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[nextpage title=”Introduction”]

Core Duo (formerly known by its codename, Yonah) was the first dual-core Intel CPU targeted to the mobile market, i.e., inside it there are two complete CPUs. Curiously it was also the first Intel processor to be adopted by Apple Computer. In this tutorial we will present the main features of Core Duo and Core Solo and tables with all models released to date.

Watch out to not confuse Core Duo with Core 2 Duo. Core Duo is the commercial name for the Pentium M processor with two processing cores and manufactured under 65 nm process. Core 2 Duo on the other hand is the commercial name for the processor codenamed Merom (for laptops) or Conroe (for desktops), using the new Core microarchitecture, which is the same microarchitecture used by Pentium M but with more features added.

Core Duo is, in fact, a Pentium M with two cores and manufactured using 65-nm process (currently Pentium M is manufactured using 90 nm process). For an in-depth understanding of Core Duo, we suggest you to read our tutorials Intel Dual Core Technology and Inside Pentium M Architecture. Our tutorial All Pentium M Models is also a good read if you wish to compare Core Duo to Pentium M. And if you are interested in the internal architecture used by Core Duo, read our Inside Pentium M Architecture tutorial.

Even though it has two CPU cores inside the same package, Core Duo die size is almost the same of Pentium M’s (Dothan die). This means that the cost for manufacturing Core Duo is practically the same of Pentium M, which has just one core. Core Duo has 151.6 million transistors occupying an area of 90.3 mm2 (0.14 sq inch) while Pentium M based on Dothan die has 140 million transistors on an 87.66 mm2 (0.135 sq inch) area. Keep in mind that Core Duo is manufactured under 65-nm process while Pentium M is manufactured under 90 nm one.

Core DuoFigure 1: Core Duo die.

Core Duo’s L2 memory cache is of 2 MB shared between its cores (Intel calls this shared L2 implementation “Smart Cache”). On Pentium D 840, for instance, which is a dual-core CPU, its 2 MB L2 memory cache is split between the cores, so each core has access to only 1 MB each. I.e. on Pentium D there are two 1 MB L2 memory caches, one per core. On Core Duo there is only one 2 MB L2 memory cache, which is shared between the two cores. Core 2 Duo, by the way, uses this same architecture that was introduced with Core Duo.

With a shared memory cache, the amount of memory cache that each core uses isn’t fixed. With a 2 MB L2 memory cache one core may be using 1.5 MB and the other 512 KB (0.5 MB) at a given moment, for example. If on a dual-core CPU with separated L2 memory cache one of the cores run out of cache (i.e., its 1 MB is being fully used) it needs to go directly to the slow RAM memory to fetch the required data, slowing down the system performance. On CPUs with shared L2 memory cache, each core can simply resize the amount of L2 memory cache it is using.

Another advantage of shared L2 memory cache is that if one core fetched a data (or a instruction) and stored it on the L2 cache, the other core can use this same piece of information. In dual-core CPUs with separated memory caches the second core would have to grab this data (or instruction) through the CPU local bus, i.e., “from outside,” using the local bus clock, which is far inferior than the processor internal clock, thus slowing down the system performance.

Core Duo main features are the following:

  • Dual-core technology
  • Code-name: Yonah
  • 151.6 million transistors occupying an area of 90.3 mm2 (0.14 sq inch)
  • 32 KB L1 instruction cache and 32 KB data L1 cache
  • 2 MB L2 memory cache shared between the two cores
  • Socket 478 or 479
  • 65 nm manufacturing process
  • 667 MHz (166 MHz transferring four data per clock cycle) or 533 MHz (133 MHz transferring four data per clock cycle) external bus.
  • Virtualization Technology
  • Execute Disable Technology
  • Enhanced SpeedStep Technology
  • SSE3 instruction set support

Core Sole is a Core Duo version with just one processing core. It keeps all other Core Duo technical specs, like 2 MB memory cache, 65 nm manufacturing process, virtualization technology, Execute Disable technology, Enhanced SpeedStep technology, SSE3 instruction set and 533- or 667 MHz external bus.

Core Duo and Core Solo are components from the Centrino platform. For complete details on the Centrino platform read our tutorial Everything You Need To Know About The Centrino Platform.

[nextpage title=”Core Duo Models”]

In the table below you will find all Core Duo models released so far. As you can see, the thermal dissipation (TDP, Thermal Design Power) of the models starting with a “T” if of 31 W, the thermal dissipation of the models starting with an “L” is of 15 W and the thermal dissipation of the models starting with a "U" is of only 9 W.

Just put Core Duo spec in perspective, Turion 64 ML-44 model, which this the AMD CPU targeted to the mobile market having just one core, has a TDP of 35 W.

Model sSpec Internal Clock External Clock TDP Voltage Max. Temp. (° C)
T2700 SL9JP 2.33 GHz 667 MHz 31 W 1.1625V – 1.30V 100
T2700 SL9K4 2.33 GHz 667 MHz 31 W 100
T2600 SL9JN 2.16 GHz 667 MHz 31 W 1.1625V – 1.30V 100
T2600 SL8VN 2.16 GHz 667 MHz 31 W 1.25V – 1.4V 100
T2600 SL8VS 2.16 GHz 667 MHz 31 W 100
T2600 SL9K3 2.16 GHz 667 MHz 31 W 1.1625V – 1.30V 100
T2500 SL9K2 2 GHz 667 MHz 31 W 1.1625V – 1.30V 100
T2500 SL9EH 2 GHz 667 MHz 31 W 1.1625V – 1.30V 100
T2500 SL8VT 2 GHz 667 MHz 31 W 1.1625V – 1.30V 100
T2500 SL8VP 2 GHz 667 MHz 31 W 1.1625V – 1.30V 100
T2450 SLA4M 2 GHz 533 MHz 31 W 100
T2350 SL9JK 1.86 GHz 533 MHz
31 W
100
T2400 SL8VU 1.83 GHz 667 MHz 31 W 100
T2400 SL9JM 1.83 GHz 667 MHz 31 W 1.1625V – 1.30V 100
T2400 SL9JZ 1.83 GHz 667 MHz 31 W 1.1625V – 1.30V 100
L2500 SL9JU 1.83 GHz 667 MHz 15 W 0.950V-1.175V 100
T2400 SL8VQ 1.83 GHz 667 MHz 31 W 1.25V – 1.4V 100
T2250 SL9DV 1.73 GHz 533 MHz 31 W 100
L2400 SL8VW 1.66 GHz 667 MHz 15 W 0.950V-1.175V 100
T2300 SL8VV 1.66 GHz 667 MHz 31 W 100
T2300 SL8VR 1.66 GHz 667 MHz 31 W 1.25V – 1.4V 100
T2300E SL9DM 1.66 GHz 667 MHz 31 W 1.1625V – 1.30V 100
T2300E SL9DN 1.66 GHz 667 MHz 31 W 1.1625V – 1.30V 100
T2300E SL9JE 1.66 GHz 667 MHz 31 W 1.1625V – 1.30V 100
L2400 SL9JT 1.66 GHz 667 MHz 15 W 0.950V-1.175V 100
T2300 SL9JL 1.66 GHz 667 MHz 31 W 100
T2050 SL9BN 1.6 GHz 533 MHz 31 W 100
L2300 SL9JS 1.50 GHz 667 MHz 15 W 0.950V-1.175V 100
L2300 SL8VX 1.50 GHz 667 MHz 15 W 0.950V-1.175V 100
U2500 SL99V 1.20 GHz 533 MHz 9 W 0.9375V-1.175V 100
U2400 SL99W 1.06 GHz 533 MHz 9 W 0.9375V-1.175V 100

[nextpage title=”Core Solo Models”]

Core Sole is a Core Duo version with just one processing core. It keeps all other Core Duo technical specs, like 2 MB memory cache, 65 nm manufacturing process, virtualization technology, Execute Disable technology, Enhanced SpeedStep technology, SSE3 instruction set and 533- or 667 MHz external bus.

In the table below you will find all Core Solo models released so far. As you can see, the thermal dissipation (TDP, Thermal Design Power) of the models starting with a “T” if of 31 W, while the thermal dissipation of the models starting with a “U” is only 5.5 W.

Model sSpec Internal Clock External Clock TDP Voltage Max. Temp. (° C)
T1400 SL92X 1.83 GHz 667 MHz 31 W 1.1625V – 1.30V 100
T1400 SL92V 1.83 GHz 667 MHz 31 W 1.1625V – 1.30V 100
T1400 SL9L5 1.83 GHz 667 MHz 31 W 100
T1350 SL99T 1.86 GHz 533 MHz 31 W 100
T1300 SL8W3 1.66 GHz 667 MHz 31 W 100
T1300 SL8VY 1.66 GHz 667 MHz 31 W 1.25V-1.4V 100
T1300 SL9L4 1.66 GHz 667 MHz 31 W 100
U1500 SL9LC 1.33 GHz 533 MHz 5.5 W 0.950 V – 0.975 V 100
U1400 SL8W6 1.20 GHz 533 MHz 5.5 W 0.950 V – 0.975 V 100
U1300 SL8W7 1.06 GHz 533 MHz 5.5 W 0.950 V – 0.975 V 100