All Core 2 Models

[nextpage title=”Introduction”]

Core 2 Solo, Core 2 Duo, Core 2 Quad and Core 2 Extreme processors are based on the new Core microarchitecture, released to replace Netburst microarchitecture, used on Pentium 4 and CPU’s based on it. In this tutorial we will list all models from these processors released so far together with their main technical specs.

Core 2 family comes in four flavors: Core 2 Solo, a single-core mobile CPU that replaces Pentium M; Core 2 Duo, a dual-core CPU that replaces Pentium 4 and Pentium D; Core 2 Quad, which is a quad-core Core 2 Duo; and Core 2 Extreme, which replaces Pentium Extreme Edition and has models with two and four cores. Core 2 Extreme runs at higher clock rates and has its clock multiplier unlocked, which allows you to overclock the CPU by changing the CPU clock multiplier.Pay attention to not confuse Core 2 Duo with Core Duo. Core Duo is the commercial name for a Pentium M manufactured using 65 nm process, codenamed Yonah, while Core 2 Duo is the commercial name for the CPU codenamed Merom (for laptops) or Conroe (for desktops), which uses the new Intel Core microarchitecture. For an in-depth discussion on this new microarchitecture, read our Inside Intel Core Microarchitecture and Penryn Core New Features tutorials.

Here is a summary of the main Core 2 family features:

• Core microarchitecture.
• 32 KB instruction L1 memory cache and 32 KB data L1 memory cache for each core.
• Single-core techonology (on Core 2 Solo models), dual-core technology (on Core 2 Duo and some Core 2 Extreme models) or quad-core technology (on Core 2 Quad and some Core 2 Extreme models).
• 65 nm or 45 nm manufacturing process.
• Socket LGA775 on desktop models (except Core 2 Extreme QX9775, which uses socket 771)
• 800 MHz (200 MHz transferring four data per clock cycle), 1,066 MHz (266 MHz transferring four data per clock cycle), 1333 MHz (333 MHz transferring four data per clock cycle) or 1600 MHz (400 MHz transferring four data per clock cycle) external clock rates.
• 2 MB, 3 MB, 4 MB or 6 MB unified L2 memory cache (on processors with four cores L2 cache is divided in two, and each half is shared by each pair of cores).
• Intel Virtualization Technology. (Except on Core 2 Duo E4x00, E7x00 and E81xx models)
• Intel EM64T Technology
• SSE3 instruction set
• SSE4.1 instruction set on 45 nm models
• Execute Disable Bit
• Intelligent Power Capability
• Enhanced SpeedStep Technology

Now let’s talk about Core 2 Solo, Core 2 Duo, Core 2 Quad and Core 2 Extreme desktop and mobile models launched so far.

[nextpage title=”Core 2 Duo Models”]

In the table below we list all Core 2 Duo models released so far.

sSpec	Model	Internal Clock	External Clock	L2 Cache	Tech.	TDP (W)	Max. Temp. (° C)	Voltage
SLB9L	E8600	3.33 GHz	1,333 MHz	6 MB	45 nm	65	72.4	0.85V – 1.3625V
SLB9K	E8500	3.16 GHz	1,333 MHz	6 MB	45 nm	65	74.1	0.85 V – 1.3625 V
SLAPK	E8500	3.16 GHz	1,333 MHz	6 MB	45 nm	65	72.4	0.85 V – 1.3625 V
SLB9J	E8400	3.00 GHz	1,333 MHz	6 MB	45 nm	65	74.1	0.85 V – 1.3625 V
SLAPL	E8400	3.00 GHz	1,333 MHz	6 MB	45 nm	65	72.4	0.85 V – 1.3625 V
SLAPJ	E8300	2.83 GHz	1,333 MHz	6 MB	45 nm	65	72.4	0.85 V – 1.3625 V
SLAQR	E8190	2.66 GHz	1,333 MHz	6 MB	45 nm	65	72.4	0.85 V – 1.3625 V
SLAPP	E8200	2.66 GHz	1,333 MHz	6 MB	45 nm	65	72.4	0.85 V – 1.3625 V
SLGTD	E7600	3.06 GHz	1,066 MHz	3 MB	45 nm	65	74.1	0.85 V – 1.3625 V
SLB9Z	E7500	2.93 GHz	1,066 MHz	3 MB	45 nm	65	74.1	0.85 V – 1.3625 V
SLB9Y	E7400	2.80 GHz	1,066 MHz	3 MB	45 nm	65	74.1	0.85 V – 1.3625 V
SLB9X	E7300	2.66 GHz	1,066 MHz	3 MB	45 nm	65	74.1	0.85 V – 1.3625 V
SLAPB	E7300	2.66 GHz	1,066 MHz	3 MB	45 nm	65	74.1	0.85 V – 1.3625V
SLAPC	E7200	2.53 GHz	1,066 MHz	3 MB	45 nm	65	74.1	0.85 V – 1.3625 V
SLAVN	E7200	2.53 GHz	1,066 MHz	3 MB	45 nm	65	74.1	0.85 V – 1.3625 V
SLA9U	E6850	3.00 GHz	1,333 MHz	4 MB	65 nm	65	72	0.962 V – 1.35 V
SLA9V	E6750	2.66 GHz	1,333 MHz	4 MB	65 nm	65	72	0.962 V – 1.35 V
SL9ZF	E6700	2.66 GHz	1,066 MHz	4 MB	65 nm	65	60.1	0.85 V – 1.5 V
SL9S7	E6700	2,66 GHz	1,066 MHz	4 MB	65 nm	65	60.1	0.85 V – 1.35 V
SL9ZL	E6600	2.40 GHz	1,066 MHz	4 MB	65 nm	65	60.1	1.18 V – 1.32 V
SL9S8	E6600	2.40 GHz	1,066 MHz	4 MB	65 nm	65	60.1	0.85 V – 1.35 V
SLA9X	E6550	2.33 GHz	1,333 MHz	4 MB	65 nm	65	72	0.962 V – 1.35 V
SLAA5	E6540	2.33 GHz	1,333 MHz	4 MB	65 nm	65	72	0.962 V – 1.35 V
SLA4T	E6420	2.13 GHz	1,066 MHz	4 MB	65 nm	65	60.1	0.85 V – 1.5 V
SL9T9	E6400	2.13 GHz	1,066 MHz	2 MB	65 nm	65	61.4	1.22 V – 1.32 V
SL9S9	E6400	2.13 GHz	1,066 MHz	2 MB	65 nm	65	61.4	0.85 V – 1.35 V
SLA4U	E6320	1.86 GHz	1,066 MHz	4 MB	65 nm	65	60.1	0.85 V – 1.5 V
SL9TA	E6300	1.86 GHz	1,066 MHz	2 MB	65 nm	65	61.4	1.22 V – 1.32 V
SL9SA	E6300	1.86 GHz	1,066 MHz	2 MB	65 nm	65	61.4	0.85 V – 1.35 V
SLALT	E4700	2.6 GHz	800 MHz	2 MB	65 nm	65	73.3	1.162 V – 1.312 V
SLA94	E4600	2.4 GHz	800 MHz	2 MB	65 nm	65	73.3	1.162 V – 1.312 V
SLA95	E4500	2.2 GHz	800 MHz	2 MB	65 nm	65	73.3	0.962 V – 1.35 V
SL93F	E4400	2.0 GHz	800 MHz	2 MB	65 nm	65	61.4	1.16 V – 1.31 V
SLA98	E4400	2.0 GHz	800 MHz	2 MB	65 nm	65	73.3	1.16 V – 1.31 V
SL9TB	E4300	1.8 GHz	800 MHz	2 MB	65 nm	65	61.4	0.85 V – 1.35 V

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

[nextpage title=”Core 2 Quad Models”]

In the table below we list all Core 2 Quad models released so far.

sSpec	Model	Internal Clock	External Clock	L2 Cache	Tech.	TDP (W)	Max. Temp. (° C)	Voltage
SLB8W	Q9650	3.00 GHz	1,333 MHz	12 MB	45 nm	95	71.4	0.85 V – 1.3625 V
SLGAE	Q9550S	2.83 GHz	1,333 MHz	12 MB	45 nm	65	76.3	0.85 V – 1.3625 V
SLB8V	Q9550	2.83 GHz	1,333 MHz	12 MB	45 nm	95	71.4	0.85 V – 1.3625 V
SLAWQ	Q9550	2.83 GHz	1,333 MHz	12 MB	45 nm	95	71.4	0.85 V – 1.3625 V
SLGYZ	Q9505S	2.83 GHz	1,333 MHz	6 MB	45 nm	65	76.3	0.85 V – 1.3625 V
SLGYY	Q9505	2.83 GHz	1,333 MHz	6 MB	45 nm	95	71.4	0.85 V – 1.3625 V
SLAWR	Q9450	2.66 GHz	1,333 MHz	12 MB	45 nm	95	71.4	0.85 V – 1.3625 V
SLG9U	Q9400S	2.66 GHz	1,333 MHz	6 MB	45 nm	65	76.3	0.85 V – 1.3625 V
SLB6B	Q9400	2.66 GHz	1,333 MHz	6 MB	45 nm	95	71.4	0.85 V – 1.3625 V
SLAWE	Q9300	2.50 GHz	1,333 MHz	6 MB	45 nm	95	71.4	0.85 V – 1.3625 V
SLGT7	Q8400S	2.66 GHz	1,333 MHz	4 MB	45 nm	65	76.3	0.85 V – 1.3625 V
SLGT6	Q8400	2.66 GHz	1,333 MHz	4 MB	45 nm	95	71.4	0.85 V – 1.3625 V
SLGUR	Q8300	2.50 GHz	1,333 MHz	4 MB	45 nm	95	71.4	0.85 V – 1.3625 V
SLB5W	Q8300	2.50 GHz	1,333 MHz	4 MB	45 nm	95	71.4	0.85 V – 1.3625 V
SLG9T	Q8200S	2.33 GHz	1,333 MHz	4 MB	45 nm	65	76.3	0.85 V – 1.3625 V
SLG9S	Q8200	2.33 GHz	1,333 MHz	4 MB	45 nm	95	71.4	0.85 V – 1.3625 V
SLB5M	Q8200	2.33 GHz	1,333 MHz	4 MB	45 nm	95	71.4	0.85 V – 1.3625 V
SLACQ	Q6700	2.66 GHz	1,066 MHz	8 MB	65 nm	95	71	0.85 V – 1.5 V
SL9UM	Q6600	2.40 GHz	1,066 MHz	8 MB	65 nm	105	62.2	1.10 V – 1.37 V
SLACR	Q6600	2.40 GHz	1,066 MHz	8 MB	65 nm	95	71	0.85 V – 1.5 V

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

[nextpage title=”Core 2 Extreme Models”]

In the table below we list all Core 2 Extreme models released so far.

sSpec	Model	Internal Clock	External Clock	L2 Cache	Tech.	TDP (W)	Max. Temp. (° C)	Voltage	Cores	Socket
SLANY	QX9775	3.2 GHz	1,600 MHz	12 MB	45 nm	150	63	1.212 V	4	771
SLAWM	QX9770	3.2 GHz	1,600 MHz	12 MB	45 nm	136	55.5	0.85 V – 1.3625 V	4	775
SLAWN	QX9650	3 GHz	1,333 MHz	12 MB	45 nm	130	64.5	0.85 V – 1.3625 V	4	775
SLAN3	QX9650	3 GHz	1,333 MHz	12 MB	45 nm	130	64.5	0.85 V – 1.3625 V	4	775
SLAFN	QX6850	3 GHz	1,333 MHz	8 MB	65 nm	130	64.5	1.10 V – 1.37 V	4	775
SL9UK	QX6800	2.93 GHz	1,066 MHz	8 MB	65 nm	130	64.5	1.10 V – 1.37 V	4	775
SL9S5	X6800	2.93 GHz	1,066 MHz	4 MB	65 nm	75	60.4	0.85 V – 1.35 V	2	775
SLACP	QX6800	2.93 GHz	1,066 MHz	8 MB	65 nm	130	64.5	1.10 V – 1.37 V	4	775
SLA33	X7900	2.80 GHz	800 MHz	4 MB	65 nm	44	100	–	2	775
SLAF4	X7900	2.80 GHz	800 MHz	4 MB	65 nm	44	100	1.125 V – 1.325 V	2	775
SL9UL	QX6700	2.66 GHz	1,066 MHz	8 MB	65 nm	130	65	1.10 V – 1.37 V	4	775
SLA6Z	X7800	2.60 GHz	800 MHz	4 MB	65 nm	44	100	–	2	775

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

[nextpage title=”Core 2 Solo Models”]

In the table below we list all Core 2 Solo (which is a Core 2 Duo with only one processing core, targeted on mobile computers, replacing Pentium M) models released so far.

sSpec	Model	Internal Clock	External Clock	L2 Cache	Tech.	TDP (W)	Max. Temp. (° C)	Voltage (V)
SLGFM	SU3500	1.4 GHz	800 MHz	3 MB	45 nm	5.5	100	1.05 – 1.15
SLGAR	SU3300	1.2 GHz	800 MHz	3 MB	45 nm	5.5	–	1.05 – 1.15
SLAGL	U2200	1.2 GHz	533 MHz	1 MB	65 nm	5.5	100	0.86 – 0.975
SLAGM	U2100	1.06 GHz	533 MHz	1 MB	65 nm	5.5	100	0.86 – 0.975

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

[nextpage title=”Core 2 Duo Mobile Models”]

On mobile models the first letter from the model name shows us the maximum power dissipation from the CPU. "T" stands for TDP between 30W and 39W; "P" models have a 20 W – 29 W TDP. "L" represents models with TDP from 12 W to 19 W, and "U" identifies processors with TDP under 12 W. The "S" letter, by the way, identifies models with a smaller BGA package (22 x 22 mm), aimed to ultra-compact laptops. TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

In the table below we list all Core 2 Duo Mobile models released so far.

sSpec	Model	Internal Clock	External Clock	L2 Cache	Tech.	TDP (W)	Max. Temp. (° C)	Voltage (V)
SLGQS	P9700	2.8 GHz	1,066 MHz	6 MB	45 nm	28	105	1.012 – 1.175
SLGE6	P9600	2.66 GHz	1,066 MHz	6 MB	45 nm	25	105	1.05 – 1.212
SLGE8	P9500	2.53 GHz	1,066 MHz	6 MB	45 nm	25	105	1.05 – 1.212
SLB4E	P9500	2.53 GHz	1,066 MHz	6 MB	45 nm	25	105	1.05 – 1.162
SLGFE	P8700	2.53 GHz	1,066 MHz	3 MB	45 nm	25	105	1.0 – 1.25
SLGA4	P8600	2.4 GHz	1,066 MHz	3 MB	45 nm	25	105	1.0 – 1.25
SLB4N	P8600	2.4 GHz	1,066 MHz	3 MB	45 nm	25	105	1.0 – 1.25
SLGFD	P8600	2.4 GHz	1,066 MHz	3 MB	45 nm	25	105	1.0 – 1.25
SLB3S	P8600	2.4 GHz	1,066 MHz	3 MB	45 nm	25	105	1.0 – 1.25
SLB3Q	P8400	2.26 GHz	1,066 MHz	3 MB	45 nm	25	105	1.0 – 1.25
SLB3R	P8400	2.26 GHz	1,066 MHz	3 MB	45 nm	25	105	1.0 – 1.25
SLB4M	P8400	2.26 GHz	1,066 MHz	3 MB	45 nm	25	105	1.0 – 1.25
SLB54	P7450	2.13 GHz	1,066 MHz	3 MB	45 nm	25	90	1.0 – 1.25
SLG8X	P7370	2.0 GHz	1,066 MHz	3 MB	45 nm	25	90	1.0 – 1.25
SLB53	P7350	2.0 GHz	1,066 MHz	3 MB	45 nm	25	90	1.0 – 1.25
SLGKH	T9900	3.06 GHz	1,066 MHz	6 MB	45 nm	35	105	1.05 – 1.212
SLGEE	T9900	3.06 GHz	1,066 MHz	6 MB	45 nm	35	105	1.05 – 1.212
SLGES	T9800	2.93 GHz	1,066 MHz	6 MB	45 nm	35	105	1.05 – 1.212
SLG9F	T9600	2.8 GHz	1,066 MHz	6 MB	45 nm	35	105	1.05 – 1.212
SLGEM	T9600	2.8 GHz	1,066 MHz	6 MB	45 nm	35	105	1.05 – 1.212
SLB43	T9600	2.8 GHz	1,066 MHz	6 MB	45 nm	35	105	1.05 – 1.162
SLB47	T9600	2.8 GHz	1,066 MHz	6 MB	45 nm	35	105	1.05 – 1.162
SLGE4	T9550	2.66 GHz	1,066 MHz	6 MB	45 nm	35	105	1.05 – 1.212
SLAPW	T9500	2.6 GHz	800 MHz	6 MB	45 nm	35	105	1.0 – 1.25
SLAZA	T9500	2.6 GHz	800 MHz	6 MB	45 nm	35	105	1.0 – 1.25
SLAQH	T9500	2.6 GHz	800 MHz	6 MB	45 nm	35	105	1.062 – 1.15
SLAYX	T9500	2.6 GHz	800 MHz	6 MB	45 nm	35	105	1.05 – 1.137
SLGEK	T9400	2.53 GHz	1,066 MHz	6 MB	45 nm	35	105	1.05 – 1.212
SL3BX	T9400	2.53 GHz	1,066 MHz	6 MB	45 nm	35	105	1.05 – 1.162
SLGE5	T9400	2.53 GHz	1,066 MHz	6 MB	45 nm	35	105	1.05 – 1.212
SLB46	T9400	2.53 GHz	1,066 MHz	6 MB	45 nm	35	105	1.05 – 1.162
SLAPV	T9300	2.5 GHz	800 MHz	6 MB	45 nm	35	105	1.0 – 1.25
SLAQG	T9300	2.5 GHz	800 MHz	6 MB	45 nm	35	105	1.062 – 1.15
SLAZB	T9300	2.5 GHz	800 MHz	6 MB	45 nm	35	105	1.0 – 1.25
SLAYY	T9300	2.5 GHz	800 MHz	6 MB	45 nm	35	105	1.05 – 1.137
SLAPU	T8300	2.4 GHz	800 MHz	3 MB	45 nm	35	105	1.0 – 1.25
SLAYQ	T8300	2.4 GHz	800 MHz	3 MB	45 nm	35	105	1.0 – 1.25
SLAPA	T8300	2.4 GHz	800 MHz	3 MB	45 nm	35	105	1.0 – 1.25
SLAZC	T8300	2.4 GHz	800 MHz	3 MB	45 nm	35	105	1.0 – 1.25
SLAPR	T8300	2.4 GHz	800 MHz	3 MB	45 nm	35	105	1.0 – 1.25
SLAXG	T8100	2.1 GHz	800 MHz	3 MB	45 nm	35	105	1.0 – 1.25
SLAYP	T8100	2.1 GHz	800 MHz	3 MB	45 nm	35	105	1.0 – 1.25
SLAYZ	T8100	2.1 GHz	800 MHz	3 MB	45 nm	35	105	1.05 – 1.137
SLAZD	T8100	2.1 GHz	800 MHz	3 MB	45 nm	35	105	1.0 – 1.25
SLAVJ	T8100	2.1 GHz	800 MHz	3 MB	45 nm	35	105	1.0 – 1.25
SLAPT	T8100	2.1 GHz	800 MHz	3 MB	45 nm	35	105	1.0 – 1.25
SLAPS	T8100	2.1 GHz	800 MHz	3 MB	45 nm	35	105	1.0 – 1.25
SLAP9	T8100	2.1 GHz	800 MHz	3 MB	45 nm	35	105	1.0 – 1.25
SLAUU	T8100	2.1 GHz	800 MHz	3 MB	45 nm	35	105	1.05 – 1.237
SLAF6	T7800	2.6 GHz	800 MHz	4 MB	65 nm	35	100	–
SLA75	T7800	2.6 GHz	800 MHz	4 MB	65 nm	35	100	–
SLADL	T7700	2.4 GHz	800 MHz	4 MB	65 nm	35	100	–
SLAF7	T7700	2.4 GHz	800 MHz	4 MB	65 nm	35	100	–
SLA3M	T7700	2.4 GHz	800 MHz	4 MB	65 nm	35	100	1.0375 – 1.3
SLA43	T7700	2.4 GHz	800 MHz	4 MB	65 nm	35	100	1.0375 – 1.3
SL9SJ	T7600	2.33 GHz	667 MHz	4 MB	65 nm	34	100	1.0375 – 1.3
SL9SD	T7600	2.33 GHz	667 MHz	4 MB	65 nm	34	100	1.0375 – 1.3
SLAF8	T7500	2.2 GHz	800 MHz	4 MB	65 nm	35	100	–
SLADM	T7500	2.2 GHz	800 MHz	4 MB	65 nm	35	100	–
SLA44	T7500	2.2 GHz	800 MHz	4 MB	65 nm	35	100	1.0375 – 1.3
SLA3N	T7500	2.2 GHz	800 MHz	4 MB	65 nm	35	100	1.0375 – 1.3
SL9SK	T7400	2.16 GHz	667 MHz	4 MB	65 nm	34	100	1.0375 – 1.3
SL9SE	T7400	2.16 GHz	667 MHz	4 MB	65 nm	34	100	1.0375 – 1.3
SLA45	T7300	2.0 GHz	800 MHz	4 MB	65 nm	35	100	1.0375 – 1.3
SLA3P	T7300	2.0 GHz	800 MHz	4 MB	65 nm	35	100	1.0375 – 1.3
SLAXH	T7250	2.0 GHz	800 MHz	2 MB	65 nm	35	100	1.075 – 1.175
SLA3T	T7250	2.0 GHz	800 MHz	2 MB	65 nm	35	100	1.075 – 1.175
SLA49	T7250	2.0 GHz	800 MHz	2 MB	65 nm	35	100	1.075 – 1.175
SL9SL	T7200	2.0 GHz	667 MHz	4 MB	65 nm	34	100	1.0375 – 1.3
SL9SF	T7200	2.0 GHz	667 MHz	4 MB	65 nm	34	100	1.0375 – 1.3
SLA4A	T7100	1.8 GHz	800 MHz	2 MB	65 nm	35	100	1.075 – 1.175
SLA3U	T7100	1.80 GHz	800 MHz	2 MB	65 nm	35	100	1.075 – 1.175
SLGF5	T6600	2.2 GHz	800 MHz	2 MB	45 nm	35	90	1.0 – 1.25
SLGLL	T6570	2.1 GHz	800 MHz	2 MB	45 nm	35	100	1.0 – 1.25
SLGF4	T6500	2.1 GHz	800 MHz	2 MB	45 nm	35	105	1.0 – 1.25
SJGJ4	T6400	2.0 GHz	800 MHz	2 MB	45 nm	35	90	1.0 – 1.25
SLB6D	T5900	2.2 GHz	800 MHz	2 MB	65 nm	35	85	1.075 – 1.175
SLAZR	T5870	2.0 GHz	800 MHz	2 MB	65 nm	35	100	1.075 – 1.175
SLA4C	T5850	2.16 GHz	667 MHz	2 MB	65 nm	35	85	1.075 – 1.175
SLB6E	T5800	2.0 GHz	800 MHz	2 MB	65 nm	35	85	1.075 – 1.175
SLA4D	T5750	2.0 GHz	667 MHz	2 MB	65 nm	35	100	1.075 – 1.175
SLAJ5	T5670	1.8 GHz	800 MHz	2 MB	65 nm	35	100	1.075 – 1.175
SL9U7	T5600	1.83 GHz	667 MHz	2 MB	65 nm	34	100	–
SL9SP	T5600	1.83 GHz	667 MHz	2 MB	65 nm	34	100	1.0375 – 1.3
SL9SG	T5600	1.83 GHz	667 MHz	2 MB	65 nm	34	100	1.0375 – 1.3
SL9U3	T5600	1.83 GHz	667 MHz	2 MB	65 nm	34	100	–
SLA4E	T5550	1.83 GHz	667 MHz	2 MB	65 nm	35	100	1.075 – 1.175
SL9SQ	T5500	1.66 GHz	667 MHz	2 MB	65 nm	34	100	1.0375 – 1.3
SL9SH	T5500	1.66 GHz	667 MHz	2 MB	65 nm	34	100	1.0375 – 1.3
SL9U4	T5500	1.66 GHz	667 MHz	2 MB	65 nm	34	100	–
SL9U8	T5500	1.66 GHz	667 MHz	2 MB	65 nm	–	100	–
SLAEB	T5470	1.6 GHz	800 MHz	2 MB	65 nm	35	100	1.075 – 1.175
SLA4F	T5450	1.66 GHz	667 MHz	2 MB	65 nm	35	100	1.075 – 1.175
SL9WE	T5300	1.73 GHz	533 MHz	2 MB	65 nm	34	100	–
SLALK	T5270	1.4 GHz	800 MHz	2 MB	65 nm	35	100	1.075 – 1.175
SLA9S	T5250	1.5 GHz	667 MHz	2 MB	65 nm	35	100	1.075 – 1.175
SL9VP	T5200	1.6 GHz	533 MHz	2 MB	65 nm	34	100	1.075 – 1.250
SLGER	SP9600	2.53 GHz	1,066 MHz	6 MB	45 nm	25	105	1.05 – 1.15
SLB64	SP9400	2.40 GHz	1,066 MHz	6 MB	45 nm	25	–	1.05 – 1.15
SLB63	SP9300	2.26 GHz	1,066 MHz	6 MB	45 nm	25	–	1.05 – 1.15
SLGEQ	SL9600	2.13 GHz	1,066 MHz	6 MB	45 nm	17	105	1.05 – 1.15
SLB66	SL9400	1.86 GHz	1,066 MHz	6 MB	45 nm	17	–	1.05 – 1.15
SLB65	SL9300	1.6 GHz	1,066 MHz	6 MB	45 nm	17	–	1.05 – 1.15
SLGFN	SU9600	1.60 GHz	800 MHz	3 MB	45 nm	10	105	1.05 – 1.15
SLGHN	SU9400	1.40 GHz	800 MHz	3 MB	45 nm	10	–	1.05 – 1.15
SLB5Q	SU9300	1.20 GHz	800 MHz	3 MB	45 nm	10	–	1.05 – 1.15
SLA3R	L7500	1.6 GHz	800 MHz	4 MB	65 nm	17	100	0.975 – 1.062
SL9SM	L7400	1.5 GHz	667 MHz	4 MB	65 nm	17	100	0.975 – 1.062
SLGFX	L7400	1.5 GHz	667 MHz	4 MB	65 nm	17	100	0.975 – 1.062
SLA3S	L7300	1.4 GHz	800 MHz	4 MB	65 nm	17	100	0.975 – 1.062
SL9SN	L7200	1.33 GHz	667 MHz	4 MB	65 nm	17	100	0.975 – 1.062
SLV3W	U7600	1.33 GHz	533 MHz	2 MB	65 nm	10	100	0.8 – 0.975
SLA2U	U7600	1.2 GHz	533 MHz	2 MB	65 nm	10	100	0.8 – 0.975
SLV3X	U7500	1.2 GHz	533 MHz	2 MB	65 nm	10	100	0.8 – 0.975
SLA2V	U7500	1.06 GHz	533 MHz	2 MB	65 nm	10	100	0.8 – 0.975

[nextpage title=”Core 2 Quad Mobile Models”]

In the table below we list all Core 2 Quad Mobile models released so far.

sSpec	Model	Internal Clock	External Clock	L2 Cache	Tech.	TDP (W)	Max. Temp. (° C)	Voltage (V)
SLB5G	Q9100	2.26 GHz	1066 MHz	12 MB	45 nm	45	–	1.05 – 1.175
SLGEJ	Q9000	2.0 GHz	1066 MHz	6 MB	45 nm	45	100	1.05 – 1.175

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

 

[nextpage title=”Core 2 Extreme Mobile Models”]

In the table below we list all Core 2 Extreme Mobile models released so far.

sSpec	Model	Internal Clock	External Clock	L2 Cache	Cores	Tech.	TDP (W)	Max. Temp. (° C)	Voltage (V)
SLB5J	QX9300	2.53 GHz	1,066 MHz	12 MB	4	45 nm	45	–	1.05 – 1.175
SLB48	X9100	3.06 GHz	1,066 MHz	6 MB	2	45 nm	45	105	1.05 – 1.162
SLAZ3	X9000	2.8 GHz	800 MHz	6 MB	2	45 nm	44	105	1.062 – 1.15
SLAQJ	X9000	2.8 GHz	800 MHz	6 MB	2	45 nm	44	105	1.062 – 1.15
SLA33	X7900	2.8 GHz	800 MHz	4 MB	2	65 nm	44	100	–
SLAF4	X7900	2.8 GHz	800 MHz	4 MB	2	65 nm	44	100	1.125 – 1.325
SLA6Z	X7800	2.6 GHz	800 MHz	4 MB	2	65 nm	44	100	–

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.