All Sempron Models

ByMike S.

Socket AM2 Sempron

Contents

Contrary to socket 754 Sempron processors, which can only work under single channel configurarion, socket AM2 Sempron CPUs can use dual channel config, doubling the memory transfer rate if you use two or four memory modules in your PC. Keep in mind that socket 754 Sempron processors accept only DDR memories, while socket AM2 Sempron processors accept only DDR2 memories.

The main specifications for Sempron processors based on socket AM2 include:

  • 64 KB instruction L1 memory cache and 64 KB data L1 memory cache
  • 128 KB or 256 KB L2 memory cache
  • HyperTransport bus running at 800 MHz (3.2 GB/s). This clock may also be referred as “1,600 MHz.”
  • Memory controller supporting DDR2-400, DDR2-533 and DDR2-667 memories under dual channel configuration, meaning that the CPU accesses the memory 128 bits per time, if two or four memory modules are used.
  • SSE3 instruction set.
  • 64-bit instructions.
  • 90 nm or 65 nm manufacturing process.

Recently AMD started using a new numbering system for their processors. This new system is more complicated than the previous one and will only be adopted by new processors, i.e., processors that were already launched with the old numbering system won’t have their model number replaced, keeping the old naming.

This new numbering system uses a five-character format: XX-####, where XX are letters and #### are numbers. The two letters indicate the processor class, with the second letter indicating the CPU thermal dissipation (TDP). The first number after the dash indicates the processor series and informs the CPU features. The three last numbers indicate the position of the CPU within its series and class. The higher this number, the more features the CPU has – usually indicating a higher performance within its class and series.

In the table below we list all Sempron socket AM2 models released to date. TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e. the CPU cooler must be able to dissipate at least this amount of heat.

OPN (Tray) OPN (Box) Model Clock TDP L2 Cache Max. Temp. (°C) Voltage  Tech.
SDH1300IAA4DP SDH1300DPBOX LE-1300 2.3 GHz 45 W 512 KB 75 1.2 V / 1.30 V / 1.35 V 65 nm
SDH1250IAA4DP SDH1250DPBOX LE-1250 2.2 GHz 45 W 512 KB 75 1.2 V / 1.45 V / 1.40 V 65 nm
SDH1200IAA4DE SDH1200DPBOX LE-1200 2.1 GHz 45 W 512 KB 65 1.2 V / 1.45 V / 1.40 V 65 nm

SDH1150IAA3DE

SDH1150DEBOX

LE-1150

2.0 GHz

45 W

256 KB

 75 1.2 V / 1.45 V / 1.40 V

65 nm
SDH1100IAA3DE SDH1100DPBOX LE-1100 1.9 GHz 45 W 256 KB 65 1.2 V / 1.45 V / 1.40 V 65 nm
SDA3800IAA3CN SDA3800CNBOX 3800+ 2.2 GHz 62 W 256 KB 55-69 1.25 / 1.35 / 1.40 V 90 nm
SDA3600IAA3CN SDA3600CNBOX 3600+ 2.0 GHz 62 W 256 KB 55-69 1.25 / 1.35 / 1.40 V 90 nm
SDA3500IAA2CN SDA3500CNBOX 3500+ 2.0 GHz 62 W 128 KB 55-69 1.25 / 1.35 / 1.40 V 90 nm
SDD3500IAA2CN SDD3500CBNOX 3500+ 2.0 GHz 35 W 128 KB 78 1.20 / 1.25 V 90 nm
SDA3400IAA3CN SDA3400CNBOX 3400+ 1.8 GHz 62 W 256 KB 55-69 1.25 / 1.35 / 1.40 V 90 nm
SDA3400IAA3CW SDA3400CWBOX 3400+ 1.8 GHz 62 W 256 KB 55-69 1.35 / 1.40 V 90 nm
SDD3400IAA3CN SDD3400CBNOX 3400+ 1.8 GHz 35 W 256 KB 78 1.20 / 1.25 V 90 nm
SDA3200IAA2CN SDA3200CNBOX 3200+ 1.8 GHz 62 W 128 KB 55-69 1.25 / 1.35 / 1.40 V 90 nm
SDD3200IAA2CN SDD3200CNBOX 3200+ 1.8 GHz 35 W 128 KB 78 1.20 / 1.25 V 90 nm
SDA3200IAA2CW SDA3200CWBOX 3200+ 1.8 GHz 62 W 128 KB 55-69 1.35 / 1.40 V 90 nm
SDA3000IAA3CN SDA3000CNBOX 3000+ 1.6 GHz 62 W 256 KB 55-69 1.25 / 1.35 / 1.40 V 90 nm
SDD3000IAA3CN SDD3000CNBOX 3000+ 1.6 GHz 35 W 256 KB 78 1.20 / 1.25V 90 nm
SDA2800IAA2CN SDA2800CNBOX 2800+ 1.6 GHz 62 W 128 KB 55-69 1.25 / 1.35 / 1.40 V 90 nm

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