[nextpage title=”Introduction”]

The Core i3 is a CPU series manufactured by Intel aimed at entry-level computers. In this tutorial, we will present a series of quick reference tables for you to compare the main differences between all models released to date.

By the way, the correct name of this line of processors is “Core i3,” not “Intel i3.”

Currently, there are three different generations of Core i3 processors available. In the table below, we describe the main differences between these generations.

Model 5xx 3xx 21xx 23xx
Market Desktop Mobile Desktop Mobile
Generation First First Second Second
Microarchitecture Nehalem Nehalem Sandy Bridge Sandy Bridge
Manufacturing Process 32 nm 32 nm 32 nm 32 nm
Number of Cores 2 2 2 2
Hyper-Threading Yes Yes Yes Yes
L1 cache (per core) 32 kiB+32 kiB 32 kiB+32kiB 32 kiB+32 kiB 32 kiB+32kiB
L2 cache (per core) 256 kiB 256 kiB 256 kiB 256 kiB
L3 cache (total) 4 MiB 3 MiB 3 MiB 3 MiB
DMI bus 1 GB/s 1 GB/s 2 GB/s 2 GB/s
Memory (DDR3) 1066, 1333 800, 1066 1066, 1333 1066, 1333, 1600
DDR3L and DDR3L-RS No No No No
Graphics Engine HD Graphics HD Graphics HD 2000 or HD 3000 HD 3000
DirectX 10 10 10.1 10.1
Graphics Processors 6 6 6 or 12 12
Graphics Base Clock 733 MHz 166 MHz or 500 MHz 650 MHz or 850 MHz 350 MHz or 650 MHz
Graphics Boost Clock No 500 MHz or 667 MHz 1.1 GHz 1 GHz or 1.15 GHz
Displays Supported 2 2 2 2
PCIe Controller 2.0 2.0 2.0 2.0
PCIe Configuration 1×16, 2×8 1×16 1×16, 2×8, 1×8, 2×4 1×16, 2×8, 1×8, 2×4
Turbo Boost No No No No
EM64T Yes Yes Yes Yes
Virtualization Yes Yes Yes Yes
SSE4.2 Yes Yes Yes Yes
AES-NI No No No No
AVX No No Yes Yes
AVX2 No No No No
Base Clock 133 MHz 133 MHz 100 MHz 100 MHz
Pinout LGA1156 G1 or BGA1288 LGA1155 G2 or BGA1023

 

Model 32xx 3xxx 4xxx 4xxx
Market Desktop Mobile Desktop Mobile
Generation Third Third Fouth Fourth
Microarchitecture Ivy Bridge Ivy Bridge Haswell Haswell
Manufacturing Process 22 nm 22 nm 22 nm 22 nm
Number of Cores 2 2 2 2
Hyper-Threading Yes Yes Yes Yes
L1 cache (per core) 32 kiB+32kiB 32 kiB+32 kiB 32 kiB+32 kiB 32 kiB+32 kiB
L2 cache (per core) 256 kiB 256 kiB 256 kiB 256 kiB
L3 cache (total) 3 MiB 3 MiB 3 MiB or 4 MiB 3 MiB
DMI bus 2 GB/s 2 GB/s 2 GB/s 2 GB/s
Memory (DDR3) 1333, 1600 1333, 1600 1333, 1600 1333, 1600
DDR3L and DDR3L-RS No Yes Yes Yes
Graphics Engine HD 2500 or HD 4000 HD 4000    
DirectX 11 11 11.1 11.1
Graphics Processors 6 or 12 12 HD 4400 or HD 4600 HD 4200, HD 4400, HD 4600 or Iris 5100
Graphics Base Clock 650 MHz 350 MHz or 650 MHz HD 4400 or HD 4600 HD 4200, HD 4400, HD 4600 or Iris 5100
Graphics Boost Clock 1.05 GHz 1.05 GHz or 1 GHz HD 4400 or HD 4600 HD 4200, HD 4400, HD 4600 or Iris 5100
Displays Supported 3 3 3 3
PCIe Controller 2.0 2.0 3.0 2.0
PCIe Configuration 1×16, 2×8, 1×8, 2×4 1×16, 2×8, 1×8, 2×4 1×16, 2×8, 1×8, 2×4 1×16, 2×8, 1×8, 2×4 ou 1×4, 4×1
Turbo Boost No No No No
EM64T Yes Yes Yes Yes
Virtualization Yes Yes Yes Yes
SSE4.2 Yes Yes Yes Yes
AES-NI No No Yes Yes
AVX Yes Yes Yes Yes
AVX2 No No Yes Yes
Base Clock 100 MHz 100 MHz 100 MHz 100 MHz
Pinout LGA1155 G2 or BGA1023 LGA1150 FCPGA946 or FCBGA1168

Let’s now take a detailed look at all Core i3 models launched so far.

[nextpage title=”Core i3-5xx Models (Desktop)”]

In the table below, we listed all Core i3-5xx CPU models. These are desktop models based on the Nehalem microarchitecture, and are also called first-generation Core i3 processors. These models use the socket LGA1156. The integrated memory controller supports dual-channel architecture as well as 1,066 MHz and 1,333 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller, supporting one x16 datapath or two x8 datapaths. Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, which is listed as 2.5 GT/s by Intel). All models have an integrated DirectX 10 video controller with six execution units running at 733 MHz, using an engine that is known as “Intel HD Graphics.” These processors support two video monitors.

All Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec Model Clock Cores HT Video Video Clock L3 Cache Tech. TDP (W) Max. Temp. (°C)* Voltage (V)
SLBY2 560 3.33 GHz 2 Yes HD Graphics 733 MHz 4 MiB 32 nm 73 72.6 0.64 – 1.4
SLBUD 550 3.2 GHz 2 Yes HD Graphics 733 MHz 4 MiB 32 nm 73 72.6 0.64 – 1.4
SLBTD 540 3.06 GHz 2 Yes HD Graphics 733 MHz 4 MiB 32 nm 73 72.6 0.64 – 1.4
SLBMQ 540 3.06 GHz 2 Yes HD Graphics 733 MHz 4 MiB 32 nm 73 72.6 0.64 – 1.4
SLBX7 530 2.93 GHz 2 Yes HD Graphics 733 MHz 4 MiB 32 nm 73 72.6 0.65 – 1.4
SLBLR 530 2.93 GHz 2 Yes HD Graphics 733 MHz 4 MiB 32 nm 73 72.6 0.65 – 1.4

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

[nextpage title=”Core i3-3xx Models (Mobile)”]

The first-generation Core i3 targeted to laptops, named 3xx, uses the Nehalem microarchitecture. They can use two different pinouts, BGA1288 or socket G1, and have an integrated dual-channel DDR3 memory controller supporting 800 MHz and 1,066 MHz DDR3 memories. (“UM” models support only DDR3-800 memories.) They have an integrated PCI Express 2.0 controller supporting one x16 connection, and an integrated DirectX 10 video controller running at 500 MHz with 667 MHz “boost” clock (166 MHz with 500 MHz “boost” clock in “UM” models). Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, which is listed as 2.5 GT/s by Intel). These processors support two video monitors.

All Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec Model Clock Cores HT Video Video Clock Video Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)* Package
SLC25 390M 2.66 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 90 G1
SLC24 390M 2.66 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 105 BGA1288
SLBZX 380M 2.53 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 90 G1
SLBSL 380UM 1.33 GHz 2 Yes HD Graphics 166 MHz 500 MHz 32 nm 3 MiB 18 105 BGA1288
SLBUK 370M 2.40 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 90 G1
SLBU5 350M 2.26 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 90 G1
SLBU6 350M 2.26 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 105 BGA1288
SLBPK 350M 2.26 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 90 G2
SLBPL 350M 2.26 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 105 BGA1288
SLBNF 330M 2.13 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 105 BGA1288
SLBMD 330M 2.13 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 90 G1
SLBUG 330UM 1.20 GHz 2 Yes HD Graphics 166 MHz 500 MHz 32 nm 3 MiB 18 105 BGA1288
SLBXW 330E 2.13 GHz 2 Yes HD Graphics 500 MHz 667 MHz 32 nm 3 MiB 35 105 BGA1288

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

[nextpage title=”Core i3-21xx Models (Desktop)”]

In the table below, we listed all Core i3-21xx CPU models. These are desktop models based on the Sandy Bridge microarchitecture. They are also called second-generation Core i3 processors and use the socket LGA1155. The integrated memory controller supports dual-channel architecture as well as 1,066 MHz and 1,333 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). All models have an integrated DirectX 10.1 video controller running at 650 MHz or 850 MHz, with 1.1 GHz “boost” clock and six (HD 2000) or 12 (HD 3000) processing cores. These models support two video monitors.

As mentioned before, all Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec Model Clock Cores HT Video Video Clock Video Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)* Voltage (V)
SR05W 2130 3.40 GHz 2 Yes HD 2000 850 MHz 1.1 GHz 32 nm 3 MiB 65 69.1 NA
SR0AY 2125 3.30 GHz 2 Yes HD 3000 850 MHz 1.1 GHz 32 nm 3 MiB 65 69.1 NA
SR060 2120T 2.60 GHz 2 Yes HD 2000 650 MHz 1.1 GHz 32 nm 3 MiB 35 65.0 NA
SR05Y 2120 3.30 GHz 2 Yes HD 2000 850 MHz 1.1 GHz 32 nm 3 MiB 65 69.1 NA
SR0BA 2105 3.10 GHz 2 Yes HD 3000 850 MHz 1.1 GHz 32 nm 3 MiB 65 69.1 NA
SR05D 2102 3.10 GHz 2 Yes HD 2000 850 MHz 1.1 GHz 32 nm 3 MiB 65 69.1 NA
SR05Z 2100T 2.50 GHz 2 Yes HD 2000 650 MHz 1.1 GHz 32 nm 3 MiB 35 65.0 NA
SR05C 2100 3.10 GHz 2 Yes HD 2000 850 MHz 1.1 GHz 32 nm 3 MiB 65 69.1 NA

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

[nextpage title=”Core i3-23xx Models (Mobile)”]

The second-generation Core i3 processors targeted to laptops, which use the Sandy Bridge microarchitecture, can use two different pinouts, BGA1023 or socket G2, and have an integrated dual-channel DDR3 memory controller supporting 1,066 MHz, 1,333 MHz, and 1,600 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). They also have an integrated DirectX 10.1 video controller running at 350 MHz with 1 GHz “boost” clock on models with a TDP of 17 W, or 650 MHz with 1.15 GHz “boost” clock on models with a TDP of 35 W, all with 12 processing cores (HD 3000 graphics engine). These processors support two video monitors.

As mentioned previously, all Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec Model Clock Cores HT Video Video Clock Video Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)*

Package

NA 2377M 1.5 GHz 2 Yes HD 3000 350 MHz 1 GHz 32 nm 3 MiB 17 100 BGA1023
SR0DP 2370M 2.4 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 85 G2
SR0CV 2367M 1.4 GHz 2 Yes HD 3000 350 MHz 1 GHz 32 nm 3 MiB 17 100 BGA1023
NA 2357M 1.3 GHz 2 Yes HD 3000 350 MHz 1 GHz 32 nm 3 MiB 17 100

BGA1023

SR0DN 2350M 2.3 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 85 G2
SR04L 2330M 2.2 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 100

BGA1023

SR04J 2330M 2.2 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 85

G2

SR02V 2330E 2.2 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 100

G2

NA 2328M 2.2 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 100 BGA1023
NA 2328M 2.2 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 85 G2
SR09S 2312M 2.1 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 85 G2
SR04S 2310M 2.1 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 85

G2

SR04R 2310M 2.1 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 100

BGA1023

SR077 2310E 2.1 GHz 2 Yes HD 3000 650 MHz 1.15 GHz 32 nm 3 MiB 35 100

BGA1023

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

[nextpage title=”Core i3-32xx Models (Desktop)”]

The Core i3-32xx models are based on the Ivy Bridge microarchitecture and are also known as the third-generation Core i3 processors. They use the socket LGA1155, the same used by the second-generation Core i3 processors. The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). All models have an integrated DirectX 11 video controller with six (HD 2500) or 12 (HD 4000) processing units, running at 650 MHz with 1.05 GHz “boost” clock. All models support three displays (previous generations support two).

As mentioned earlier, all Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec Model Clock Cores HT Video Video Clock Video Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)* Voltage (V)
SR0YX 3250 3.5 GHz 2 Yes HD 2500 650 MHz 1.05 GHz 22 nm 3 MiB 55 65.3 NA
SR0YW 3250T 3.0 GHz 2 Yes HD 2500 650 MHz 1.05 GHz 22 nm 3 MiB 35 65.0 NA
SR0YL 3245 3.4 GHz 2 Yes HD 4000 650 MHz 1.05 GHz 22 nm 3 MiB 55 65.3 NA
SR0RH 3240 3.4 GHz 2 Yes HD 2500 650 MHz 1.05 GHz 22 nm 3 MiB 55 65.3 NA
SR0RK 3240T 2.9 GHz 2 Yes HD 2500 650 MHz 1.05 GHz 22 nm 3 MiB 35 65.0 NA
SR0RF 3225 3.3 GHz 2 Yes HD 4000 650 MHz 1.05 GHz 22 nm 3 MiB 55 65.3 NA
SR0RG 3220 3.3 GHz 2 Yes HD 2500 650 MHz 1.05 GHz 22 nm 3 MiB 55 65.3 NA
SR0RE 3220T 2.8 GHz 2 Yes HD 2500 650 MHz 1.05 GHz 22 nm 3 MiB 35 65.0 NA
SR0YY 3210 3.2 GHz 2 Yes HD 2500 650 MHz 1.05 GHz 22 nm 3 MiB 55 65.3 NA

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

[nextpage title=”Core i3-3xxx Models (Mobile)”]

As their desktop counterparts, the Core i3-3xxx models targeted to mobile computers are based on the Ivy Bridge microarchitecture and are also known as the third-generation Core i3 processors. They can use either the BGA1023 pinout or the socket G2 pinout. The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3, DDR3L, and DDR3L-RS memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).

All models have an integrated DirectX 11 video controller with 12 execution units (Intel HD 4000 graphics).

As stated before, all Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec Model Clock Cores HT Video Video Clock Video Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)* Package
SR12P 3229Y 1.4 GHz 2 Yes HD 4000 350 MHz 850 MHz 22 nm 3 MiB 13 105 BGA1023
SR0XF 3227U 1.9 GHz 2 Yes HD 4000 350 MHz 1.1 GHz 22 nm 3 MiB 17 105 G2
SR0N9 3217U 1.8 GHz 2 Yes HD 4000 350 MHz 1.05 GHz 22 nm 3 MiB 17 105 BGA1023
SR0T4 3110M 2.4 GHz 2 Yes HD 4000 650 MHz 1 GHz  22 nm 3 MiB 35 90 G2
SR0N2 3110M 2.4 GHz 2 Yes HD 4000 650 MHz 1 GHz 22 nm 3 MiB 35 105 BGA1023
SR0N1 3110M 2.4 GHz 2 Yes HD 4000 650 MHz 1 GHz 22 nm 3 MiB 35 90 G2

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

[nextpage title=”Core i3-4xxx Models (Desktop)”]

Core i3-4xxx models are based on the Haswell microarchitecture and are also known as the fourth-generation Core i3 processors. They use a new socket, LGA1150, which is not compatible with motherboards developed for previous models.

These processors have a PCI Express 3.0 controller, instead of a 2.0 as other models. This controller supports one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).

Another difference is the support for AES-NI and AVX2 instructions, not available on previous models.

Two graphics engines are available at the moment, both DirectX 11.1 with 20 execution engines (codenamed “GT2”).

As mentioned earlier, all Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec

Model

Clock

Cores

HT

Video

Video Clock

Vídeo Boost

Tech.

L3 Cache

TDP (W)

Max. Temp. (°C)*

Voltage (V)

SR1NL 4340 3.6 GHz 2 Sim HD 4600 350 MHz 1.15 GHz 22 nm 4 MiB 54 72 NA
SR1NM 4330 3.5 GHz 2 Sim HD 4600 N/D 1.15 GHz 22 nm 4 MiB 54 NA NA
SR1NK 4330T 3.0 GHz 2 Sim HD 4600  200 MHz 1.15 GHz 22 nm 4 MiB 35 72 NA
SR1NP 4130 3.4 GHz 2 Sim HD 4400 350 MHz 1.15 GHz 22 nm 3 MiB 54 72 NA
SR1NN 4130T 2.9 GHz 2 Sim HD 4400 200 MHz 1.15 GHz 22 nm 3 MiB 35 72 NA

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

[nextpage title=”Core i3-4xxx Models (Mobile)”]

As their desktop counterparts, the Core i3-4xxx models targeted to mobile computers are based on the Haswell microarchitecture and are also known as the fourth-generation Core i3 processors. They can use either the FCBGA1168 or the FCPGA946 pinout, which are not compatible with the pinout standard used by previous models.

Another difference is the support for AES-NI and AVX2 instructions, not available on previous models.

An important difference between the desktop and mobile models of the fourth-generation Core i3 is the PCI Express controller, which is 3.0 on desktop models, but 2.0 on mobile versions.

The “U” and “Y” models carry an integrated south bridge chip with a four-port USB 3.0 controller and a four-port (two-port on the 4005U model) SATA-600 controller. On these models, the PCI Express controller supports only one x4 connection or four x1 connections. On “M” models the PCI Express supports one x16 connection, two x8 connections, one x8 connection or two x4 connections.

Four graphics engines are available, all DirectX 11.1: HD 4200 (codenamed “GT1”, 10 execution engines), HD 4400 (codenamed “GT2”, 20 execution engines), HD 4600 (also codenamed “GT2”, 20 execution engines) and Iris 5100 (codenamed “GT3”, 40 execution engines).

The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3L and LPDDR3 (on models “U” and “Y”) memories.

As mentioned earlier, all Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec Model Clock Cores HT Video Video Clock Vídeo Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)* Package
SR18B 4158U 2.0 GHz 2 Sim Iris 5100 200 MHz 1.1 GHz 22 nm 3 MiB 28 100 FCBGA1168
NA 4100M 2.5 GHz 2 Sim HD 4600 400 MHz 1.1 GHz 22 nm 3 MiB 37 100 NA
SR1DC 4020Y 1.5 GHz 2 Sim HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 FCBGA1168
NA 4012Y 1.5 GHz 2 Sim HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 NA
SR18F 4010Y 1.3 GHz 2 Sim HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 FCBGA1168
SR16P 4010U 1.8 GHz 2 Sim HD 4400 200 MHz 1 GHz 22 nm 3 MiB 15 100 FCBGA1168
SR16Q 4010U 1.7 GHz 2 Sim HD 4400 200 MHz 1 GHz 22 nm 3 MiB 15 100 FCBGA1168
NA 4005U 1.7 GHz 2 Sim HD 4400 200 MHz 950 MHz 22 nm 3 MiB 15 100 NA
SR1HC 4000M 2.4 GHz 2 Sim HD 4600 400 MHz 1.1 GHz 22 nm 3 MiB 37 100 FCPGA946

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.