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[nextpage title=”Introduction”]

Since the launch of Pentium II, each top-shelf Intel CPU series has its value counterpart named Celeron. In this tutorial, you can check the characteristics of every mobile Celeron released to date.

By the way, if you want a list of the desktop Celeron models, check out our All Celeron Models tutorial.

Mobile models, however, are not idhentical to the desktop ones.

Early Mobile Celeron models (based on Pentium II and Pentium III architecture) were very similar to the desktop ones, but with lower voltage, thus consuming less power and dissipating less heat. The following models were based on Pentium M, Core Solo or Core Duo, always features like L2 memory cache, external bus speed and internal clock rate reduced in comparison to their desktop counterparts. The official name of these models is Celeron M. Note there were no desktop Celeron models base on this architecture.

The most recent models are based on Core 2 Duo and Core i3 architectures, some of them with two processing cores, some with only one. There are ultra low voltage models, focusing on low power consuption, and others with higher voltage and clock rates, aimed on laptops with higher performance (but still on the value segment). These models are named Mobile Celeron.

In the next pages you can have an idea of all mobile Celeron models launched to date and their characteristics.

[nextpage title=”Mobile Celeron (Pentium II and III)”]

First mobile Celeron models were based on Pentium II and Pentium III processors, operating, however, with a lower voltage, and thus with lower power consuption and heat dissipation.

The main characteristics of first Mobile Celeron models are:

  • Based on Pentium II and Pentium III with Mendocino (0.25 µm), Coppermine (0.18 µm) or Tualatin (0.13 µm) cores
  • Manufacturing technology: 0.25 µm (250 nm), 0.18 µm (180 nm) or 0.13 µm (130 nm)
  • L1 Cache: 32 KB total, 16 KB for instructions and 16 KB for data
  • L2 Cache: 128 KB on 0.25 µm and 0.18 µm models, 256 KB on 0.13 µm models
  • External clock: 66 MHz, 100 MHz or 133 MHz
  • Packaging/socket: PGA2, micro-PGA2, FC-PGA, socket 495, socket 479, socket 478, micro-FCPGA or micro-FCBGA
  • Support to SSE instructions

In the table below we list all Mobile Celeron models based on Pentium II and Pentium III CPUs that were released.

sSpec

Internal Clock

External Clock

L2 Cache

Voltage (V)

TDP (W)

Technology

SL6HA

1.33 GHz

133 MHz

256 KB

1.5

19

130 µm

SL64K

1.20 GHz

133 MHz

256 KB

1.45

24.4

130 µm

SL63Z

1.20 GHz

133 MHz

256 KB

1.5

24.4

130 µm

SL64L

1.13 GHz

133 MHz

256 KB

1.5

23.8

130 µm

SL642

1.13 GHz

133 MHz

256 KB

1.5

24.4

130 µm

SL64M

1.06 GHz

133 MHz

256 KB

1.5

23.2

130 µm

SL643

1.06 GHz

133 MHz

256 KB

1.45

23.2

130 µm

SL6AB

1.00 GHz

133 MHz

256 KB

1.5

130 µm

SL6B3

1.00 GHz

133 MHz

256 KB

1.4

130 µm

SL6B4

733 MHz

133 MHz

256 KB

1.15

130 µm

SL5SR

933 MHz

133 MHz

128 KB

1.7

24.6

180 µm

SL5SK

933 MHz

133 MHz

128 KB

1.7

20.6

180 µm

SL5SU

933 MHz

133 MHz

128 KB

1.7

24.6

180 µm

SL5T2

866 MHz

133 MHz

128 KB

1.7

23.3

180 µm

SL5Q3

866 MHz

133 MHz

128 KB

1.7

23.3

180 µm

SL5Q2

866 MHz

133 MHz

128 KB

1.7

23.3

180 µm

SL5T3

800 MHz

133 MHz

128 KB

1.7

22

180 µm

SL5SQ

800 MHz

133 MHz

128 KB

1.7

22

180 µm

SL5ST

800 MHz

133 MHz

128 KB

1.7

22

180 µm

SL5SP

733 MHz

133 MHz

128 KB

1.7

20.6

180 µm

SL5SS

733 MHz

133 MHz

128 KB

1.7

20.6

180 µm

SL5PX

900 MHz

100 MHz

128 KB

1.7

24

180 µm

SL5PY

900 MHz

100 MHz

128 KB

1.7

24

180 µm

SL57Y

850 MHz

100 MHz

128 KB

1.6

18.8

180 µm

SL585

850 MHz

100 MHz

128 KB

1.6

18.8

180 µm

SL5CB

800 MHz

100 MHz

128 KB

1.6

17.6

180 µm

SL584

800 MHz

100 MHz

128 KB

1.6

17.6

180 µm

SL57X

800 MHz

100 MHz

128 KB

1.6

17.6

180 µm

SL58K

750 MHz

100 MHz

128 KB

1.6

15.8

180 µm

SL56Q

750 MHz

100 MHz

128 KB

1.6

15.8

180 µm

SL53U

750 MHz

100 MHz

128 KB

1.6

15.8

180 µm

SL53C

750 MHz

100 MHz

128 KB

1.6

15.8

180 µm

SL56P

750 MHz

100 MHz

128 KB

1.6

15.8

180 µm

SL55Q

750 MHz

100 MHz

128 KB

1.6

15.8

180 µm

SL4GU

700 MHz

100 MHz

128 KB

1.6

15

180 µm

SL4GX

700 MHz

100 MHz

128 KB

1.6

15

180 µm

SL4PY

700 MHz

100 MHz

128 KB

23

180 µm

SL63F

650 MHz

100 MHz

256 KB

1.1

7

130 µm

SL4PX

650 MHz

100 MHz

128 KB

14

180 µm

SL4JG

650 MHz

100 MHz

128 KB

1.6

14

180 µm

SL4AE

650 MHz

100 MHz

128 KB

1.6

14

180 µm

SL4JW

650 MHz

100 MHz

128 KB

1.6

14

180 µm

SL4AD

650 MHz

100 MHz

128 KB

1.6

14

180 µm

SL4JV

600 MHz

100 MHz

128 KB

1.6

13

180 µm

SL4PW

600 MHz

100 MHz

128 KB

1.6

13

180 µm

SL4MU

600 MHz

100 MHz

128 KB

13

180 µm

SL5DS

600 MHz

100 MHz

128 KB

1.1

6.4

180 µm

SL4AR

600 MHz

100 MHz

128 KB

1.6

13

180 µm

SL4AP

600 MHz

100 MHz

128 KB

1.6

13

180 µm

SL4JF

600 MHz

100 MHz

128 KB

1.6

13

180 µm

SL582

600 MHz

100 MHz

128 KB

1.35

8.7

180 µm

SL3ZF

550 MHz

100 MHz

128 KB

1.6

18.4

180 µm

SL3ZE

550 MHz

100 MHz

128 KB

1.6

18.4

180 µm

SL4JE

550 MHz

100 MHz

128 KB

1.6

11.9

180 µm

SL4MT

550 MHz

100 MHz

128 KB

1.6

11.9

180 µm

SL4JD

500 MHz

100 MHz

128 KB

1.6

11.2

180 µm

SL4ZR

500 MHz

100 MHz

128 KB

1.1

5

180 µm

SL4PV

500 MHz

100 MHz

128 KB

1.6

11.2

180 µm

SL4JU

500 MHz

100 MHz

128 KB

1.6

11.2

180 µm

SL4JT

500 MHz

100 MHz

128 KB

1.6

11.2

180 µm

SL46Y

500 MHz

100 MHz

128 KB

11.2

180 µm

SL43Z

500 MHz

100 MHz

128 KB

1.35

7.9

180 µm

SL45A

500 MHz

100 MHz

128 KB

1.35

7.9

180 µm

SL3PC

500 MHz

100 MHz

128 KB

1.6

16.8

180 µm

SL43Q

500 MHz

100 MHz

128 KB

1.6

16.8

180 µm

SL43R

500 MHz

100 MHz

128 KB

1.6

16.8

180 µm

SL3PE

500 MHz

100 MHz

128 KB

1.6

16.8

180 µm

SL43U

450 MHz

100 MHz

128 KB

1.6

15.5

180 µm

SL43T

450 MHz

100 MHz

128 KB

1.6

15.5

180 µm

SL4JS

450 MHz

100 MHz

128 KB

1.6

15.5

180 µm

SL4PT

450 MHz

100 MHz

128 KB

1.6

15.5

180 µm

SL3PD

450 MHz

100 MHz

128 KB

1.6

15.5

180 µm

SL3PF

450 MHz

100 MHz

128 KB

1.6

15.5

180 µm

SL4JC

450 MHz

100 MHz

128 KB

1.6

15.5

180 µm

SL43W

400 MHz

100 MHz

128 KB

1.35

10.1

180 µm

SL3UL

400 MHz

100 MHz

128 KB

1.35

10.1

180 µm

SL4AB

667 MHz

66 MHz

128 KB

1.65

17.5

180 µm

SL3KD

466 MHz

66 MHz

128 KB

1.9

20.7

250 µm

SL3KC

466 MHz

66 MHz

128 KB

1.9

20.7

250 µm

SL3KB

433 MHz

66 MHz

128 KB

1.9

19.4

250 µm

SL3KA

433 MHz

66 MHz

128 KB

1.9

19.4

250 µm

SL3GQ

400 MHz

66 MHz

128 KB

1.6

13.8

250 µm

SL3GR

400 MHz

66 MHz

128 KB

1.6

13.8

250 µm

SL3C7

366 MHz

66 MHz

128 KB

1.6

13.1

250 µm

SL3HQ

366 MHz

66 MHz

128 KB

1.6

13.1

250 µm

SL3HP

300 MHz

66 MHz

128 KB

1.6

11.8

250 µm

SL3HN

300 MHz

66 MHz

128 KB

1.6

11.1

250 µm

SL3AH

300 MHz

66 MHz

128 KB

1.6

11.1

250 µm

SL3C8

300 MHz

66 MHz

128 KB

1.6

11.8

250 µm

SL3HM

266 MHz

66 MHz

128 KB

1.6

9.8

250 µm

SL3DQ

266 MHz

66 MHz

128 KB

1.5

9.8

250 µm

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

[nextpage title=”Mobile Celeron (Pentium 4)”]

Mobile Celeron models based on Pentium 4 have an external bus of 400 MHz (100 MHz transferring four data units by clock cycle, i.e., Quad Data Rate, a.k.a. QDR), 256 KB L2 cache and were manufactured with 0.13 µm (130 nm) technology. For a more detailed explanation on those CPUs microarchitecture, read out Inside Pentium 4 Architecture tutorial.

Their main characteristics are:

  • Based on Pentium 4 with Northwood core
  • Manufacturing technology: 0.13 µm
  • L1 Cache: 12k micro instructions (µops)
  • L2 Cache: 256 KB
  • External Clock: 400 MHz (100 MHz QDR)
  • Socket: 478
  • Maximum temperature: 100o C
  • Support for SSE2 instructions

In the table below we list all Mobile Celeron models based on Pentium 4 processors that were released.

sSpec

Internal Clock

Voltage (V)

TDP (W)

SL75J 2.4 GHz 1.3 35
SL73Y 2.2 GHz 1.3 35
SL6ZW 2.2 GHz 1.3 35
SL6VJ 2.0 GHz 1.3 32
SL6QH 2.0 GHz 1.3 32
SL6VH 1.8 GHz 1.3 30
SL6J4 1.8 GHz 1.3 30
SL6VG 1.7 GHz 1.3 30
SL6J3 1.7 GHz 1.3 30
SL6J2 1.6 GHz 1.3 30
SL6M5 1.5 GHz 1.3 30
SL6FN 1.5 GHz 1.3 30
SL6M4 1.4 GHz 1.3 30
SL6FM 1.4 GHz 1.3

30

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

[nextpage title=”Celeron M 300 Series”]

Celeron M 300 series models are based on Pentium M, but with only half L2 cache in comparison with this other CPU. Some models are based on Banias core, manufactured under 0.13 µm (130 nm) technology and with 512 KB L2 cache, while others are based on Dothan core, manufactured under 90 nm technology and with 1 MB or 512 KB L2 cache. All models work with a 400 MHz external bus (100 MHz transferring four data units per clock cycle, i.e., Quad Data Rate or QDR). To learn more about the architecture used by these CPUs, read our Inside Pentium M Architecture tutorial.

Main characteristics of Celeron M 300 series are:

  • Based on Pentium M with Banias (0.13 µm) or Dothan (90 nm) cores
  • Manufacturing technology: 0.13 µm (130 nm) or 90 nm
  • L1 Cache: 32 KB for instructions and 32 KB for data
  • L2 Cache: 512 KB or 1 MB
  • External Clock: 400 MHz (100 MHz QDR)
  • Packaging: micro-FCPGA or micro-FCBGA
  • Maximum temperature: 100o C
  • Support for SSE2 instructions

In the table below we list all Celeron M 300 series models that were released.

sSpec Model Internal Clock L2 Cache Tech. Voltage (V) TDP (W) Packaging
SL8MH 390 1.7 GHz 1 MB 90 nm 1.004 – 1.292 27 micro-FCBGA
SL8MP 390 1.7 GHz 1 MB 90 nm 1.25 – 1.4 27 micro-FCPGA
SL8MV 390 1.7 GHz 1 MB 90 nm 1.004 – 1.292 27 micro-FCBGA
SL8LV 383 1.0 GHz 1 MB 90 nm 0.876 – 0.956 5.5 micro-FCBGA
SL8MN 380 1.6 GHz 1 MB 90 nm 0.988 – 1.292 21 micro-FCPGA
SL8MG 380 1.6 GHz 1 MB 90 nm 1.004 – 1.292 21 micro-FCBGA
SL89S 373J 1.0 GHz 512 KB 90 nm 0.94 5.5 micro-FCBGA
SL8A4 373J 1.0 GHz 512 KB 90 nm 0.94 5.5 micro-FCBGA
SL8LW 373 1.0 GHz 512 KB 90 nm 5.5 micro-FCBGA
SL8LQ 373 1.0 GHz 512 KB 90 nm 0.876 – 0.956 5.5 micro-FCBGA
SL8MF 370 1.5 GHz 1 MB 90 nm 1.004 – 1.292 21 micro-FCBGA
SL8MM 370 1.5 GHz 1 MB 90 nm 0.988 – 1.292 21 micro-FCPGA
SL8MT 370 1.5 GHz 1 MB 90 nm 0.988 – 1.292 21 micro-FCBGA
SL86J 370 1.5 GHz 1 MB 90 nm 1.26 21 micro-FCPGA
SL86P 370 1.5 GHz 1 MB 90 nm 1.26 21 micro-FCBGA
SL86Q 360 1.4 GHz 1 MB 90 nm 1.26 21 micro-FCBGA
SL8ML 360 1.4 GHz 1 MB 90 nm 1.004 – 1.292 21 micro-FCPGA
SL86K 360 1.4 GHz 1 MB 90 nm 1.26 21 micro-FCPGA
SL7LS 360 1.4 GHz 1 MB 90 nm 1.26 21 micro-FCPGA
SL7LR 360 1.4 GHz 1 MB 90 nm 1.26 21 micro-FCBGA
SL7QX 353 900 MHz 512 KB 90 nm 5 micro-FCBGA
SL7F7 353 900 MHz 512 KB 90 nm 0.956 – 1.052 5 micro-FCBGA
SL8MK 350 1.3 GHz 1 MB 90 nm 1.3 21 micro-FCPGA
SL7R9 350 1.3 GHz 1 MB 90 nm 1.26 21 micro-FCBGA
SL7RA 350 1.3 GHz 1 MB 90 nm 1.26 21 micro-FCBGA
SL86L 350 1.3 GHz 1 MB 90 nm 1.26 21 micro-FCPGA
SL8MD 350 1.3 GHz 1 MB 90 nm 1.004 – 1.292 21 micro-FCBGA
SL7ME 340 1.5 GHz 512 KB 0.13 µm 0.956 – 1.052 24.5 micro-FCPGA
SL6N7 320 1.3 GHz 512 KB 0.13 µm 1.324 24.5 micro-FCPGA
SL8FM 320 1.3 GHz 512 KB 0.13 µm 24.5 micro-FCBGA
SL6NM 320 1.3 GHz 512 KB 0.13 µm 1.324 24.5 micro-FCBGA
SL79T 310 1.2 GHz 512 KB 0.13 µm 1.324 24.5 micro-FCBGA
SL79S 310 1.2 GHz 512 KB 0.13 µm 1.356 24.5 micro-FCPGA

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

[nextpage title=”Celeron M 400 Series”]

Celeron M 400 series processors are based on Core Solo (Yonah core), but with half L2 cache (compared to Core Solo) and no Enhanced Speedstep technology. It is a CPU based on Pentium M microarchitecture manufactured under 65 nm technology, with 1 MB L2 cache and 533 MHz external bus (133 MHz transferring four data units per clock cycle, i.e., Quad Data Rate or QDR).

Celeron M 400 series main characteristics are:

  • Based on Core Solo with Yonah core
  • Manufacturing technology: 65 nm
  • L1 Cache: 32 KB for instructions and 32 KB for data
  • L2 Cache: 1 MB
  • External clock: 533 MHz (133 MHz QDR)
  • Packaging: micro-FCPGA or micro-FCBGA
  • Maximum temperature: 100o C
  • Support for SSE3 instructions

In the table below we list all Celeron M 400 series models that were released.

sSpec

Model

Internal Clock

Voltage (V)

TDP (W)

Packaging
SL9KX 450 2.0 GHz 1.0 – 1.3 27 micro-FCPGA
SL9L8 443 1.2 GHz 0.95 – 0.975 5.5 micro-FCBGA
SL9KW 440 1.86 GHz 1.0 – 1.3 27 micro-FCPGA
SL9KV 430 1.73 GHz 1.0 – 1.3 27 micro-FCPGA
SL92F 430 1.73 GHz 1.0 – 1.3 27 micro-FCPGA
SL8XW 423 1.06 GHz 0.85 – 1.1 5.5 micro-FCBGA
SL8VZ 420 1.6 GHz 1.0 – 1.3 27 micro-FCPGA
SL8W2 410 1.46 GHz 1.0 – 1.3 27 micro-FCPGA

T
DP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

[nextpage title=”Mobile Celeron 500 Series”]

Mobile Celeron 500 series units are based on Core 2 Duo (Core architecture), but with only one processing core (Meron core), being manufactured under 65 nm technology, having 1 MB L2 cache and external clock rate of 533 MHz or 667 MHz (133 MHz or 166 MHz transferring four data units per clock cycle, respectively). If you want to learn more about the architecture used by these processors, check out our Inside Intel Core Microarchitecture tutorial.

Mobile Celeron 500 series main characteristics are:

  • Base on Core 2 Duo
  • Merom core
  • Only one processing core
  • Manufacturing technology: 65 nm
  • L1 Cache: 32 KB for instructions and 32 KB for data
  • L2 Cache: 1 MB
  • External clock: 533 MHz (133 MHz QDR) or 667 MHz (166 MHz QDR)
  • Packaging: micro-FCPGA
  • Maximum temperature: 100o C
  • Support for SSE3 instructions

In the table below we list all Mobile Celeron 500 series models that were released.

sSpec Model Internal Clock External Clock Voltage (V) TDP (W)
SLB6L 585 2.16 GHz 667 MHz 1.075 – 1.175 31
SLB6M 575 2.0 GHz 667 MHz 1.075 – 1.175 31
SLA2D 560 2.13 GHz 533 MHz 1.1 – 1.25 31
SLA2E 550 2.0 GHz 533 MHz 1.1 – 1.25 27
SLA2F 540 1.86 GHz 533 MHz 1.1 – 1.25 27 – 31
SL9VA 530 1.73 GHz 533 MHz 1.125 – 1.255 26
SLA2G 530 1.73 GHz 533 MHz 1.1 – 1.25 27
SLAHP 523 930 MHz 533 MHz 0.85 – 1.1 5.5
SL9WT 520 1.6 GHz 533 MHz 0.95 – 1.3 30
SL9WN 520 1.6 GHz 533 MHz 1.1 – 1.25 26

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

[nextpage title=”Mobile Celeron 700 Series”]

Mobile Celeron 700 series models are based on 45-nm Core 2 Duo (Core architecture), but with only one processing core. They are aimed to netbooks and low-power laptops, and have 1 MB L2 cache and external clock rate of 800 MHz (200 MHz transferring four data units per clock cycle). If you want to learn more about the architecture used by these processors, check out our Penryn Core New Features tutorial.

Mobile Celeron 700 series main characteristics are:

  • Base on Core 2 Duo
  • Penryn core
  • Only one processing core
  • Manufacturing technology: 45 nm
  • L1 Cache: 32 KB for instructions and 32 KB for data
  • L2 Cache: 1 MB
  • External clock: 800 MHz (200 MHz QDR)
  • Packaging: micro-FCBGA
  • Maximum temperature: 100o C
  • Support for SSE4.1 instructions

In the table below we list the only Mobile Celeron 700 series model launched so far.

sSpec

Model

Internal Clock

Voltage (V)

TDP (W)

SLGEV 743 1.3 GHz 10
SLGAM 723 1.2 GHz 1.05 – 1.15 10
SLGAS 723 1.2 GHz 1.05 – 1.15 10
SLGAN 722 1.2 GHz 0.775 – 1.1 5.5
SLGAT 722 1.2 GHz 0.775 – 1.1 5.5

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

[nextpage title=”Mobile Celeron 900 Series”]

Mobile Celeron 900 series processors are based on 45-nm Core 2 Duo (Core architecture), but with only one processing core. They have 1 MB L2 cache and external clock rate of 800 MHz (200 MHz transferring four data units per clock cycle). If you want to learn more about those processors architecture, check out our Penryn Core New Features tutorial.

Mobile Celeron series 900 main characteristics are:

  • Base on Core 2 Duo
  • Penryn core
  • Only one processing core
  • Manufacturing technology: 45 nm
  • L1 Cache: 32 KB for instructions and 32 KB for data
  • L2 Cache:
    1 MB
  • External clock: 800 MHz (200 MHz QDR)
  • Packaging: micro-FCPGA
  • Maximum temperature: 105o C
  • Support for SSE4.1 instructions

In the table below we list the only Mobile Celeron 900 series model launched so far.

sSpec

Model

Internal Clock

Voltage (V)

TDP (W)

SLGLQ 900 2.2 GHz 1.0 – 1.25 35

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

[nextpage title=”Mobile Celeron T1000 Series”]

Mobile Celeron T1000 series units are based on 65-nm Core 2 Duo, with two processing cores. If you want to learn more about the architecture used by these processors, check out our Inside Intel Core Microarchitecture tutorial.

Mobile Celeron T1000 series main characteristics are:

  • Base on Core 2 Duo
  • Meron core
  • Two processing cores
  • Manufacturing technology: 65 nm
  • L1 Cache: 32 KB for instructions and 32 KB for data
  • L2 Cache: 512 KB or 1 MB
  • External clock: 533 MHz (133 MHz QDR) ou 667 MHz (166 MHz QDR)
  • Packaging: micro-FCPGA
  • Maximum temperature: 100o C
  • Support for SSE3 instructions

In the table below we list all Mobile Celeron series T1000 models released to date.

sSpec Model Internal Clock External clock L2 Cache Voltage (V) TDP (W)
SLB6H T1700 1.83 GHz 667 MHz 1 MB 1.075 – 1.175 35
SLB6J T1600 1.66 GHz 667 MHz 1 MB 1.075 – 1.175 35
SLAQK T1500 1.86 GHz 533 MHz 512 KB 1.075 – 1.175 35
SLAQL T1400 1.73 GHz 533 MHz 512 KB 1.075 – 1.175 35

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

[nextpage title=”Mobile Celeron T3000 Series”]

Mobile Celeron T3000 series models are based on 45-nm Core 2 Duo (Core architecture) with two processing cores. They have 1 MB L2 cache and external clock rate of 800 MHz (200 MHz transferring four data units per clock cycle). If you want to learn more about the architecture used by these processors check out our Penryn Core New Features tutorial.

Mobile Celeron T3000 series main characteristics are:

  • Base on Core 2 Duo
  • Penryn core
  • Two processing cores
  • Manufacturing technology: 45 nm
  • L1 Cache: 32 KB for instructions and 32 KB for data
  • L2 Cache: 1 MB
  • External clock: 800 MHz (200 MHz QDR)
  • Packaging: micro-FCPGA or micro-FCBGA
  • Maximum temperature: 105o C
  • Support for SSE4.1 instructions

In the table below we list all Mobile Celeron T3000 series models released to date.

sSpec Model Internal Clock Voltage (V) TDP (W) Packaging
SLG92 T3300 2.0 GHz 35 micro-FCPGA
SLGJW T3300 2.0 GHz 35 micro-FCPGA
SLGEY T3100 1.9 GHz 1.0 – 1.25 35 micro-FCPGA
SLGVS T3100 1.9 GHz 1.0 – 1.25 35 micro-FCBGA
SLGMY T3000 1.8 GHz 1.0 – 1.25 35 micro-FCBGA

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

[nextpage title=”Mobile Celeron SU2000 Series”]

Mobile Celeron SU2000 series are low-TDP processors based on 45-nm Core 2 Duo with two processing cores. They have 1 MB L2 cache and external clock rate of 800 MHz (200 MHz transferring four data units per clock cycle). If you want to learn more about the architecture used by these processors, check out our Penryn Core New Features tutorial.

Mobile Celeron SU2000 series main characteristics are:

  • Based on Core 2 Duo
  • Penryn core
  • Two processing cores
  • Manufacturing technology: 45 nm
  • L1 Cache: 32 KB for instructions and 32 KB for data
  • L2 Cache: 1 MB
  • External clock: 800 MHz (200 MHz QDR)
  • Packaging: micro-FCBGA
  • Maximum temperature: 100o C
  • Support for SSE4.1 instructions

In the table below we list all Mobile Celeron SU2000 series models released to date.

sSpec Model Internal Clock Voltage (V) TDP (W)
SLGYW SU2300 1.2 GHz 1.05 – 1.15 10
SLGSB SU2300 1.2 GHz 1.05 – 1.15 10

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

[nextpage title=”Mobile Celeron U3000 Series”]

The Mobile Celeron U3000 series is based on the 32 nm Core i3, with two processing cores, but without support to Turbo Boost and Hyper-Threading thechnologies. It has a 2 MB L3 cache and DMI bus at 2 GB/s, besides integrated memory and video controllers. For more information about this architecture, read our Inside Intel Nehalem Microarchitecture tutorial.

The main characteristics of the Mobile Celeron U3000 series are:

  • Based on Core i3
  • Arrandale core
  • Two processing cores
  • Manufacturing technology: 32 nm
  • L1 Cache: 32 KB for instructions and 32 KB for data
  • L2 Cache: 256 KB per core
  • L3 Cache: 2 MB
  • DMI bus (2 GB/s)
  • Integrated PCI Express 2.0 controller (one x16 lane)
  • Integrated memory controller supporting up to 8 GB in dual-channel architecture
  • Support for DDR3 memories up to 800 MHz
  • Integrated Graphics Adapter, running at 500 MHz
  • Socket: BGA1288
  • Maximum temperature: 105 °C
  • SSE4.1 and SSE4.2 instruction sets

In the table below we list the Mobile Celeron U3000 series model released to date. TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

sSpec

Model

Internal Clock

Voltage (V)

TDP (W)

SLBUE U3400 1.06 GHz 18

[nextpage title=”Mobile Celeron P4000 Series”]

The Mobile Celeron P4000 series is based on the 32 nm Core i3, with two processing cores, but without support to Turbo Boost and Hyper-Threading thechnologies. It has a 2 MB L3 cache and DMI bus at 2 GB/s, besides integrated memory and video controllers. For more information about this architecture, read our Inside Intel Nehalem Microarchitecture tutorial.

The main characteristics of the Mobile Celeron P4000 series are:

  • Based on Core i3
  • Arrandale core
  • Two processing cores
  • Manufacturing technology: 32 nm
  • L1 Cache: 32 KB for instructions and 32 KB for data
  • L2 Cache: 256 KB per core
  • L3 Cache: 2 MB
  • DMI bus (2 GB/s)
  • Integrated PCI Express 2.0 controller (one x16 or two x8 lanes)
  • Integrated memory controller supporting up to 8 GB in dual-channel architecture
  • Support for DDR3 memories up to 1066 MHz
  • Integrated Graphics Adapter, running at 667 MHz
  • Socket: BPA988 or BGA1288
  • Maximum temperature: 90 °C
  • SSE4.1 and SSE4.2 instruction sets

In the table below we list the Mobile Celeron P4000 series models released to date. TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.

sSpec Model Internal Clock Voltage (V) TDP (W) Package
SLBQB P4505 1.86 GHz 35 1288
SLBNL P4500 1.86 GHz 35 988