We are a participant in the Amazon Services LLC Associates Program, an affiliate advertising program designed to provide a means for us to earn fees by linking to Amazon.com and affiliated sites.

[nextpage title=”Introduction”]

Core 2 Solo, Core 2 Duo, Core 2 Quad and Core 2 Extreme processors are based on the new Core microarchitecture, released to replace Netburst microarchitecture, used on Pentium 4 and CPU’s based on it. In this tutorial we will list all models from these processors released so far together with their main technical specs.

Core 2 family comes in four flavors: Core 2 Solo, a single-core mobile CPU that replaces Pentium M; Core 2 Duo, a dual-core CPU that replaces Pentium 4 and Pentium D; Core 2 Quad, which is a quad-core Core 2 Duo; and Core 2 Extreme, which replaces Pentium Extreme Edition and has models with two and four cores. Core 2 Extreme runs at higher clock rates and has its clock multiplier unlocked, which allows you to overclock the CPU by changing the CPU clock multiplier.Pay attention to not confuse Core 2 Duo with Core Duo. Core Duo is the commercial name for a Pentium M manufactured using 65 nm process, codenamed Yonah, while Core 2 Duo is the commercial name for the CPU codenamed Merom (for laptops) or Conroe (for desktops), which uses the new Intel Core microarchitecture. For an in-depth discussion on this new microarchitecture, read our Inside Intel Core Microarchitecture and Penryn Core New Features tutorials.

Here is a summary of the main Core 2 family features:

  • Core microarchitecture.
  • 32 KB instruction L1 memory cache and 32 KB data L1 memory cache for each core.
  • Single-core techonology (on Core 2 Solo models), dual-core technology (on Core 2 Duo and some Core 2 Extreme models) or quad-core technology (on Core 2 Quad and some Core 2 Extreme models).
  • 65 nm or 45 nm manufacturing process.
  • Socket LGA775 on desktop models (except Core 2 Extreme QX9775, which uses socket 771)
  • 800 MHz (200 MHz transferring four data per clock cycle), 1,066 MHz (266 MHz transferring four data per clock cycle), 1333 MHz (333 MHz transferring four data per clock cycle) or 1600 MHz (400 MHz transferring four data per clock cycle) external clock rates.
  • 2 MB, 3 MB, 4 MB or 6 MB unified L2 memory cache (on processors with four cores L2 cache is divided in two, and each half is shared by each pair of cores).
  • Intel Virtualization Technology. (Except on Core 2 Duo E4x00, E7x00 and E81xx models)
  • Intel EM64T Technology
  • SSE3 instruction set
  • SSE4.1 instruction set on 45 nm models
  • Execute Disable Bit
  • Intelligent Power Capability
  • Enhanced SpeedStep Technology

Now let’s talk about Core 2 Solo, Core 2 Duo, Core 2 Quad and Core 2 Extreme desktop and mobile models launched so far.

[nextpage title=”Core 2 Duo Models”]

In the table below we list all Core 2 Duo models released so far.

sSpec

Model

Internal Clock

External Clock

L2 Cache

Tech.

TDP (W)

Max. Temp. (° C)

Voltage

SLB9L E8600 3.33 GHz 1,333 MHz 6 MB 45 nm 65 72.4 0.85V – 1.3625V
SLB9K E8500 3.16 GHz 1,333 MHz 6 MB 45 nm 65 74.1 0.85 V – 1.3625 V
SLAPK E8500 3.16 GHz 1,333 MHz 6 MB 45 nm 65 72.4 0.85 V – 1.3625 V
SLB9J E8400 3.00 GHz 1,333 MHz 6 MB 45 nm 65 74.1 0.85 V – 1.3625 V
SLAPL E8400 3.00 GHz 1,333 MHz 6 MB 45 nm 65 72.4 0.85 V – 1.3625 V
SLAPJ E8300 2.83 GHz 1,333 MHz 6 MB 45 nm 65 72.4 0.85 V – 1.3625 V
SLAQR E8190 2.66 GHz 1,333 MHz 6 MB 45 nm 65 72.4 0.85 V – 1.3625 V
SLAPP E8200 2.66 GHz 1,333 MHz 6 MB 45 nm 65 72.4 0.85 V – 1.3625 V
SLGTD E7600 3.06 GHz 1,066 MHz 3 MB 45 nm 65 74.1 0.85 V – 1.3625 V
SLB9Z E7500 2.93 GHz 1,066 MHz 3 MB 45 nm 65 74.1 0.85 V – 1.3625 V
SLB9Y E7400 2.80 GHz 1,066 MHz 3 MB 45 nm 65 74.1 0.85 V – 1.3625 V
SLB9X E7300 2.66 GHz 1,066 MHz 3 MB 45 nm 65 74.1 0.85 V – 1.3625 V
SLAPB E7300 2.66 GHz 1,066 MHz 3 MB 45 nm 65 74.1 0.85 V – 1.3625V
SLAPC E7200 2.53 GHz 1,066 MHz 3 MB 45 nm 65 74.1 0.85 V – 1.3625 V
SLAVN E7200 2.53 GHz 1,066 MHz 3 MB 45 nm 65 74.1 0.85 V – 1.3625 V

SLA9U

E6850

3.00 GHz

1,333 MHz

4 MB

65 nm

65

72

0.962 V – 1.35 V

SLA9V

E6750

2.66 GHz

1,333 MHz

4 MB

65 nm

65

72

0.962 V – 1.35 V

SL9ZF

E6700

2.66 GHz

1,066 MHz

4 MB

65 nm

65

60.1

0.85 V – 1.5 V

SL9S7

E6700

2,66 GHz

1,066 MHz

4 MB

65 nm

65

60.1

0.85 V – 1.35 V

SL9ZL

E6600

2.40 GHz

1,066 MHz

4 MB

65 nm

65

60.1

1.18 V – 1.32 V

SL9S8

E6600

2.40 GHz

1,066 MHz

4 MB

65 nm

65

60.1

0.85 V – 1.35 V

SLA9X

E6550

2.33 GHz

1,333 MHz

4 MB

65 nm

65

72

0.962 V – 1.35 V

SLAA5

E6540

2.33 GHz

1,333 MHz

4 MB

65 nm

65

72

0.962 V – 1.35 V

SLA4T

E6420

2.13 GHz

1,066 MHz

4 MB

65 nm

65

60.1

0.85 V – 1.5 V

SL9T9

E6400

2.13 GHz

1,066 MHz

2 MB

65 nm

65

61.4

1.22 V – 1.32 V

SL9S9

E6400

2.13 GHz

1,066 MHz

2 MB

65 nm

65

61.4

0.85 V – 1.35 V

SLA4U

E6320

1.86 GHz

1,066 MHz

4 MB

65 nm

65

60.1

0.85 V – 1.5 V

SL9TA

E6300

1.86 GHz

1,066 MHz

2 MB

65 nm

65

61.4

1.22 V – 1.32 V

SL9SA

E6300

1.86 GHz

1,066 MHz

2 MB

65 nm

65

61.4

0.85 V – 1.35 V

SLALT E4700 2.6 GHz 800 MHz 2 MB 65 nm 65 73.3 1.162 V – 1.312 V
SLA94 E4600 2.4 GHz 800 MHz 2 MB 65 nm 65 73.3 1.162 V – 1.312 V

SLA95

E4500

2.2 GHz

800 MHz

2 MB

65 nm

65

73.3

0.962 V – 1.35 V

SL93F

E4400

2.0 GHz

800 MHz

2 MB

65 nm

65

61.4

1.16 V – 1.31 V

SLA98

E4400

2.0 GHz

800 MHz

2 MB

65 nm

65

73.3

1.16 V – 1.31 V

SL9TB

E4300

1.8 GHz

800 MHz

2 MB

65 nm

65

61.4

0.85 V – 1.35 V

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

[nextpage title=”Core 2 Quad Models”]

In the table below we list all Core 2 Quad models released so far.

sSpec

Model

Internal Clock

External Clock

L2 Cache

Tech.

TDP (W)

Max. Temp. (° C)

Voltage

SLB8W Q9650 3.00 GHz 1,333 MHz 12 MB 45 nm 95 71.4 0.85 V – 1.3625 V
SLGAE Q9550S 2.83 GHz 1,333 MHz 12 MB 45 nm 65 76.3 0.85 V – 1.3625 V
SLB8V Q9550 2.83 GHz 1,333 MHz 12 MB 45 nm 95 71.4 0.85 V – 1.3625 V
SLAWQ Q9550 2.83 GHz 1,333 MHz 12 MB 45 nm 95 71.4 0.85 V – 1.3625 V
SLGYZ Q9505S 2.83 GHz 1,333 MHz 6 MB 45 nm 65 76.3 0.85 V – 1.3625 V
SLGYY Q9505 2.83 GHz 1,333 MHz 6 MB 45 nm 95 71.4 0.85 V – 1.3625 V
SLAWR Q9450 2.66 GHz 1,333 MHz 12 MB 45 nm 95 71.4 0.85 V – 1.3625 V
SLG9U Q9400S 2.66 GHz 1,333 MHz 6 MB 45 nm 65 76.3 0.85 V – 1.3625 V
SLB6B Q9400 2.66 GHz 1,333 MHz 6 MB 45 nm 95 71.4 0.85 V – 1.3625 V
SLAWE Q9300 2.50 GHz 1,333 MHz 6 MB 45 nm 95 71.4 0.85 V – 1.3625 V
SLGT7 Q8400S 2.66 GHz 1,333 MHz 4 MB 45 nm 65 76.3 0.85 V – 1.3625 V
SLGT6 Q8400 2.66 GHz 1,333 MHz 4 MB 45 nm 95 71.4 0.85 V – 1.3625 V
SLGUR Q8300 2.50 GHz 1,333 MHz 4 MB 45 nm 95 71.4 0.85 V – 1.3625 V
SLB5W Q8300 2.50 GHz 1,333 MHz 4 MB 45 nm 95 71.4 0.85 V – 1.3625 V
SLG9T Q8200S 2.33 GHz 1,333 MHz 4 MB 45 nm 65 76.3 0.85 V – 1.3625 V
SLG9S Q8200 2.33 GHz 1,333 MHz 4 MB 45 nm 95 71.4 0.85 V – 1.3625 V
SLB5M Q8200 2.33 GHz 1,333 MHz 4 MB 45 nm 95 71.4 0.85 V – 1.3625 V
SLACQ Q6700 2.66 GHz 1,066 MHz 8 MB 65 nm 95 71 0.85 V – 1.5 V

SL9UM

Q6600

2.40 GHz

1,066 MHz

8 MB

65 nm

105

62.2

1.10 V – 1.37 V

SLACR

Q6600

2.40 GHz

1,066 MHz

8 MB

65 nm

95

71

0.85 V – 1.5 V

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

[nextpage title=”Core 2 Extreme Models”]

In the table below we list all Core 2 Extreme models released so far.

sSpec

Model

Internal Clock

External Clock

L2 Cache

Tech.

TDP (W)

Max. Temp. (° C)

Voltage

Cores

Socket

SLANY

QX9775

3.2 GHz

1,600 MHz

12 MB

45 nm

150

63

1.212 V

4

771

SLAWM

QX9770

3.2 GHz

1,600 MHz

12 MB

45 nm

136

55.5

0.85 V – 1.3625 V

4

775

SLAWN QX9650 3 GHz 1,333 MHz 12 MB 45 nm 130 64.5 0.85 V – 1.3625 V 4 775

SLAN3

QX9650

3 GHz

1,333 MHz

12 MB

45 nm

130

64.5

0.85 V – 1.3625 V

4

775

SLAFN

QX6850

3 GHz

1,333 MHz

8 MB

65 nm

130

64.5

1.10 V – 1.37 V

4

775

SL9UK

QX6800

2.93 GHz

1,066 MHz

8 MB

65 nm

130

64.5

1.10 V – 1.37 V

4

775

SL9S5

X6800

2.93 GHz

1,066 MHz

4 MB

65 nm

75

60.4

0.85 V – 1.35 V

2

775

SLACP

QX6800

2.93 GHz

1,066 MHz

8 MB

65 nm

130

64.5

1.10 V – 1.37 V

4

775

SLA33

X7900

2.80 GHz

800 MHz

4 MB

65 nm

44

100

2

775

SLAF4

X7900

2.80 GHz

800 MHz

4 MB

65 nm

44

100

1.125 V – 1.325 V

2

775

SL9UL

QX6700

2.66 GHz

1,066 MHz

8 MB

65 nm

130

65

1.10 V – 1.37 V

4

775

SLA6Z

X7800

2.60 GHz

800 MHz

4 MB

65 nm

44

100

2

775

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

[nextpage title=”Core 2 Solo Models”]

In the table below we list all Core 2 Solo (which is a Core 2 Duo with only one processing core, targeted on mobile computers, replacing Pentium M) models released so far.

sSpec Model Internal Clock External Clock L2 Cache Tech. TDP (W) Max. Temp. (° C) Voltage (V)
SLGFM SU3500 1.4 GHz 800 MHz 3 MB 45 nm 5.5 100 1.05 – 1.15
SLGAR SU3300 1.2 GHz 800 MHz 3 MB 45 nm 5.5 1.05 – 1.15
SLAGL U2200 1.2 GHz 533 MHz 1 MB 65 nm 5.5 100 0.86 – 0.975
SLAGM U2100 1.06 GHz 533 MHz 1 MB 65 nm 5.5 100 0.86 – 0.975

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

[nextpage title=”Core 2 Duo Mobile Models”]

On mobile models the first letter from the model name shows us the maximum power dissipation from the CPU. "T" stands for TDP between 30W and 39W; "P" models have a 20 W – 29 W TDP. "L" represents models with TDP from 12 W to 19 W, and "U" identifies processors with TDP under 12 W. The "S" letter, by the way, identifies models with a smaller BGA package (22 x 22 mm), aimed to ultra-compact laptops. TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

In the table below we list all Core 2 Duo Mobile models released so far.

sSpec Model Internal Clock External Clock L2 Cache Tech. TDP (W) Max. Temp. (° C) Voltage (V)
SLGQS P9700 2.8 GHz 1,066 MHz 6 MB 45 nm 28 105 1.012 – 1.175
SLGE6 P9600 2.66 GHz 1,066 MHz 6 MB 45 nm 25 105 1.05 – 1.212
SLGE8 P9500 2.53 GHz 1,066 MHz 6 MB 45 nm 25 105 1.05 – 1.212
SLB4E P9500 2.53 GHz 1,066 MHz 6 MB 45 nm 25 105 1.05 – 1.162
SLGFE P8700 2.53 GHz 1,066 MHz 3 MB 45 nm 25 105 1.0 – 1.25
SLGA4 P8600 2.4 GHz 1,066 MHz 3 MB 45 nm 25 105 1.0 – 1.25
SLB4N P8600 2.4 GHz 1,066 MHz 3 MB 45 nm 25 105 1.0 – 1.25
SLGFD P8600 2.4 GHz 1,066 MHz 3 MB 45 nm 25 105 1.0 – 1.25
SLB3S P8600 2.4 GHz 1,066 MHz 3 MB 45 nm 25 105 1.0 – 1.25
SLB3Q P8400 2.26 GHz 1,066 MHz 3 MB 45 nm 25 105 1.0 – 1.25
SLB3R P8400 2.26 GHz 1,066 MHz 3 MB 45 nm 25 105 1.0 – 1.25
SLB4M P8400 2.26 GHz 1,066 MHz 3 MB 45 nm 25 105 1.0 – 1.25
SLB54 P7450 2.13 GHz 1,066 MHz 3 MB 45 nm 25 90 1.0 – 1.25
SLG8X P7370 2.0 GHz 1,066 MHz 3 MB 45 nm 25 90 1.0 – 1.25
SLB53 P7350 2.0 GHz 1,066 MHz 3 MB 45 nm 25 90 1.0 – 1.25
SLGKH T9900 3.06 GHz 1,066 MHz 6 MB 45 nm 35 105 1.05 – 1.212
SLGEE T9900 3.06 GHz 1,066 MHz 6 MB 45 nm 35 105 1.05 – 1.212

SLGES

T9800

2.93 GHz

1,066 MHz

6 MB

45 nm

35

105

1.05 – 1.212

SLG9F T9600 2.8 GHz 1,066 MHz 6 MB 45 nm 35 105 1.05 – 1.212
SLGEM T9600 2.8 GHz 1,066 MHz 6 MB 45 nm 35 105 1.05 – 1.212
SLB43 T9600 2.8 GHz 1,066 MHz 6 MB 45 nm 35 105 1.05 – 1.162
SLB47 T9600 2.8 GHz 1,066 MHz 6 MB 45 nm 35 105 1.05 – 1.162
SLGE4 T9550 2.66 GHz 1,066 MHz 6 MB 45 nm 35 105 1.05 – 1.212
SLAPW T9500 2.6 GHz 800 MHz 6 MB 45 nm 35 105 1.0 – 1.25
SLAZA T9500 2.6 GHz 800 MHz 6 MB 45 nm 35 105 1.0 – 1.25
SLAQH T9500 2.6 GHz 800 MHz 6 MB 45 nm 35 105 1.062 – 1.15
SLAYX T9500 2.6 GHz 800 MHz 6 MB 45 nm 35 105 1.05 – 1.137
SLGEK T9400 2.53 GHz 1,066 MHz 6 MB 45 nm 35 105 1.05 – 1.212
SL3BX T9400 2.53 GHz 1,066 MHz 6 MB 45 nm 35 105 1.05 – 1.162
SLGE5 T9400 2.53 GHz 1,066 MHz 6 MB 45 nm 35 105 1.05 – 1.212
SLB46 T9400 2.53 GHz 1,066 MHz 6 MB 45 nm 35 105 1.05 – 1.162
SLAPV T9300 2.5 GHz 800 MHz 6 MB 45 nm 35 105 1.0 – 1.25
SLAQG T9300 2.5 GHz 800 MHz 6 MB 45 nm 35 105 1.062 – 1.15
SLAZB T9300 2.5 GHz 800 MHz 6 MB 45 nm 35 105 1.0 – 1.25
SLAYY T9300 2.5 GHz 800 MHz 6 MB 45 nm 35 105 1.05 – 1.137
SLAPU T8300 2.4 GHz 800 MHz 3 MB 45 nm 35 105 1.0 – 1.25
SLAYQ T8300 2.4 GHz 800 MHz 3 MB 45 nm 35 105 1.0 – 1.25
SLAPA T8300 2.4 GHz 800 MHz 3 MB 45 nm 35 105 1.0 – 1.25
SLAZC T8300 2.4 GHz 800 MHz 3 MB 45 nm 35 105 1.0 – 1.25
SLAPR T8300 2.4 GHz 800 MHz 3 MB 45 nm 35 105 1.0 – 1.25
SLAXG T8100 2.1 GHz 800 MHz 3 MB 45 nm 35 105 1.0 – 1.25
SLAYP T8100 2.1 GHz 800 MHz 3 MB 45 nm 35 105 1.0 – 1.25
SLAYZ T8100 2.1 GHz 800 MHz 3 MB 45 nm 35 105 1.05 – 1.137
SLAZD T8100 2.1 GHz 800 MHz 3 MB 45 nm 35 105 1.0 – 1.25
SLAVJ T8100 2.1 GHz 800 MHz 3 MB 45 nm 35 105 1.0 – 1.25
SLAPT T8100

2.1 GHz 800 MHz 3 MB 45 nm 35 105 1.0 – 1.25
SLAPS T8100 2.1 GHz 800 MHz 3 MB 45 nm 35 105 1.0 – 1.25
SLAP9 T8100 2.1 GHz 800 MHz 3 MB 45 nm 35 105 1.0 – 1.25
SLAUU T8100 2.1 GHz 800 MHz 3 MB 45 nm 35 105 1.05 – 1.237
SLAF6 T7800 2.6 GHz 800 MHz 4 MB 65 nm 35 100
SLA75 T7800 2.6 GHz 800 MHz 4 MB 65 nm 35 100
SLADL T7700 2.4 GHz 800 MHz 4 MB 65 nm 35 100
SLAF7 T7700 2.4 GHz 800 MHz 4 MB 65 nm 35 100
SLA3M T7700 2.4 GHz 800 MHz 4 MB 65 nm 35 100 1.0375 – 1.3
SLA43 T7700 2.4 GHz 800 MHz 4 MB 65 nm 35 100 1.0375 – 1.3
SL9SJ T7600 2.33 GHz 667 MHz 4 MB 65 nm 34 100 1.0375 – 1.3
SL9SD T7600 2.33 GHz 667 MHz 4 MB 65 nm 34 100 1.0375 – 1.3
SLAF8 T7500 2.2 GHz 800 MHz 4 MB 65 nm 35 100
SLADM T7500 2.2 GHz 800 MHz 4 MB 65 nm 35 100
SLA44 T7500 2.2 GHz 800 MHz 4 MB 65 nm 35 100 1.0375 – 1.3
SLA3N T7500 2.2 GHz 800 MHz 4 MB 65 nm 35 100 1.0375 – 1.3
SL9SK T7400 2.16 GHz 667 MHz 4 MB 65 nm 34 100 1.0375 – 1.3
SL9SE T7400 2.16 GHz 667 MHz 4 MB 65 nm 34 100 1.0375 – 1.3
SLA45 T7300 2.0 GHz 800 MHz 4 MB 65 nm 35 100 1.0375 – 1.3
SLA3P T7300 2.0 GHz 800 MHz 4 MB 65 nm 35 100 1.0375 – 1.3
SLAXH T7250 2.0 GHz 800 MHz 2 MB 65 nm 35 100 1.075 – 1.175
SLA3T T7250 2.0 GHz 800 MHz 2 MB 65 nm 35 100 1.075 – 1.175
SLA49 T7250 2.0 GHz 800 MHz 2 MB 65 nm 35 100 1.075 – 1.175
SL9SL T7200 2.0 GHz 667 MHz 4 MB 65 nm 34 100 1.0375 – 1.3
SL9SF T7200 2.0 GHz 667 MHz 4 MB 65 nm 34 100 1.0375 – 1.3
SLA4A T7100 1.8 GHz 800 MHz 2 MB 65 nm 35 100 1.075 – 1.175
SLA3U T7100 1.80 GHz 800 MHz 2 MB 65 nm 35 100 1.075 – 1.175
SLGF5 T6600 2.2 GHz 800 MHz 2 MB 45 nm 35 90 1.0 – 1.25

SLGLL

T6570

2.1 GHz

800 MHz

2 MB

45 nm

35

100

1.0 – 1.25

SLGF4 T6500 2.1 GHz 800 MHz 2 MB 45 nm 35 105 1.0 – 1.25
SJGJ4 T6400 2.0 GHz 800 MHz 2 MB 45 nm 35 90 1.0 – 1.25
SLB6D T5900 2.2 GHz 800 MHz 2 MB 65 nm 35 85 1.075 – 1.175
SLAZR T5870 2.0 GHz 800 MHz 2 MB 65 nm 35 100 1.075 – 1.175
SLA4C T5850 2.16 GHz 667 MHz 2 MB 65 nm 35 85 1.075 – 1.175
SLB6E T5800 2.0 GHz 800 MHz 2 MB 65 nm 35 85 1.075 – 1.175
SLA4D T5750 2.0 GHz 667 MHz 2 MB 65 nm 35 100 1.075 – 1.175
SLAJ5 T5670 1.8 GHz 800 MHz 2 MB 65 nm 35 100 1.075 – 1.175
SL9U7 T5600 1.83 GHz 667 MHz 2 MB 65 nm 34 100
SL9SP T5600 1.83 GHz 667 MHz 2 MB 65 nm 34 100 1.0375 – 1.3
SL9SG T5600 1.83 GHz 667 MHz 2 MB 65 nm 34 100 1.0375 – 1.3
SL9U3 T5600 1.83 GHz 667 MHz 2 MB 65 nm 34 100
SLA4E T5550 1.83 GHz 667 MHz 2 MB 65 nm 35 100 1.075 – 1.175
SL9SQ T5500 1.66 GHz 667 MHz 2 MB 65 nm 34 100 1.0375 – 1.3
SL9SH T5500 1.66 GHz 667 MHz 2 MB 65 nm 34 100 1.0375 – 1.3
SL9U4 T5500 1.66 GHz 667 MHz 2 MB 65 nm 34 100
SL9U8 T5500 1.66 GHz 667 MHz 2 MB 65 nm 100
SLAEB T5470 1.6 GHz 800 MHz 2 MB 65 nm 35 100 1.075 – 1.175
SLA4F T5450 1.66 GHz 667 MHz 2 MB 65 nm 35 100 1.075 – 1.175
SL9WE T5300 1.73 GHz 533 MHz 2 MB 65 nm 34 100
SLALK T5270 1.4 GHz 800 MHz 2 MB 65 nm 35 100 1.075 – 1.175
SLA9S T5250 1.5 GHz 667 MHz 2 MB 65 nm 35 100 1.075 – 1.175
SL9VP T5200 1.6 GHz 533 MHz 2 MB 65 nm 34 100 1.075
– 1.250
SLGER SP9600 2.53 GHz 1,066 MHz 6 MB 45 nm 25 105 1.05 – 1.15
SLB64 SP9400 2.40 GHz 1,066 MHz 6 MB 45 nm 25 1.05 – 1.15
SLB63 SP9300 2.26 GHz 1,066 MHz 6 MB 45 nm 25 1.05 – 1.15
SLGEQ SL9600 2.13 GHz 1,066 MHz 6 MB 45 nm 17 105 1.05 – 1.15
SLB66 SL9400 1.86 GHz 1,066 MHz 6 MB 45 nm 17 1.05 – 1.15
SLB65 SL9300 1.6 GHz 1,066 MHz 6 MB 45 nm 17 1.05 – 1.15
SLGFN SU9600 1.60 GHz 800 MHz 3 MB 45 nm 10 105 1.05 – 1.15
SLGHN SU9400 1.40 GHz 800 MHz 3 MB 45 nm 10 1.05 – 1.15
SLB5Q SU9300 1.20 GHz 800 MHz 3 MB 45 nm 10 1.05 – 1.15
SLA3R L7500 1.6 GHz 800 MHz 4 MB 65 nm 17 100 0.975 – 1.062
SL9SM L7400 1.5 GHz 667 MHz 4 MB 65 nm 17 100 0.975 – 1.062
SLGFX L7400 1.5 GHz 667 MHz 4 MB 65 nm 17 100 0.975 – 1.062
SLA3S L7300 1.4 GHz 800 MHz 4 MB 65 nm 17 100 0.975 – 1.062
SL9SN L7200 1.33 GHz 667 MHz 4 MB 65 nm 17 100 0.975 – 1.062
SLV3W U7600 1.33 GHz 533 MHz 2 MB 65 nm 10 100 0.8 – 0.975
SLA2U U7600 1.2 GHz 533 MHz 2 MB 65 nm 10 100 0.8 – 0.975
SLV3X U7500 1.2 GHz 533 MHz 2 MB 65 nm 10 100 0.8 – 0.975
SLA2V U7500 1.06 GHz 533 MHz 2 MB 65 nm 10 100 0.8 – 0.975

[nextpage title=”Core 2 Quad Mobile Models”]

In the table below we list all Core 2 Quad Mobile models released so far.

sSpec Model Internal Clock External Clock L2 Cache Tech. TDP (W) Max. Temp. (° C) Voltage (V)
SLB5G Q9100 2.26 GHz 1066 MHz 12 MB 45 nm 45 1.05 – 1.175
SLGEJ Q9000 2.0 GHz 1066 MHz 6 MB 45 nm 45 100 1.05 – 1.175

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

 

[nextpage title=”Core 2 Extreme Mobile Models”]

In the table below we list all Core 2 Extreme Mobile models released so far.

sSpec Model Internal Clock External Clock L2 Cache Cores Tech. TDP (W) Max. Temp. (° C) Voltage (V)
SLB5J QX9300 2.53 GHz 1,066 MHz 12 MB 4 45 nm 45 1.05 – 1.175
SLB48 X9100 3.06 GHz 1,066 MHz 6 MB 2 45 nm 45 105 1.05 – 1.162
SLAZ3 X9000 2.8 GHz 800 MHz 6 MB 2 45 nm 44 105 1.062 – 1.15
SLAQJ X9000 2.8 GHz 800 MHz 6 MB 2 45 nm 44 105 1.062 – 1.15
SLA33 X7900 2.8 GHz 800 MHz 4 MB 2 65 nm 44 100
SLAF4 X7900 2.8 GHz 800 MHz 4 MB 2 65 nm 44 100 1.125 – 1.325
SLA6Z X7800 2.6 GHz 800 MHz 4 MB 2 65 nm 44 100

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.