All Core i3 Models

[nextpage title=”Introduction”]

The Core i3 is a CPU series manufactured by Intel aimed at entry-level computers. In this tutorial, we will present a series of quick reference tables for you to compare the main differences between all models released to date.

By the way, the correct name of this line of processors is “Core i3,” not “Intel i3.”

Currently, there are three different generations of Core i3 processors available. In the table below, we describe the main differences between these generations.

Model	5xx	3xx	21xx	23xx
Market	Desktop	Mobile	Desktop	Mobile
Generation	First	First	Second	Second
Microarchitecture	Nehalem	Nehalem	Sandy Bridge	Sandy Bridge
Manufacturing Process	32 nm	32 nm	32 nm	32 nm
Number of Cores	2	2	2	2
Hyper-Threading	Yes	Yes	Yes	Yes
L1 cache (per core)	32 kiB+32 kiB	32 kiB+32kiB	32 kiB+32 kiB	32 kiB+32kiB
L2 cache (per core)	256 kiB	256 kiB	256 kiB	256 kiB
L3 cache (total)	4 MiB	3 MiB	3 MiB	3 MiB
DMI bus	1 GB/s	1 GB/s	2 GB/s	2 GB/s
Memory (DDR3)	1066, 1333	800, 1066	1066, 1333	1066, 1333, 1600
DDR3L and DDR3L-RS	No	No	No	No
Graphics Engine	HD Graphics	HD Graphics	HD 2000 or HD 3000	HD 3000
DirectX	10	10	10.1	10.1
Graphics Processors	6	6	6 or 12	12
Graphics Base Clock	733 MHz	166 MHz or 500 MHz	650 MHz or 850 MHz	350 MHz or 650 MHz
Graphics Boost Clock	No	500 MHz or 667 MHz	1.1 GHz	1 GHz or 1.15 GHz
Displays Supported	2	2	2	2
PCIe Controller	2.0	2.0	2.0	2.0
PCIe Configuration	1×16, 2×8	1×16	1×16, 2×8, 1×8, 2×4	1×16, 2×8, 1×8, 2×4
Turbo Boost	No	No	No	No
EM64T	Yes	Yes	Yes	Yes
Virtualization	Yes	Yes	Yes	Yes
SSE4.2	Yes	Yes	Yes	Yes
AES-NI	No	No	No	No
AVX	No	No	Yes	Yes
AVX2	No	No	No	No
Base Clock	133 MHz	133 MHz	100 MHz	100 MHz
Pinout	LGA1156	G1 or BGA1288	LGA1155	G2 or BGA1023

Model	32xx	3xxx	4xxx	4xxx
Market	Desktop	Mobile	Desktop	Mobile
Generation	Third	Third	Fouth	Fourth
Microarchitecture	Ivy Bridge	Ivy Bridge	Haswell	Haswell
Manufacturing Process	22 nm	22 nm	22 nm	22 nm
Number of Cores	2	2	2	2
Hyper-Threading	Yes	Yes	Yes	Yes
L1 cache (per core)	32 kiB+32kiB	32 kiB+32 kiB	32 kiB+32 kiB	32 kiB+32 kiB
L2 cache (per core)	256 kiB	256 kiB	256 kiB	256 kiB
L3 cache (total)	3 MiB	3 MiB	3 MiB or 4 MiB	3 MiB
DMI bus	2 GB/s	2 GB/s	2 GB/s	2 GB/s
Memory (DDR3)	1333, 1600	1333, 1600	1333, 1600	1333, 1600
DDR3L and DDR3L-RS	No	Yes	Yes	Yes
Graphics Engine	HD 2500 or HD 4000	HD 4000
DirectX	11	11	11.1	11.1
Graphics Processors	6 or 12	12	HD 4400 or HD 4600	HD 4200, HD 4400, HD 4600 or Iris 5100
Graphics Base Clock	650 MHz	350 MHz or 650 MHz	HD 4400 or HD 4600	HD 4200, HD 4400, HD 4600 or Iris 5100
Graphics Boost Clock	1.05 GHz	1.05 GHz or 1 GHz	HD 4400 or HD 4600	HD 4200, HD 4400, HD 4600 or Iris 5100
Displays Supported	3	3	3	3
PCIe Controller	2.0	2.0	3.0	2.0
PCIe Configuration	1×16, 2×8, 1×8, 2×4	1×16, 2×8, 1×8, 2×4	1×16, 2×8, 1×8, 2×4	1×16, 2×8, 1×8, 2×4 ou 1×4, 4×1
Turbo Boost	No	No	No	No
EM64T	Yes	Yes	Yes	Yes
Virtualization	Yes	Yes	Yes	Yes
SSE4.2	Yes	Yes	Yes	Yes
AES-NI	No	No	Yes	Yes
AVX	Yes	Yes	Yes	Yes
AVX2	No	No	Yes	Yes
Base Clock	100 MHz	100 MHz	100 MHz	100 MHz
Pinout	LGA1155	G2 or BGA1023	LGA1150	FCPGA946 or FCBGA1168

Let’s now take a detailed look at all Core i3 models launched so far.

[nextpage title=”Core i3-5xx Models (Desktop)”]

In the table below, we listed all Core i3-5xx CPU models. These are desktop models based on the Nehalem microarchitecture, and are also called first-generation Core i3 processors. These models use the socket LGA1156. The integrated memory controller supports dual-channel architecture as well as 1,066 MHz and 1,333 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller, supporting one x16 datapath or two x8 datapaths. Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, which is listed as 2.5 GT/s by Intel). All models have an integrated DirectX 10 video controller with six execution units running at 733 MHz, using an engine that is known as “Intel HD Graphics.” These processors support two video monitors.

All Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec	Model	Clock	Cores	HT	Video	Video Clock	L3 Cache	Tech.	TDP (W)	Max. Temp. (°C)*	Voltage (V)
SLBY2	560	3.33 GHz	2	Yes	HD Graphics	733 MHz	4 MiB	32 nm	73	72.6	0.64 – 1.4
SLBUD	550	3.2 GHz	2	Yes	HD Graphics	733 MHz	4 MiB	32 nm	73	72.6	0.64 – 1.4
SLBTD	540	3.06 GHz	2	Yes	HD Graphics	733 MHz	4 MiB	32 nm	73	72.6	0.64 – 1.4
SLBMQ	540	3.06 GHz	2	Yes	HD Graphics	733 MHz	4 MiB	32 nm	73	72.6	0.64 – 1.4
SLBX7	530	2.93 GHz	2	Yes	HD Graphics	733 MHz	4 MiB	32 nm	73	72.6	0.65 – 1.4
SLBLR	530	2.93 GHz	2	Yes	HD Graphics	733 MHz	4 MiB	32 nm	73	72.6	0.65 – 1.4

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

[nextpage title=”Core i3-3xx Models (Mobile)”]

The first-generation Core i3 targeted to laptops, named 3xx, uses the Nehalem microarchitecture. They can use two different pinouts, BGA1288 or socket G1, and have an integrated dual-channel DDR3 memory controller supporting 800 MHz and 1,066 MHz DDR3 memories. (“UM” models support only DDR3-800 memories.) They have an integrated PCI Express 2.0 controller supporting one x16 connection, and an integrated DirectX 10 video controller running at 500 MHz with 667 MHz “boost” clock (166 MHz with 500 MHz “boost” clock in “UM” models). Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, which is listed as 2.5 GT/s by Intel). These processors support two video monitors.

All Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec

Model

Clock

Cores

Video

Video Clock

Video Boost

Tech.

L3 Cache

TDP (W)

Max. Temp. (°C)*

Package

SLC25

390M

2.66 GHz

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

SLC24

390M

2.66 GHz

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

105

BGA1288

SLBZX

380M

2.53 GHz

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

SLBSL

380UM

1.33 GHz

Yes

HD Graphics

166 MHz

500 MHz

32 nm

3 MiB

105

BGA1288

SLBUK

370M

2.40 GHz

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

SLBU5

350M

2.26 GHz

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

SLBU6

350M

2.26 GHz

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

105

BGA1288

SLBPK

350M

2.26 GHz

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

SLBPL

350M

2.26 GHz

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

105

BGA1288

SLBNF

330M

2.13 GHz

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

105

BGA1288

SLBMD

330M

2.13 GHz

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

SLBUG

330UM

1.20 GHz

Yes

HD Graphics

166 MHz

500 MHz

32 nm

3 MiB

105

BGA1288

SLBXW

330E

2.13 GHz

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

105

BGA1288

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

[nextpage title=”Core i3-21xx Models (Desktop)”]

In the table below, we listed all Core i3-21xx CPU models. These are desktop models based on the Sandy Bridge microarchitecture. They are also called second-generation Core i3 processors and use the socket LGA1155. The integrated memory controller supports dual-channel architecture as well as 1,066 MHz and 1,333 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). All models have an integrated DirectX 10.1 video controller running at 650 MHz or 850 MHz, with 1.1 GHz “boost” clock and six (HD 2000) or 12 (HD 3000) processing cores. These models support two video monitors.

As mentioned before, all Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec

Model

Clock

Cores

Video

Video Clock

Video Boost

Tech.

L3 Cache

TDP (W)

Max. Temp. (°C)*

Voltage (V)

SR05W

2130

3.40 GHz

Yes

HD 2000

850 MHz

1.1 GHz

32 nm

3 MiB

69.1

SR0AY

2125

3.30 GHz

Yes

HD 3000

850 MHz

1.1 GHz

32 nm

3 MiB

69.1

SR060

2120T

2.60 GHz

Yes

HD 2000

650 MHz

1.1 GHz

32 nm

3 MiB

65.0

SR05Y

2120

3.30 GHz

Yes

HD 2000

850 MHz

1.1 GHz

32 nm

3 MiB

69.1

SR0BA

2105

3.10 GHz

Yes

HD 3000

850 MHz

1.1 GHz

32 nm

3 MiB

69.1

SR05D

2102

3.10 GHz

Yes

HD 2000

850 MHz

1.1 GHz

32 nm

3 MiB

69.1

SR05Z

2100T

2.50 GHz

Yes

HD 2000

650 MHz

1.1 GHz

32 nm

3 MiB

65.0

SR05C

2100

3.10 GHz

Yes

HD 2000

850 MHz

1.1 GHz

32 nm

3 MiB

69.1

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

[nextpage title=”Core i3-23xx Models (Mobile)”]

The second-generation Core i3 processors targeted to laptops, which use the Sandy Bridge microarchitecture, can use two different pinouts, BGA1023 or socket G2, and have an integrated dual-channel DDR3 memory controller supporting 1,066 MHz, 1,333 MHz, and 1,600 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). They also have an integrated DirectX 10.1 video controller running at 350 MHz with 1 GHz “boost” clock on models with a TDP of 17 W, or 650 MHz with 1.15 GHz “boost” clock on models with a TDP of 35 W, all with 12 processing cores (HD 3000 graphics engine). These processors support two video monitors.

As mentioned previously, all Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec

Model

Clock

Cores

Video

Video Clock

Video Boost

Tech.

L3 Cache

TDP (W)

Max. Temp. (°C)*

Package

2377M

1.5 GHz

Yes

HD 3000

350 MHz

1 GHz

32 nm

3 MiB

100

BGA1023

SR0DP

2370M

2.4 GHz

Yes

HD 3000

650 MHz

1.15 GHz

32 nm

3 MiB

SR0CV

2367M

1.4 GHz

Yes

HD 3000

350 MHz

1 GHz

32 nm

3 MiB

100

BGA1023

2357M

1.3 GHz

Yes

HD 3000

350 MHz

1 GHz

32 nm

3 MiB

100

BGA1023

SR0DN

2350M

2.3 GHz

Yes

HD 3000

650 MHz

1.15 GHz

32 nm

3 MiB

SR04L

2330M

2.2 GHz

Yes

HD 3000

650 MHz

1.15 GHz

32 nm

3 MiB

100

BGA1023

SR04J

2330M

2.2 GHz

Yes

HD 3000

650 MHz

1.15 GHz

32 nm

3 MiB

SR02V

2330E

2.2 GHz

Yes

HD 3000

650 MHz

1.15 GHz

32 nm

3 MiB

100

2328M

2.2 GHz

Yes

HD 3000

650 MHz

1.15 GHz

32 nm

3 MiB

100

BGA1023

2328M

2.2 GHz

Yes

HD 3000

650 MHz

1.15 GHz

32 nm

3 MiB

SR09S

2312M

2.1 GHz

Yes

HD 3000

650 MHz

1.15 GHz

32 nm

3 MiB

SR04S

2310M

2.1 GHz

Yes

HD 3000

650 MHz

1.15 GHz

32 nm

3 MiB

SR04R

2310M

2.1 GHz

Yes

HD 3000

650 MHz

1.15 GHz

32 nm

3 MiB

100

BGA1023

SR077

2310E

2.1 GHz

Yes

HD 3000

650 MHz

1.15 GHz

32 nm

3 MiB

100

BGA1023

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

[nextpage title=”Core i3-32xx Models (Desktop)”]

The Core i3-32xx models are based on the Ivy Bridge microarchitecture and are also known as the third-generation Core i3 processors. They use the socket LGA1155, the same used by the second-generation Core i3 processors. The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). All models have an integrated DirectX 11 video controller with six (HD 2500) or 12 (HD 4000) processing units, running at 650 MHz with 1.05 GHz “boost” clock. All models support three displays (previous generations support two).

As mentioned earlier, all Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec

Model

Clock

Cores

Video

Video Clock

Video Boost

Tech.

L3 Cache

TDP (W)

Max. Temp. (°C)*

Voltage (V)

SR0YX

3250

3.5 GHz

Yes

HD 2500

650 MHz

1.05 GHz

22 nm

3 MiB

65.3

SR0YW

3250T

3.0 GHz

Yes

HD 2500

650 MHz

1.05 GHz

22 nm

3 MiB

65.0

SR0YL

3245

3.4 GHz

Yes

HD 4000

650 MHz

1.05 GHz

22 nm

3 MiB

65.3

SR0RH

3240

3.4 GHz

Yes

HD 2500

650 MHz

1.05 GHz

22 nm

3 MiB

65.3

SR0RK

3240T

2.9 GHz

Yes

HD 2500

650 MHz

1.05 GHz

22 nm

3 MiB

65.0

SR0RF

3225

3.3 GHz

Yes

HD 4000

650 MHz

1.05 GHz

22 nm

3 MiB

65.3

SR0RG

3220

3.3 GHz

Yes

HD 2500

650 MHz

1.05 GHz

22 nm

3 MiB

65.3

SR0RE

3220T

2.8 GHz

Yes

HD 2500

650 MHz

1.05 GHz

22 nm

3 MiB

65.0

SR0YY

3210

3.2 GHz

Yes

HD 2500

650 MHz

1.05 GHz

22 nm

3 MiB

65.3

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

[nextpage title=”Core i3-3xxx Models (Mobile)”]

As their desktop counterparts, the Core i3-3xxx models targeted to mobile computers are based on the Ivy Bridge microarchitecture and are also known as the third-generation Core i3 processors. They can use either the BGA1023 pinout or the socket G2 pinout. The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3, DDR3L, and DDR3L-RS memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).

All models have an integrated DirectX 11 video controller with 12 execution units (Intel HD 4000 graphics).

As stated before, all Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec

Model

Clock

Cores

Video

Video Clock

Video Boost

Tech.

L3 Cache

TDP (W)

Max. Temp. (°C)*

Package

SR12P

3229Y

1.4 GHz

Yes

HD 4000

350 MHz

850 MHz

22 nm

3 MiB

105

BGA1023

SR0XF

3227U

1.9 GHz

Yes

HD 4000

350 MHz

1.1 GHz

22 nm

3 MiB

105

SR0N9

3217U

1.8 GHz

Yes

HD 4000

350 MHz

1.05 GHz

22 nm

3 MiB

105

BGA1023

SR0T4

3110M

2.4 GHz

Yes

HD 4000

650 MHz

1 GHz

22 nm

3 MiB

SR0N2

3110M

2.4 GHz

Yes

HD 4000

650 MHz

1 GHz

22 nm

3 MiB

105

BGA1023

SR0N1

3110M

2.4 GHz

Yes

HD 4000

650 MHz

1 GHz

22 nm

3 MiB

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

[nextpage title=”Core i3-4xxx Models (Desktop)”]

Core i3-4xxx models are based on the Haswell microarchitecture and are also known as the fourth-generation Core i3 processors. They use a new socket, LGA1150, which is not compatible with motherboards developed for previous models.

These processors have a PCI Express 3.0 controller, instead of a 2.0 as other models. This controller supports one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).

Another difference is the support for AES-NI and AVX2 instructions, not available on previous models.

Two graphics engines are available at the moment, both DirectX 11.1 with 20 execution engines (codenamed “GT2”).

sSpec

Model

Clock

Cores

Video

Video Clock

Vídeo Boost

Tech.

L3 Cache

TDP (W)

Max. Temp. (°C)*

Voltage (V)

SR1NL

4340

3.6 GHz

Sim

HD 4600

350 MHz

1.15 GHz

22 nm

4 MiB

SR1NM

4330

3.5 GHz

Sim

HD 4600

N/D

1.15 GHz

22 nm

4 MiB

SR1NK

4330T

3.0 GHz

Sim

HD 4600

200 MHz

1.15 GHz

22 nm

4 MiB

SR1NP

4130

3.4 GHz

Sim

HD 4400

350 MHz

1.15 GHz

22 nm

3 MiB

SR1NN

4130T

2.9 GHz

Sim

HD 4400

200 MHz

1.15 GHz

22 nm

3 MiB

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

[nextpage title=”Core i3-4xxx Models (Mobile)”]

As their desktop counterparts, the Core i3-4xxx models targeted to mobile computers are based on the Haswell microarchitecture and are also known as the fourth-generation Core i3 processors. They can use either the FCBGA1168 or the FCPGA946 pinout, which are not compatible with the pinout standard used by previous models.

Another difference is the support for AES-NI and AVX2 instructions, not available on previous models.

An important difference between the desktop and mobile models of the fourth-generation Core i3 is the PCI Express controller, which is 3.0 on desktop models, but 2.0 on mobile versions.

The “U” and “Y” models carry an integrated south bridge chip with a four-port USB 3.0 controller and a four-port (two-port on the 4005U model) SATA-600 controller. On these models, the PCI Express controller supports only one x4 connection or four x1 connections. On “M” models the PCI Express supports one x16 connection, two x8 connections, one x8 connection or two x4 connections.

Four graphics engines are available, all DirectX 11.1: HD 4200 (codenamed “GT1”, 10 execution engines), HD 4400 (codenamed “GT2”, 20 execution engines), HD 4600 (also codenamed “GT2”, 20 execution engines) and Iris 5100 (codenamed “GT3”, 40 execution engines).

The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3L and LPDDR3 (on models “U” and “Y”) memories.

sSpec

Model

Clock

Cores

Video

Video Clock

Vídeo Boost

Tech.

L3 Cache

TDP (W)

Max. Temp. (°C)*

Package

SR18B

4158U

2.0 GHz

Sim

Iris 5100

200 MHz

1.1 GHz

22 nm

3 MiB

100

FCBGA1168

4100M

2.5 GHz

Sim

HD 4600

400 MHz

1.1 GHz

22 nm

3 MiB

100

SR1DC

4020Y

1.5 GHz

Sim

HD 4200

200 MHz

850 MHz

22 nm

3 MiB

11.5

100

FCBGA1168

4012Y

1.5 GHz

Sim

HD 4200

200 MHz

850 MHz

22 nm

3 MiB

11.5

100

SR18F

4010Y

1.3 GHz

Sim

HD 4200

200 MHz

850 MHz

22 nm

3 MiB

11.5

100

FCBGA1168

SR16P

4010U

1.8 GHz

Sim

HD 4400

200 MHz

1 GHz

22 nm

3 MiB

100

FCBGA1168

SR16Q

4010U

1.7 GHz

Sim

HD 4400

200 MHz

1 GHz

22 nm

3 MiB

100

FCBGA1168

4005U

1.7 GHz

Sim

HD 4400

200 MHz

950 MHz

22 nm

3 MiB

100

SR1HC

4000M

2.4 GHz

Sim

HD 4600

400 MHz

1.1 GHz

22 nm

3 MiB

100

FCPGA946

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

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