All Core i3 Models
Core i3-23xx Models (Mobile)
Contents
The second-generation Core i3 processors targeted to laptops, which use the Sandy Bridge microarchitecture, can use two different pinouts, BGA1023 or socket G2, and have an integrated dual-channel DDR3 memory controller supporting 1,066 MHz, 1,333 MHz, and 1,600 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). They also have an integrated DirectX 10.1 video controller running at 350 MHz with 1 GHz “boost” clock on models with a TDP of 17 W, or 650 MHz with 1.15 GHz “boost” clock on models with a TDP of 35 W, all with 12 processing cores (HD 3000 graphics engine). These processors support two video monitors.
As mentioned previously, all Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.
| sSpec | Model | Clock | Cores | HT | Video | Video Clock | Video Boost | Tech. | L3 Cache | TDP (W) | Max. Temp. (°C)* |
Package |
| NA | 2377M | 1.5 GHz | 2 | Yes | HD 3000 | 350 MHz | 1 GHz | 32 nm | 3 MiB | 17 | 100 | BGA1023 |
| SR0DP | 2370M | 2.4 GHz | 2 | Yes | HD 3000 | 650 MHz | 1.15 GHz | 32 nm | 3 MiB | 35 | 85 | G2 |
| SR0CV | 2367M | 1.4 GHz | 2 | Yes | HD 3000 | 350 MHz | 1 GHz | 32 nm | 3 MiB | 17 | 100 | BGA1023 |
| NA | 2357M | 1.3 GHz | 2 | Yes | HD 3000 | 350 MHz | 1 GHz | 32 nm | 3 MiB | 17 | 100 |
BGA1023 |
| SR0DN | 2350M | 2.3 GHz | 2 | Yes | HD 3000 | 650 MHz | 1.15 GHz | 32 nm | 3 MiB | 35 | 85 | G2 |
| SR04L | 2330M | 2.2 GHz | 2 | Yes | HD 3000 | 650 MHz | 1.15 GHz | 32 nm | 3 MiB | 35 | 100 |
BGA1023 |
| SR04J | 2330M | 2.2 GHz | 2 | Yes | HD 3000 | 650 MHz | 1.15 GHz | 32 nm | 3 MiB | 35 | 85 |
G2 |
| SR02V | 2330E | 2.2 GHz | 2 | Yes | HD 3000 | 650 MHz | 1.15 GHz | 32 nm | 3 MiB | 35 | 100 |
G2 |
| NA | 2328M | 2.2 GHz | 2 | Yes | HD 3000 | 650 MHz | 1.15 GHz | 32 nm | 3 MiB | 35 | 100 | BGA1023 |
| NA | 2328M | 2.2 GHz | 2 | Yes | HD 3000 | 650 MHz | 1.15 GHz | 32 nm | 3 MiB | 35 | 85 | G2 |
| SR09S | 2312M | 2.1 GHz | 2 | Yes | HD 3000 | 650 MHz | 1.15 GHz | 32 nm | 3 MiB | 35 | 85 | G2 |
| SR04S | 2310M | 2.1 GHz | 2 | Yes | HD 3000 | 650 MHz | 1.15 GHz | 32 nm | 3 MiB | 35 | 85 |
G2 |
| SR04R | 2310M | 2.1 GHz | 2 | Yes | HD 3000 | 650 MHz | 1.15 GHz | 32 nm | 3 MiB | 35 | 100 |
BGA1023 |
| SR077 | 2310E | 2.1 GHz | 2 | Yes | HD 3000 | 650 MHz | 1.15 GHz | 32 nm | 3 MiB | 35 | 100 |
BGA1023 |
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.