All Mobile Celeron Models

Celeron M 300 Series

Celeron M 300 series models are based on Pentium M, but with only half L2 cache in comparison with this other CPU. Some models are based on Banias core, manufactured under 0.13 µm (130 nm) technology and with 512 KB L2 cache, while others are based on Dothan core, manufactured under 90 nm technology and with 1 MB or 512 KB L2 cache. All models work with a 400 MHz external bus (100 MHz transferring four data units per clock cycle, i.e., Quad Data Rate or QDR). To learn more about the architecture used by these CPUs, read our Inside Pentium M Architecture tutorial.

Main characteristics of Celeron M 300 series are:

• Based on Pentium M with Banias (0.13 µm) or Dothan (90 nm) cores
• Manufacturing technology: 0.13 µm (130 nm) or 90 nm
• L1 Cache: 32 KB for instructions and 32 KB for data
• L2 Cache: 512 KB or 1 MB
• External Clock: 400 MHz (100 MHz QDR)
• Packaging: micro-FCPGA or micro-FCBGA
• Maximum temperature: 100^o C
• Support for SSE2 instructions

In the table below we list all Celeron M 300 series models that were released.

TDP stands for Thermal Design Power and indicates the CPU thermal dissipation, i.e., the CPU cooler must be capable of dissipating at least this amount of heat.