• Skip to primary navigation
  • Skip to main content
  • Skip to primary sidebar
  • Skip to footer
Hardware Secrets

Hardware Secrets

Uncomplicating the complicated

  • Case
  • Cooling
  • Memory
  • Mobile
    • Laptops
    • Smartphones
    • Tablets
  • Motherboard
  • Networking
  • Other
    • Audio
    • Cameras
    • Consumer Electronics
    • Desktops
    • Museum
    • Software
    • Tradeshows & Events
  • Peripherals
    • Headset
    • Keyboard
    • Mouse
    • Printers
  • Power
  • Storage
Home » All Sempron Models

All Sempron Models

[nextpage title=”Introduction”]

Sempron is an AMD CPU targeted to the entry-level market, i.e., to users that don’t need a high processing power and are more worried with price than performance. Sempron main competitor is Celeron  from Intel and you can read our tutorial Sempron vs. Celeron D for a technical comparison between these two CPUs.

Sempron is available with five socket types: 462, 754, AM2, AM3 and S1 (this one for laptops only). Sempron processors based on socket 462 are simpler versions of Athlon XP, while Sempron processors based on socket 754, socket AM2 and socket S1 are simpler versions of Athlon 64. AM3 versions derive from Athlon II X2 processor, but with only one processing core.

Watch out: since socket-462 Sempron processors use a totally different architecture from other Sempron processors, it is not possible to compare them directly.

The “PR” (Performance Rating) system used by Sempron can only be used to compare models using the same socket type. It is not possible to compare Sempron’s PR rating with Athlon XP’s or Athlon 64’s. For example, a Sempron 3000+ isn’t necessarily faster than an Athlon XP 2800+ or than an Athlon 64 2800+. By the same token a socket-462 Sempron 3000+ isn’t necessarily faster than a socket-754 Sempron 2800+. As we said, we can only use this naming scheme to compare Sempron models based on the same socket. We can say for sure, for example, that a socket-754 Sempron 3000+ is faster than a Sempron 2800+ also based on socket 754.

Let’s talk now about the features of each Sempron line (socket 462, socket 754, socket AM2, socket AM3 and socket S1), where we listed all Sempron models released to date.

[nextpage title=”Socket 462 Sempron”]

Sempron processors based on socket 462 are, in fact, Athlon XP processors with a 333 MHz external bus (166 MHz transferring two data per clock cycle) and 256 KB of L2 memory cache (or 512 KB on 3000+ model). Click here for a full comparison between socket-462 Sempron and Athlon XP.

This Sempron line has the same features of Athlon XP processors, like:

  • 64 KB instruction L1 memory cache and 64 KB data L1 memory cache.
  • 256 KB or 512 KB L2 memory cache.
  • Support for MMX, 3DNow!, SSE and SSE2 instructions (no SSE3).
  • 130 nm manufacturing process.

In the table below we list all Sempron socket 462 models released to date. TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e. the CPU cooler must be able to dissipate at least this amount of heat.

OPN (Tray) OPN (Box) Model Clock TDP L2 Cache Max. Temp. (º C) Voltage
SDA3000DUT4D SDA3000BOX 3000+ 2 GHz 62 W 512 KB 90 1.6 V
SDC2800DUT3D SDC2800BOX 2800+ 2 GHz 62 W 256 KB 90 1.6 V
SDA2800DUT3D SDA2800BOX 2800+ 2 GHz 62 W 256 KB 90 1.6 V
SDA2600DUT3D SDA2600BOX 2600+ 1.833 GHz 62 W 256 KB 90 1.6 V
SDA2500DUT3D SDA2500BOX 2500+ 1.75 GHz 62 W 256 KB 90 1.6 V
SDC2400DUT3D SDC2400BOX 2400+ 1.667 GHz 62 W 256 KB 90 1.6 V
SDA2400DUT3D SDA2400BOX 2400+ 1.667 GHz 62 W 256 KB 90 1.6 V
SDA2300DUT3D SDA2300BOX 2300+ 1.583 GHz 62 W 256 KB 90 1.6 V
SDC2200DUT3D SDC2200BOX 2200+ 1.5 GHz 62 W 256 KB 90 1.6 V
SDA2200DUT3D SDA2200BOX 2200+ 1.5 GHz 62 W 256 KB 90 1.6 V

[nextpage title=”Socket 754 Sempron”]

Sempron processors based on socket 754 are in fact Athlon 64 processors with less L2 memory cache and without the 64-bit extensions. However, Sempron models launched recently are coming with 64-bit technology support.

The main specifications for Sempron processors based on socket 754 include:

  • 64 KB instruction L1 memory cache and 64 KB data L1 memory cache
  • 128 KB or 256 KB L2 memory cache
  • HyperTransport bus running at 800 MHz (3.2 GB/s). This clock may also be referred as “1,600 MHz”.
  • DDR single channel memory configuration.
  • SSE3 instruction set on models that have the 64-bit extensions enabled.
  • 90 nm manufacturing process.

In the table below we list all Sempron socket 754 models released to date. TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e. the CPU cooler must be able to dissipate at least this amount of heat.

OPN (Tray) OPN (Box) Model Clock TDP 64-bit SSE3 L2 Cache Max. Temp. (º C) Voltage
SDA3400AIO3BX SDA3400BXBOX 3400+ 2 GHz 62 W Yes Yes 256 KB 69 1.4 V
SDA3300AIO2BO SDA3300BOBOX 3300+ 2 GHz 62 W Yes Yes 128 KB 69 1.4 V
SDA3300AIO2BX SDA3300BXBOX 3300+ 2 GHz 62 W Yes Yes 128 KB 69 1.4 V
SDA3300AIO2BA SDA3300BABOX 3300+ 2 GHz 62 W No No 128 KB 70 1.4 V
SDA3300AIO2BA SDA3300CVBOX 3300+ 2 GHz 62 W No No 128 KB 70 1.4 V
SDA3100AIO3BA SDA3100CVBOX 3100+ 1.8 GHz 62 W No No 256 KB 70 1.4 V
SDA3100AIP3AX SDA3100AXBOX 3100+ 1.8 GHz 62 W No No 256 KB 70 1.4 V
SDA3100AIO3BA SDA3100BABOX 3100+ 1.8 GHz 62 W No No 256 KB 70 1.4 V
SDA3100AIO3BO SDA3100BOBOX 3100+ 1.8 GHz 62 W Yes Yes 256 KB 69 1.4 V
SDA3100AIO3BX SDA3100BXBOX 3100+ 1.8 GHz 62 W Yes Yes 256 KB 69 1.4 V
SDA3000AIO2BA SDA3000CVBOX 3000+ 1.8 GHz 62 W No No 128 KB 70 1.4 V
SDA3000AIO2BO SDA3000BOBOX 3000+ 1.8 GHz 62 W Yes Yes 128 KB 69 1.4 V
SDA3000AIO2BX SDA3000BXBOX 3000+ 1.8 GHz 62 W Yes Yes 128 KB 69 1.4 V
SDA3000AIP2AX SDA3000AXBOX 3000+ 1.8 GHz 62 W No No 128 KB 70 1.4 V
SDA3000AIO2BA SDA3000BABOX 3000+ 1.8 GHz 62 W No No 128 KB 70 1.4 V
SDA2800AIO3BA SDA2800BABOX

2800+ 1.6 GHz 62 W No No 256 KB 70 1.4 V
SDA2800AIO3BA SDA2800CVBOX 2800+ 1.6 GHz 62 W No No 256 KB 70 1.4 V
SDA2800AIO3BO SDA2800BOBOX 2800+ 1.6 GHz 62 W Yes Yes 256 KB 69 1.4 V
SDA2800AIO3BX SDA2800BXBOX 2800+ 1.6 GHz 62 W Yes Yes 256 KB 69 1.4 V
SDA2600AIO2BA SDA2600BABOX 2600+ 1.6 GHz 62 W No No 128 KB 70 1.4 V
SDA2600AIO2BA SDA2600CVBOX 2600+ 1.6 GHz 62 W No No 128 KB 70 1.4 V
SDA2600AIO2BX SDA2600BXBOX 2600+ 1.6 GHz 62 W Yes Yes 128 KB 69 1.4 V
SDA2600AIO2BO SDA2600BOBOX 2600+ 1.6 GHz 62 W Yes Yes 128 KB 69 1.4 V
SDA2500AIO3BX SDA2500BXBOX 2500+ 1.4 GHz 62 W Yes Yes 256 KB 69 1.4 V

[nextpage title=”Socket AM2 Sempron”]

Contrary to socket 754 Sempron processors, which can only work under single channel configurarion, socket AM2 Sempron CPUs can use dual channel config, doubling the memory transfer rate if you use two or four memory modules in your PC. Keep in mind that socket 754 Sempron processors accept only DDR memories, while socket AM2 Sempron processors accept only DDR2 memories.

The main specifications for Sempron processors based on socket AM2 include:

  • 64 KB instruction L1 memory cache and 64 KB data L1 memory cache
  • 128 KB or 256 KB L2 memory cache
  • HyperTransport bus running at 800 MHz (3.2 GB/s). This clock may also be referred as “1,600 MHz.”
  • Memory controller supporting DDR2-400, DDR2-533 and DDR2-667 memories under dual channel configuration, meaning that the CPU accesses the memory 128 bits per time, if two or four memory modules are used.
  • SSE3 instruction set.
  • 64-bit instructions.
  • 90 nm or 65 nm manufacturing process.

Recently AMD started using a new numbering system for their processors. This new system is more complicated than the previous one and will only be adopted by new processors, i.e., processors that were already launched with the old numbering system won’t have their model number replaced, keeping the old naming.

This new numbering system uses a five-character format: XX-####, where XX are letters and #### are numbers. The two letters indicate the processor class, with the second letter indicating the CPU thermal dissipation (TDP). The first number after the dash indicates the processor series and informs the CPU features. The three last numbers indicate the position of the CPU within its series and class. The higher this number, the more features the CPU has – usually indicating a higher performance within its class and series.

In the table below we list all Sempron socket AM2 models released to date. TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e. the CPU cooler must be able to dissipate at least this amount of heat.

OPN (Tray) OPN (Box) Model Clock TDP L2 Cache Max. Temp. (°C) Voltage  Tech.
SDH1300IAA4DP SDH1300DPBOX LE-1300 2.3 GHz 45 W 512 KB 75 1.2 V / 1.30 V / 1.35 V 65 nm
SDH1250IAA4DP SDH1250DPBOX LE-1250 2.2 GHz 45 W 512 KB 75 1.2 V / 1.45 V / 1.40 V 65 nm
SDH1200IAA4DE SDH1200DPBOX LE-1200 2.1 GHz 45 W 512 KB 65 1.2 V / 1.45 V / 1.40 V 65 nm

SDH1150IAA3DE

SDH1150DEBOX

LE-1150

2.0 GHz

45 W

256 KB

75 1.2 V / 1.45 V / 1.40 V

65 nm

SDH1100IAA3DE SDH1100DPBOX LE-1100 1.9 GHz 45 W 256 KB 65 1.2 V / 1.45 V / 1.40 V 65 nm
SDA3800IAA3CN SDA3800CNBOX 3800+ 2.2 GHz 62 W 256 KB 55-69 1.25 / 1.35 / 1.40 V 90 nm
SDA3600IAA3CN SDA3600CNBOX 3600+ 2.0 GHz 62 W 256 KB 55-69 1.25 / 1.35 / 1.40 V 90 nm
SDA3500IAA2CN SDA3500CNBOX 3500+ 2.0 GHz 62 W 128 KB 55-69 1.25 / 1.35 / 1.40 V 90 nm
SDD3500IAA2CN SDD3500CBNOX 3500+ 2.0 GHz 35 W 128 KB 78 1.20 / 1.25 V 90 nm
SDA3400IAA3CN SDA3400CNBOX 3400+ 1.8 GHz 62 W 256 KB 55-69 1.25 / 1.35 / 1.40 V 90 nm
SDA3400IAA3CW SDA3400CWBOX 3400+ 1.8 GHz 62 W 256 KB 55-69 1.35 / 1.40 V 90 nm
SDD3400IAA3CN SDD3400CBNOX 3400+ 1.8 GHz 35 W 256 KB 78 1.20 / 1.25 V 90 nm
SDA3200IAA2CN SDA3200CNBOX 3200+ 1.8 GHz 62 W 128 KB 55-69 1.25 / 1.35 / 1.40 V 90 nm
SDD3200IAA2CN SDD3200CNBOX 3200+ 1.8 GHz 35 W 128 KB 78 1.20 / 1.25 V 90 nm
SDA3200IAA2CW SDA3200CWBOX 3200+ 1.8 GHz 62 W 128 KB 55-69 1.35 / 1.40 V 90 nm
SDA3000IAA3CN SDA3000CNBOX 3000+ 1.6 GHz 62 W 256 KB 55-69 1.25 / 1.35 / 1.40 V 90 nm
SDD3000IAA3CN SDD3000CNBOX 3000+ 1.6 GHz 35 W 256 KB 78 1.20 / 1.25V 90 nm
SDA2800IAA2CN SDA2800CNBOX 2800+ 1.6 GHz 62 W 128 KB 55-69 1.25 / 1.35 / 1.40 V 90 nm

[nextpage title=”Socket AM3 Sempron”]

Like socket AM2 versions, AM3 Sempron CPU is compatible with dual channel memory architecture, doubling the memory transfer rate as long as you use an even number of memory modules on your computer. Socket AM2 and AM2+ CPUs work only with DDR2 memories, but socket AM3 processors can work with both DDR2 and DDR3 memories, depending on which kind of motherboard you install them (socket AM2+ or socket AM3, respectively). This way these processors are also compatible with socket AM2+ motherboards and even with some socket AM2 ones.

Socket AM3 Sempron main features are:

  • 64 KB L1 instruction cache and 64 KB L1 data cache.
  • 1 MB L2 memory cache.
  • One processing core.
  • HyperTransport bus running at 2 GHz MHz (8 GB/s). This clock may also be referred as “4,000 MHz.”
  • Memory controller supporting DDR2 memories when installed on socket AM2+ motherboards or DDR3 when installed on socket AM3 boards.
  • SSE4a instruction set.
  • 64-bit instructions.
  • 45 nm manufacturing process.

In the table below we list the only Sempron socket AM3 model released to date. TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e. the CPU cooler must be able to dissipate at least this amount of heat.

OPN (Tray) OPN (Box) Model Clock TDP L2 Cache Max. Temp. (°C) Voltage

Techn.

SDX140HBK13GQ SDX140HBGQBOX 140 2.7 GHz 45 W 1 MB 65 – 45 nm

[nextpage title=”Sempron For Laptops”]

Besides Turion 64 and Athlon 64 Mobile, AMD also has launched Sempron models targeted to the mobile market, which are based on the socket AM2 version of Sempron.

The main specifications for Sempron processors targeted to laptops include:

  • Socket S1 (the same socket used by Turion 64 X2) 
  • 64 KB instruction L1 memory cache and 64 KB data L1 memory cache
  • 256 KB or 512 KB L2 memory cache
  • HyperTransport bus running at 800 MHz (3.2 GB/s). This clock may also be referred as “1,600 MHz”.
  • Memory controller supporting DDR2-400, DDR2-533 and DDR2-667 memories under dual channel configuration, meaning that the CPU accesses the memory 128 bits per time, if two or four memory modules are used.
  • SSE3 instruction set.
  • 64-bit instructions.
  • 90 nm or 65 nm manufacturing process.
  • PowerNow technology.
  • Enhanced Virus Protection technology.

In the table below we list all Sempron socket S1 models released to date. TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e. the CPU cooler must be able to dissipate at least this amount of heat. 

OPN Model Clock TDP L2 Cache

Tech.

SMD4000HAX4DN 4000+ 2.2 GHz 31 W 512 KB

65 nm

SMD3800HAX3CM 3800+ 2.2 GHz 31 W 256 KB

90 nm

SMD3800HAX3DN 3800+ 2.2 GHz 31 W 256 KB

65 nm

SMS3600HAX3CM 3600+ 2.0 GHz 25 W 256 KB

90 nm

SMS3600HAX3DN 3600+ 2.0 GHz 25 W 256 KB

65 nm

SMS3500HAX4CM 3500+ 1.8 GHz 25 W 512 KB

90 nm

SMS3400HAX3CM 3400+ 1.8 GHz 25 W 256 KB

90 nm

SMS3200HAX4CM 3200+ 1.6 GHz 25 W 512 KB

90 nm

SMSI40SAM12GG SI-40 2.0 GHz 25 W 512 KB 65 nm
SMG210UOAX3DX 210U 1.5 GHz 15 W 256 KB 65 nm
SMF200UOAX3DV 200U 1.0 GHz 8 W 256 KB 65 nm

Reader Interactions

Leave a Reply Cancel reply

Your email address will not be published. Required fields are marked *

Primary Sidebar

As a participant in the Amazon Services LLC Associates Program, this site may earn from qualifying purchases. We may also earn commissions on purchases from other retail websites.

car service

Why Is Fleet Maintenance Important?

If you have a fleet of vehicles you use within your business, it’s crucial you keep up with their

Playing Fifa on Play station 4

Tips for Recycling Your Gaming Consoles and Devices

These days, it seems like almost everybody is gaming. As great as this is, it’s also creating a

Business planning

How to Develop Your Venture Capital Business

Venture Capital (VC) is a type of private equity investment in which investors provide funding to

Footer

For Performance

  • PCI Express 3.0 vs. 2.0: Is There a Gaming Performance Gain?
  • Does dual-channel memory make difference on integrated video performance?
  • Overclocking Pros and Cons
  • All Core i7 Models
  • Understanding RAM Timings

Everything you need to know

  • Everything You Need to Know About the Dual-, Triple-, and Quad-Channel Memory Architectures
  • What You Should Know About the SPDIF Connection (2022 Guide)
  • Everything You Need to Know About the Intel Virtualization Technology
  • Everything You Need to Know About the CPU Power Management

Copyright © 2023 · All rights reserved - Hardwaresecrets.com
About Us · Privacy Policy · Contact