Controller	3.0	3.0	3.0	3.0
PCIe Configuration	1×16, 2×8, 1×8, 2×4	1×16, 2×8, 1×8, 2×4	1×16, 2×8, 1×8, 2×4	1×16, 2×8, 1×8, 2×4 ou 1×4, 4×1
Turbo Boost	2.0	2.0	2.0	2.0
EM64T	Yes	Yes	Yes	Yes
Virtualization	Yes	Yes	Yes	Yes
SSE4.2	Yes	Yes	Yes	Yes
AES-NI	Yes	Yes	Yes	Yes
AVX	Yes	Yes	Yes	Yes
AVX2	No	No	Yes	Yes
Base Clock	100 MHz	100 MHz	100 MHz	100 MHz
Pinout	LGA1155	G2 or BGA1023	LGA1150	FCPGA946, FCBGA1168 or FCBGA1364

 
† Except for the model 2390T, which has two cores, supports the Hyper-Threading technology, and has 3 MiB of cache L3.
‡ The 2550K model and models ending with a “P” don’t have integrated video.
* Except for the 4570T model, which has two cores and supports the Hyper-Threading technology.
Let’s now take a detailed look at all Core i5 models launched so far.
 
In the table below, we listed all Core i5 6xx and Core i5 7xx CPU models. These are desktop models based on the Nehalem microarchitecture and are also called first-generation Core i5 processors. These models use the socket LGA1156. The integrated memory controller supports dual-channel architecture as well as 1,066 MHz and 1,333 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 datapath or two x8 datapaths. Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, listed as 2.5 GT/s by Intel). All 6xx models have an integrated DirectX 10 video controller with 12 execution units running at 733 MHz or 900 MHz, using an engine that is known as “Intel HD Graphics,” a feature not present on the 7xx models. Models with integrated video support two video monitors.
The 7xx models are quad-core CPUs without the Hyper-Threading technology, while the 6xx models are dual-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having four cores. However, while on the 7xx models these cores are all “real,” on the 6xx models two of these cores are “real” and the other two are simulated.

sSpec	Model	Clock	Turbo Boost
SLBRP	760	2.80 GHz	3.46 GHz
SLBLH	750S	2.40 GHz	3.20 GHz
SLBLC	750	2.66 GHz	3.20 GHz
SLBTM	680	3.60 GHz	3.86 GHz
SLBLT	670	3.56 GHz	3.73 GHz
SLBTB	661	3.33 GHz	3.60 GHz
SLBNE	661	3.33 GHz	3.60 GHz
SLBTK	660	3.33 GHz	3.60 GHz
SLBLV	660	3.33 GHz	3.60 GHz
SLBXL	655K	3.20 GHz	3.46 GHz
SLBTJ	650	3.20 GHz	3.46 GHz
SLBLK	650	3.20 GHz	3.46 GHz

sSpec	Cores	HT	Video
SLBRP	4	No	No
SLBLH	4	No	No
SLBLC	4	No	No
SLBTM	2	Yes	HD Graphics
SLBLT	2	Yes	HD Graphics
SLBTB	2	Yes	HD Graphics
SLBNE	2	Yes	HD Graphics
SLBTK	2	Yes	HD Graphics
SLBLV	2	Yes	HD Graphics
SLBXL	2	Yes	HD Graphics
SLBTJ	2	Yes	HD Graphics
SLBLK	2	Yes	HD Graphics

sSpec	Model	Video Clock	L3 Cache
SLBRP	760	No	8 MiB
SLBLH	750S	No	8 MiB
SLBLC	750	No	8 MiB
SLBTM	680	733 MHz	4 MiB
SLBLT	670	733 MHz	4 MiB
SLBTB	661	900 MHz	4 MiB
SLBNE	661	900 MHz	4 MiB
SLBTK	660	733 MHz	4 MiB
SLBLV	660	733 MHz	4 MiB
SLBXL	655K	733 MHz	4 MiB
SLBTJ	650	733 MHz	4 MiB
SLBLK	650	733 MHz	4 MiB

sSpec	TDP (W)	Max. Temp. (°C)*	Voltage (V)
SLBRP	95	72.7	0.65 – 1.4
SLBLH	82	76.7	0.65 – 1.4
SLBLC	95	72.7	0.65 – 1.4
SLBTM	73	72.6	0.65 – 1.4
SLBLT	73	72.6	0.65 – 1.4
SLBTB	87	69.8	0.65 – 1.4
SLBNE	87	69.8	0.65 – 1.4
SLBTK	73	72.6	0.65 – 1.4
SLBLV	73	72.6	0.65 – 1.4
SLBXL	73	72.6	0.65 – 1.4
SLBTJ	73	72.6	0.65 – 1.4
SLBLK	73	72.6	0.65 – 1.4

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

The first-generation Core i5 targeted to laptops, named 4xx and 5xx, uses the Nehalem microarchitecture. They can use two different pinouts, BGA1288 or socket G1, and have an integrated dual-channel DDR3 memory controller supporting 800 MHz and 1,066 MHz DDR3 memories. (“UM” models support only DDR3-800 memories.) They have an integrated PCI Express 2.0 controller supporting one x16 connection and an integrated DirectX 10 video controller running at 500 MHz with a 766 MHz “boost” clock (166 MHz with a 500 MHz “boost” clock in “UM” models). Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, which is listed as 2.5 GT/s by Intel). The models listed below support two video monitors.
All Core i5 mobile CPUs are dual-core processors supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec	Model	Clock	Turbo Boost
SLC28	580M	2.66 GHz	3.33 GHz
SLC29	580M	2.66 GHz	3.33 GHz
SLBSN	560UM	1.33 GHz	2.13 GHz
SLBTS	560M	2.66 GHz	3.20 GHz
SLBTT	560M	2.66 GHz	3.20 GHz
SLBUJ	540UM	1.20 GHz	2.00 GHz
SLBTV	540M	2.53 GHz	3.06 GHz
SLBPF	540M	2.53 GHz	3.06 GHz
SLBPG	540M	2.53 GHz	3.06 GHz
SLBU3	520M	2.40 GHz	2.93 GHz
SLBNA	520M	2.40 GHz	2.93 GHz
SLBNB	520M	2.40 GHz	2.93 GHz
SLBQP	520UM	1.06 GHz	1.86 GHz
SLC27	480M	2.66 GHz	2.93 GHz
SLC26	480M	2.66 GHz	2.93 GHz
SLBXP	470UM	1.33 GHz	1.86 GHz
SLBZW	460M	2.53 GHz	2.80 GHz
SLC22	460M	2.53 GHz	2.80 GHz
SLBTZ	450M	2.40 GHz	2.66 GHz
SLBPM	430M	2.26 GHz	2.53 GHz
SLBPN	430M	2.26 GHz	2.53 GHz
SLBVS	430UM	1.20 GHz	1.73 GHz

sSpec	Cores	HT	Video
SLC28	2	Yes	HD Graphics
SLC29	2	Yes	HD Graphics
SLBSN	2	Yes	HD Graphics
SLBTS	2	Yes	HD Graphics
SLBTT	2	Yes	HD Graphics
SLBUJ	2	Yes	HD Graphics
SLBTV	2	Yes	HD Graphics
SLBPF	2	Yes	HD Graphics
SLBPG	2	Yes	HD Graphics
SLBU3	2	Yes	HD Graphics
SLBNA	2	Yes	HD Graphics
SLBNB	2	Yes	HD Graphics
SLBQP	2	Yes	HD Graphics
SLC27	2	Yes	HD Graphics
SLC26	2	Yes	HD Graphics
SLBXP	2	Yes	HD Graphics
SLBZW	2	Yes	HD Graphics
SLC22	2	Yes	HD Graphics
SLBTZ	2	Yes	HD Graphics
SLBPM	2	Yes	HD Graphics
SLBPN	2	Yes	HD Graphics
SLBVS	2	Yes	HD Graphics

sSpec	Model	Video Clock	Video Boost	Tech.
SLC28	580M	500 MHz	766 MHz	32 nm
SLC29	580M	500 MHz	766 MHz	32 nm
SLBSN	560UM	166 MHz	500 MHz	32 nm
SLBTS	560M	500 MHz	766 MHz	32 nm
SLBTT	560M	500 MHz	766 MHz	32 nm
SLBUJ	540UM	166 MHz	500 MHz	32 nm
SLBTV	540M	500 MHz	766 MHz	32 nm
SLBPF	540M	500 MHz	766 MHz	32 nm
SLBPG	540M	500 MHz	766 MHz	32 nm
SLBU3	520M	500 MHz	766 MHz	32 nm
SLBNA	520M	500 MHz	766 MHz	32 nm
SLBNB	520M	500 MHz	766 MHz	32 nm
SLBQP	520UM	166 MHz	500 MHz	32 nm
SLC27	480M	500 MHz	766 MHz	32 nm
SLC26	480M	500 MHz	766 MHz	32 nm
SLBXP	470UM	166 MHz	500 MHz	32 nm
SLBZW	460M	500 MHz	766 MHz	32 nm
SLC22	460M	500 MHz	766 MHz	32 nm
SLBTZ	450M	500 MHz	766 MHz	32 nm
SLBPM	430M	500 MHz	766 MHz	32 nm
SLBPN	430M	500 MHz	766 MHz	32 nm
SLBVS	430UM	166 MHz	500 MHz	32 nm

sSpec	L3 Cache	TDP (W)	Max. Temp. (°C)*	Package
SLC28	3 MiB	35	105	G1
SLC29	3 MiB	35	105	BGA1288
SLBSN	3 MiB	18	105	BGA1288
SLBTS	3 MiB	35	105	G1
SLBTT	3 MiB	35	105	BGA1288
SLBUJ	3 MiB	18	105	BGA1288
SLBTV	3 MiB	35	105	G1
SLBPF	3 MiB	35	105	BGA1288
SLBPG	3 MiB	35	105	G1
SLBU3	3 MiB	35	105	G1
SLBNA	3 MiB	35	105	BGA1288
SLBNB	3 MiB	35	105	G1
SLBQP	3 MiB	18	105	BGA1288
SLC27	3 MiB	35	105	G1
SLC26	3 MiB	35	105	BGA1288
SLBXP	3 MiB	18	105	BGA1288
SLBZW	3 MiB	35	105	G1
SLC22	3 MiB	35	105	BGA1288
SLBTZ	3 MiB	35	105	G1
SLBPM	3 MiB	35	105	BGA1288
SLBPN	3 MiB	35	105	G1
SLBVS	3 MiB	18	105	BGA1288

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

In the table below, we listed all Core i5-2xxx desktop CPU models, which are based on the Sandy Bridge microarchitecture. They are also called second-generation Core i5 processors and use the socket LGA1155. The integrated memory controller supports dual-channel architecture as well as 1,066 MHz and 1,333 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). All models (except the 2550K and the “P” models) have an integrated DirectX 10.1 video controller running at 650 MHz with a 1.25 GHz “boost” clock or 850 MHz with a 1.1 GHz “boost” clock, with six (HD 2000) or 12 (HD 3000) processing cores. Models with integrated video support two displays.
Second-generation Core i5 desktop CPUs with four cores don’t support the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having four cores. However, while on quad-core models these cores are all “real,” on the dual-core model two of these cores are “real” and the other two are simulated.

sSpec	Model	Clock	Turbo Boost
SR0QH	2550K	3.4 GHz	3.8 GHz
SR00A	2500T	2.3 GHz	3.3 GHz
SR009	2500S	2.7 GHz	3.7 GHz
SR008	2500K	3.3 GHz	3.7 GHz
SR00T	2500	3.3 GHz	3.7 GHz
SR0G1	2450P	3.2 GHz	3.5 GHz
SR0BB	2405S	2.5 GHz	3.3 GHz
SR00S	2400S	2.5 GHz	3.3 GHz
SR00Q	2400	3.1 GHz	3.4 GHz
SR065	2390T	2.7 GHz	3.5 GHz
SR0G2	2380P	3.1 GHz	3.4 GHz
SR02L	2320	3.0 GHz	3.3 GHz
SR02K	2310	2.9 GHz	3.2 GHz
SR00D	2300	2.8 GHz	3.1 GHz

sSpec	Cores	HT	Video
SR0QH	4	No	No
SR00A	4	No	HD 2000
SR009	4	No	HD 2000
SR008	4	No	HD 3000
SR00T	4	No	HD 2000
SR0G1	4	No	No
SR0BB	4	No	HD 3000
SR00S	4	No	HD 2000
SR00Q	4	No	HD 2000
SR065	2	Yes	HD 2000
SR0G2	4	No	No
SR02L	4	No	HD 2000
SR02K	4	No	HD 2000
SR00D	4	No	HD 2000

sSpec	Model	Video Clock	Video Boost	L3 Cache
SR0QH	2550K	No	No	6 MiB
SR00A	2500T	650 MHz	1.25 GHz	6 MiB
SR009	2500S	850 MHz	1.1 GHz	6 MiB
SR008	2500K	850 MHz	1.1 GHz	6 MiB
SR00T	2500	850 MHz	1.1 GHz	6 MiB
SR0G1	2450P	No	No	6 MiB
SR0BB	2405S	850 MHz	1.1 GHz	6 MiB
SR00S	2400S	850 MHz	1.1 GHz	6 MiB
SR00Q	2400	850 MHz	1.1 GHz	6 MiB
SR065	2390T	650 MHz	1.25 GHz	3 MiB
SR0G2	2380P	No	No	6 MiB
SR02L	2320	850 MHz	1.1 GHz	6 MiB
SR02K	2310	850 MHz	1.1 GHz	6 MiB
SR00D	2300	850 MHz	1.1 GHz	6 MiB

sSpec	Tech.	TDP (W)	Max. Temp. (°C)*	Voltage (V)
SR0QH	32 nm	95	72.6	NA
SR00A	32 nm	45	69.8	NA
SR009	32 nm	65	69.1	NA
SR008	32 nm	95	72.6	NA
SR00T	32 nm	95	72.6	NA
SR0G1	32 nm	95	72.6	NA
SR0BB	32 nm	65	69.1	NA
SR00S	32 nm	65	69.1	NA
SR00Q	32 nm	95	72.6	NA
SR065	32 nm	35	65.0	NA
SR0G2	32 nm	95	72.6	NA
SR02L	32 nm	95	72.6	NA
SR02K	32 nm	95	72.6	NA
SR00D	32 nm	95	72.6	NA

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.
[nextpage title=”Core i5-2xxx Models (Mobile)”]
The second-generation Core i5 targeted to laptops, which use the Sandy Bridge microarchitecture, can use two different pinouts, BGA1023 or socket G2, and have an integrated dual-channel DDR3 memory controller supporting 1,066 MHz, 1,333 MHz, and 1,600 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an integrated DirectX 10.1 video controller running at 350 MHz with a 1.2 GHz “boost” clock on models with a TDP of 17 W, or 650 MHz with a 1.3 GHz “boost” clock on models with a TDP of 35 W, all with 12 processing cores (HD 3000 graphics engine).
All Core i5 mobile CPUs are dual-core processors supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec	Model	Clock	Turbo Boost
SR0CS	2557M	1.7 GHz	2.7 GHz
SR044	2540M	2.6 GHz	3.3 GHz
SR046	2540M	2.6 GHz	3.3 GHz
SR03W	2537M	1.4 GHz	2.3 GHz
SR048	2520M	2.5 GHz	3.2 GHz
NA	2520M	2.5 GHz	3.2 GHz
SR02U	2510E	2.5 GHz	3.1 GHz
SR0D6	2467M	1.6 GHz	2.3 GHz
SR0CH	2450M	2.5 GHz	3.1 GHz
SR06Z	2450M	2.5 GHz	3.1 GHz
SR04Z	2450M	2.5 GHz	3.1 GHz
NA	2435M	2.4 GHz	3 GHz
NA	2435M	2.4 GHz	3 GHz
SR04W	2430M	2.4 GHz	3 GHz
NA	2430M	2.4 GHz	3 GHz
SR04B	2410M	2.3 GHz	2.9 GHz
SR04G	2410M	2.3 GHz	2.9 GHz

sSpec	Cores	HT	Video
SR0CS	2	Yes	HD 3000
SR044	2	Yes	HD 3000
SR046	2	Yes	HD 3000
SR03W	2	Yes	HD 3000
SR048	2	Yes	HD 3000
NA	2	Yes	HD 3000
SR02U	2	Yes	HD 3000
SR0D6	2	Yes	HD 3000
SR0CH	2	Yes	HD 3000
SR06Z	2	Yes	HD 3000
SR04Z	2	Yes	HD 3000
NA	2	Yes	HD 3000
NA	2	Yes	HD 3000
SR04W	2	Yes	HD 3000
NA	2	Yes	HD 3000
SR04B	2	Yes	HD 3000
SR04G	2	Yes	HD 3000

sSpec	Model	Video Clock	Video Boost	Tech.
SR0CS	2557M	350 MHz	1.2 GHz	32 nm
SR044	2540M	650 MHz	1.3 GHz	32 nm
SR046	2540M	650 MHz	1.3 GHz	32 nm
SR03W	2537M	350 MHz	1.2 GHz	32 nm
SR048	2520M	650 MHz	1.3 GHz	32 nm
NA	2520M	650 MHz	1.3 GHz	32 nm
SR02U	2510E	650 MHz	1.3 GHz	32 nm
SR0D6	2467M	350 MHz	1.2 GHz	32 nm
SR0CH	2450M	650 MHz	1.3 GHz	32 nm
SR06Z	2450M	650 MHz	1.3 GHz	32 nm
SR04Z	2450M	650 MHz	1.3 GHz	32 nm
NA	2435M	650 MHz	1.3 GHz	32 nm
NA	2435M	650 MHz	1.3 GHz	32 nm
SR04W	2430M	650 MHz	1.3 GHz	32 nm
NA	2430M	650 MHz	1.3 GHz	32 nm
SR04B	2410M	650 MHz	1.3 GHz	32 nm
SR04G	2410M	650 MHz	1.3 GHz	32 nm

sSpec	L3 Cache	TDP (W)	Max. Temp. (°C)*	Package
SR0CS	3 MiB	17	100	BGA1023
SR044	3 MiB	35	100	G2
SR046	3 MiB	35	100	BGA1023
SR03W	3 MiB	17	100	BGA1023
SR048	3 MiB	35	100	G2
NA	3 MiB	35	100	BGA1023
SR02U	3 MiB	35	100	G2
SR0D6	3 MiB	17	100	BGA1023
SR0CH	3 MiB	35	100	G2
SR06Z	3 MiB	35	100	BGA1023
SR04Z	3 MiB	35	100	BGA1023
NA	3 MiB	35	100	G2
NA	3 MiB	35	100	BGA1023
SR04W	3 MiB	35	100	G2
NA	3 MiB	35	100	BGA1023
SR04B	3 MiB	35	100	G2
SR04G	3 MiB	35	100	BGA1023

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

The Core i5-3xxx models are based on the Ivy Bridge microarchitecture and are also known as the third-generation Core i5 processors. They use the socket LGA1155, the same used by the second-generation Core i5 processors. The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). All models (except the “P” models) have an integrated DirectX 11 video controller with six (Intel HD 2500 graphics) or 12 (Intel HD 4000 graphics) processing units, running at 650 MHz with a “boost” clock of 1.25 GHz on 35xx models, 1.1 GHz on 34xx models or 1.05 GHz on 33xx models. Models with integrated video support three displays (previous generations support two).

sSpec	Model	Clock	Turbo Boost
SR0PM	3570K	3.4 GHz	3.8 GHz
SR0T7	3570	3.4 GHz	3.8 GHz
SR0P1	3570T	2.3 GHz	3.3 GHz
SR0T9	3570S	3.1 GHz	3.8 GHz
SR0P0	3550	3.3 GHz	3.7 GHz
SR0P3	3550S	3 GHz	3.7 GHz
SR0PP	3475S	2.9 GHz	3.6 GHz
SR0T8	3470	3.2 GHz	3.6 GHz
SR0RJ	3470T	2.9 GHz	3.6 GHz
SR0TA	3470S	2.9 GHz	3.6 GHz
SR0PF	3450	3.1 GHz	3.5 GHz
SR0P2	3450S	2.8 GHz	3.5 GHz
SR0WS	3350P	3.1 GHz	3.3 GHz
SR0RQ	3330	3 GHz	3.2 GHz
SR0RR	3330S	2.7 GHz	3.2 GHz

sSpec	Cores	HT	Video
SR0PM	4	No	HD 4000
SR0T7	4	No	HD 2500
SR0P1	4	No	HD 2500
SR0T9	4	No	HD 2500
SR0P0	4	No	HD 2500
SR0P3	4	No	HD 2500
SR0PP	4	No	HD 2500
SR0T8	4	No	HD 2500
SR0RJ	4	No	HD 2500
SR0TA	4	No	HD 2500
SR0PF	4	No	HD 2500
SR0P2	4	No	HD 2500
SR0WS	4	No	No
SR0RQ	4	No	HD 2500
SR0RR	4	No	HD 2500

sSpec	Model	Video Clock	Video Boost	Tech.
SR0PM	3570K	650 MHz	1.15 GHz	22 nm
SR0T7	3570	650 MHz	1.15 GHz	22 nm
SR0P1	3570T	650 MHz	1.15 GHz	22 nm
SR0T9	3570S	650 MHz	1.15 GHz	22 nm
SR0P0	3550	650 MHz	1.15 GHz	22 nm
SR0P3	3550S	650 MHz	1.1 GHz	22 nm
SR0PP	3475S	650 MHz	1.1 GHz	22 nm
SR0T8	3470	650 MHz	1.1 GHz	22 nm
SR0RJ	3470T	650 MHz	1.1 GHz	22 nm
SR0TA	3470S	650 MHz	1.1 GHz	22 nm
SR0PF	3450	650 MHz	1.1 GHz	22 nm
SR0P2	3450S	650 MHz	1.1 GHz	22 nm
SR0WS	3350P	No	1.05 GHz	22 nm
SR0RQ	3330	650 MHz	1.05 GHz	22 nm
SR0RR	3330S	650 MHz	1.05 GHz	22 nm

sSpec	L3 Cache	TDP (W)	Max. Temp. (°C)*	Voltage (V)
SR0PM	6 MiB	77	67.4	NA
SR0T7	6 MiB	77	67.4	NA
SR0P1	6 MiB	45	69.8	NA
SR0T9	6 MiB	65	69.1	NA
SR0P0	6 MiB	77	67.4	NA
SR0P3	6 MiB	65	69.1	NA
SR0PP	6 MiB	65	69.1	NA
SR0T8	6 MiB	77	67.4	NA
SR0RJ	6 MiB	35	65.0	NA
SR0TA	6 MiB	65	69.1	NA
SR0PF	6 MiB	77	67.4	NA
SR0P2	6 MiB	65	69.1	NA
SR0WS	6 MiB	69	67.4	NA
SR0RQ	6 MiB	77	67.4	NA
SR0RR	6 MiB	65	NA	NA

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

As their desktop counterparts, the Core i5-3xxx models targeted to mobile computers are based on the Ivy Bridge microarchitecture and are also known as the third-generation Core i5 processors. They can use either the BGA1023 pinout or the socket S2 pinout. The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3, DDR3L, and DDR3L-RS memories. They also have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). All models have an integrated DirectX 11 video controller with 12 execution units (Intel HD 4000 graphics). This is one of the main differences between the mobile and the desktop models, since desktop models use the Intel HD 2500 graphics (six execution units). On “M” models, the graphics engine works at 650 MHz with 1.2 GHz at “boost” mode, while on “U” models, the graphics engine works at 350 MHz with a “boost” mode of 1.15 GHz on 34xx models or 1.05 GHz on 33xx models. All models support three displays (previous generations support two).
Differently from the desktop models, mobile third-generation Core i5 processors are dual-core CPUs with Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec	Model	Clock	Turbo Boost
SR0N7	3427U	1.8 GHz	2.8 GHz
SR0MV	3360M	2.8 GHz	3.5 GHz
SR0MW	3360M	2.8 GHz	3.5 GHz
SR0MX	3320M	2.6 GHz	3.3 GHz
SR0MY	3320M	2.6 GHz	3.3 GHz
SR0N8	3317U	1.7 GHz	2.6 GHz
SR0MZ	3210M	2.5 GHz	3.1 GHz
NA	3210M	2.5 GHz	3.1 GHz

sSpec	Cores	HT	Video
SR0N7	2	Yes	HD 4000
SR0MV	2	Yes	HD 4000
SR0MW	2	Yes	HD 4000
SR0MX	2	Yes	HD 4000
SR0MY	2	Yes	HD 4000
SR0N8	2	Yes	HD 4000
SR0MZ	2	Yes	HD 4000
NA	2	Yes	HD 4000

sSpec	Model	Video Clock	Video Boost	Tech.
SR0N7	3427U	350 MHz	1.15 GHz	22 nm
SR0MV	3360M	650 MHz	1.2 GHz	22 nm
SR0MW	3360M	650 MHz	1.2 GHz	22 nm
SR0MX	3320M	650 MHz	1.2 GHz	22 nm
SR0MY	3320M	650 MHz	1.2 GHz	22 nm
SR0N8	3317U	350 MHz	1.05 GHz	22 nm
SR0MZ	3210M	650 MHz	1.2 GHz	22 nm
NA	3210M	650 MHz	1.2 GHz	22 nm

sSpec	L3 Cache	TDP (W)	Max. Temp. (°C)*	Package
SR0N7	3 MiB	17	105	BGA1023
SR0MV	3 MiB	35	105	G2
SR0MW	3 MiB	35	105	BGA1023
SR0MX	3 MiB	35	105	G2
SR0MY	3 MiB	35	105	BGA1023
SR0N8	3 MiB	17	105	BGA1023
SR0MZ	3 MiB	35	105	G2
NA	3 MiB	35	105	BGA1023

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

Core i5-4xxx models are based on the Haswell microarchitecture and are also known as the fourth-generation Core i5 processors. They use a new socket, LGA1150, which is not compatible with motherboards developed for previous models.
The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).
These processors support AVX2 instructions, not available on previous models.
All models have an integrated DirectX 11.1 video controller, and two engines are available at the moment: HD 4600 (codenamed “GT2”, 20 processing units) and Iris Pro 5200 (codenamed “GT3e”, 40 processing units, and video memory integrated into the CPU).

sSpec	Model	Clock	Turbo Clock	Cores	HT	Video
SR14D	4670	3.4 GHz	3.8 GHz	4	No	HD 4600
SR14A	4670K	3.4 GHz	3.8 GHz	4	No	HD 4600
SR14K	4670S	3.1 GHz	3.8 GHz	4	No	HD 4600
NA	4670R	3.0 GHz	3.7 GHz	4	No	Iris Pro 5200
SR14P	4670T	2.3 GHz	3.3 GHz	4	No	HD 4600
SR14E	4570	3.2 GHz	3.6 GHz	4	No	HD 4600
SR14J	4570S	2.9 GHz	3.6 GHz	4	No	HD 4600
SR1CA	4570T	2.9 GHz	3.6 GHz	2	Sim	HD 4600
NA	4570R	2.7 GHz	3.2 GHz	4	No	Iris Pro 5200
SR14F	4440	3.1 GHz	3.3 GHz	4	No	HD 4600
SR14L	4440S	2.8 GHz	3.3 GHz	4	No	HD 4600
SR14G	4430	3.0 GHz	3.2 GHz	4	No	HD 4600
SR14M	4430S	2.7 GHz	3.2 GHz	4	No	HD 4600

sSpec	Model	Video Clock	Video Boost	Tech.	L3 Cache	TDP (W)	Max. Temp. (°C)*
SR14D	4670	350 MHz	1.2 GHz	22 nm	6 MiB	84	72.72
SR14A	4670K	350 MHz	1.2 GHz	22 nm	6 MiB	84	72.72
SR14K	4670S	350 MHz	1.2 GHz	22 nm	6 MiB	65	71.35
NA	4670R	200 MHz	1.3 GHz	22 nm	4 MiB	65	71.35
SR14P	4670T	350 MHz	1.2 GHz	22 nm	6 MiB	45	71.45
SR14E	4570	350 MHz	1.15 GHz	22 nm	6 MiB	84	72.72
SR14J	4570S	350 MHz	1.15 GHz	22 nm	6 MiB	65	71.35
SR1CA	4570T	200 MHz	1.15 GHz	22 nm	4 MiB	35	66.35
NA	4570R	200 MHz	1.15 GHz	22 nm	4 MiB	65	71.35
SR14F	4440	350 MHz	1.1 GHz	22 nm	6 MiB	84	NA
SR14L	4440S	350 MHz	1.1 GHz	22 nm	6 MiB	65	NA
SR14G	4430	350 MHz	1.1 GHz	22 nm	6 MiB	84	72.72
SR14M	4430S	350 MHz	1.1 GHz	22 nm	6 MiB	65	71.35

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

The fourth-generation Core i3 processors targeted to mobile computers are based on the Haswell microarchitecture.
These processors support AVX2 instructions, not available on previous models.
The “U” and “Y” models carry an integrated south bridge chip with a four-port USB 3.0 controller and a four-port SATA-600 controller. On these models, the PCI Express controller supports only one x4 connection or four x1 connections. On the other models, the PCI Express controller supports one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).
Several graphics engines are available, all DirectX 11.1: HD 4200 (codenamed “GT1”, 10 processing units), HD 4400 (codenamed “GT2”, 20 processing units), HD 4600 (codenamed “GT2”, 20 processing units), HD 5000 (codenamed “GT3”, 40 processing units), and Iris 5100 (codenamed “GT3”, 40 processing units).
The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3L and LPDDR3 (on models “U” and “Y”) memories.
Differently from the desktop models, mobile third-generation Core i5 processors are dual-core CPUs with Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec	Model	Clock	Turbo Clock	Cores	HT	Video
SR17Q	4402E	1.6 GHz	2.7 GHz	2	Yes	HD 4600
SR17M	4400E	2.7 GHz	3.3 GHz	2	Yes	HD 4600
SR16L	4350U	1.4 GHz	2.9 GHz	2	Yes	HD 5000
NA	4330M	2.8 GHz	3.5 GHz	2	Yes	HD 4600
NA	4302Y	1.6 GHz	2.3 GHz	2	Yes	HD 4200
NA	4300M	2.6 GHz	3.3 GHz	2	Yes	HD 4600
SR1ED	4300U	1.9 GHz	2.9 GHz	2	Yes	HD 4400
SR192	4300Y	1.6 GHz	2.3 GHz	2	Yes	HD 4200
SR189	4288U	2.6 GHz	3.1 GHz	2	Yes	Iris 5100
SR18A	4358U	2.4 GHz	2.9 GHz	2	Yes	Iris 5100
SR16M	4250U	1.3 GHz	2.6 GHz	2	Yes	HD 5000
SR191	4210Y	1.5 GHz	1.9 GHz	2	Yes	HD 4200
NA	4202Y	1.6 GHz	2.0 GHz	2	Yes	HD 4200
SR15G	4200H	2.8 GHz	3.4 GHz	2	Yes	HD 4600
SR1HA	4200M	2.5 GHz	3.1 GHz	2	Yes	HD 4600
SR170	4200U	1.6 GHz	2.6 GHz	2	Yes	HD 4400
SR18T	4200Y	1.4 GHz	1.9 GHz	2	Yes	HD 4200

sSpec	Model	Video Clock	Video Boost	Tech.	L3 Cache	TDP (W)	Max. Temp. (°C)*	Package
SR17Q	4402E	NA	NA	22 nm	3 MiB	25	100	FCBGA1364
SR17M	4400E	400 MHz	1 GHz	22 nm	3 MiB	37	100	FCBGA1364
SR16L	4350U	200 MHz	1.1 GHz	22 nm	3 MiB	15	100	FCBGA1168
NA	4330M	400 MHz	1.25 GHz	22 nm	3 MiB	37	100	NA
NA	4302Y	200 MHz	850 MHz	22 nm	3 MiB	11.5	100	NA
NA	4300M	400 MHz	1.25 GHz	22 nm	3 MiB	37	100	NA
SR1ED	4300U	200 MHz	1.1 GHz	22 nm	3 MiB	15	100	FCBGA1168
SR192	4300Y	200 MHz	850 MHz	22 nm	3 MiB	11.5	100	FCBGA1168
SR189	4288U	200 MHz	1.2 GHz	22 nm	3 MiB	28	100	FCBGA1168
SR18A	4358U	200 MHz	1.1 GHz	22 nm	3 MiB	28	100	FCBGA1168
SR16M	4250U	200 MHz	1 GHz	22 nm	3 MiB	15	100	FCBGA1168
SR191	4210Y	200 MHz	850 MHz	22 nm	3 MiB	11.5	100	FCBGA1168
NA	4202Y	200 MHz	850 MHz	22 nm	3 MiB	11.5	100	NA
SR15G	4200H	400 MHz	1.15 GHz	22 nm	3 MiB	47	100	FCBGA1364
SR1HA	4200M	400 MHz	1.15 GHz	22 nm	3 MiB	37	100	FCPGA946
SR170	4200U	200 MHz	1 GHz	22 nm	3 MiB	15	100	FCBGA1168
SR18T	4200Y	200 MHz	850 MHz	22 nm	3 MiB	11.5	100	FCBGA1168

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.