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Home » All Core i7 Models

All Core i7 Models

The Core i7 is a CPU series manufactured by Intel aimed at high-range computers. In this tutorial, we will present a series of quick reference tables for you to compare the main differences between all models released to date.

By the way, the correct name of this line of processors is “Core i7,” not “Intel i7.”

Currently, there are four different generations of Core i7 processors available. In the tables below, we describe the main differences between these generations and the model series within each generation.

Model8xx9xx6xx7xx8xx and 9xx
MarketDesktopDesktopMobileMobileMobile
GenerationFirstFirstFirstFirstFirst
MicroarchitectureNehalemNehalemNehalemNehalemNehalem
Manufacturing Process45 nm45 nm or 32 nm32 nm45 nm45 nm
Number of Cores44 or 6244
Hyper-ThreadingYesYesYesYesYes
L1 cache (per core)32 kiB+32 kiB32 kiB+32 kiB32 kiB+32kB32 kiB+32 kiB32 kiB+32 kiB
L2 cache (per core)256 kiB256 kiB256 kiB256 kiB256 kiB
L3 cache (total)8 MiB8 MiB or 12 MiB4 MiB6 MiB8 MiB
DMI bus1 GB/sNo1 GB/s1 GB/s1 GB/s
Memory (DDR3)1066, 13331066800, 1066†1066, 1333 1066, 1333
Memory Channels23222
DDR3L and DDR3L-RSNoNoNoNoNo
Graphics EngineNoNoHD GraphicsNoNo
DirectXNoNo10NoNo
Graphics ProcessorsNoNo6NoNo
Graphics Base ClockNoNo166, 266 or 500 MHzNoNo
Graphics Boost ClockNoNo500, 566 or 766 MHzNoNo
Displays SupportedNoneNone2NoneNone
PCIe Controller2.0No2.02.02.0
PCIe Configuration1×16, 2×8NA1×161×161×16
Turbo Boost1.01.01.01.01.0
EM64TYesYesYesYesYes
VirtualizationYesYesYesYesYes
SSE4.2YesYesYesYesYes
AES-NINoOn 32 nm modelsYesNoNo
AVXNoNoNoNoNo
AVX2NoNoNoNoNo
Base Clock133 MHz133 MHz133 MHz133 MHz133 MHz
PinoutLGA1156LGA1366G1 or BGA1288G1G1

† Except for “UM” and “UE” models, which only support DDR3-800 memory.

Model2xxx38xx39xx2xxx
MarketDesktopDesktopDesktopMobile
GenerationSecondSecondSecondSecond
MicroarchitectureSandy BridgeSandy BridgeSandy BridgeSandy Bridge
Manufacturing Process32 nm32 nm32 nm32 nm
Number of Cores4462 or 4
Hyper-ThreadingYesYesYesYes
L1 cache (per core)32 kiB+32 kiB32 kiB+32 kiB32 kiB+32 kiB32 kiB+32kB
L2 cache (per core)256 kiB256 kiB256 kiB256 kiB
L3 cache (total)8 MiB10 MiB12 MiB or 15 MiB4 MiB, 6 MiB or 8 MiB
DMI bus2 GB/s2 GB/22 GB/s2 GB/s
Memory (DDR3)1066, 13331066, 1333, 16001066, 1333, 16001066, 1333, 1600 
Memory Channels2442
DDR3L and DDR3L-RSNoNoNoNo
Graphics EngineHD 2000 or HD 3000NoNoHD 3000
DirectX10.1NoNo10.1
Graphics Processors6 or 12NoNo12
Graphics Base Clock850 MHzNoNo350, 500 or 650 MHz
Graphics Boost Clock1.35 GHzNoNo950 MHz, 1 GHz, 1.1 GHz, 1.2 GHz or 1.3 GHz
Displays Supported2NoNone2
PCIe Controller2.03.03.02.0
PCIe Configuration1×16, 2×840 lanes‡40 lanes‡1×16, 2×8, 1×8, 2×4
Turbo Boost2.02.02.02.0
EM64TYesYesYesYes
VirtualizationYesYesYesYes
SSE4.2YesYesYesYes
AES-NIYesYesYesYes
AVXYesYesYesYes
AVX2NoNoNoNo
Base Clock100 MHz100 MHz100 MHz100 MHz
PinoutLGA1155LGA2011LGA2011G2, BGA1023 or BGA1224

‡ There are three ports, two of them supporting 1×16, 2×8, 4×4, 8×2, and 16×1 speeds, and one of them supporting 1×8, 4×2, and 8×1 speeds. The “best” configuration allowed is x16/x16/x8, however other configurations are supported, such as x8/x8/x8/x8/x8.

Model37xx3xxx4xxx4xxx
MarketDesktopMobileDesktopMobile
GenerationThirdThirdFourthFourth
MicroarchitectureIvy BridgeIvy BridgeHaswellHaswell
Manufacturing Process22 nm22 nm22 nm22 mm
Number of Cores42 or 442 or 4
Hyper-ThreadingYesYesYesYes
L1 cache (per core)32 kiB+32kB32 kiB+32 kiB32 kiB+32 kiB32 kiB+32 kiB
L2 cache (per core)256 kiB256 kiB256 kiB256 kiB
L3 cache (total)8 MiB4 MiB, 6 MiB or 8 MiB8 MiB4 MiB, 6 MiB or 8 MiB
DMI bus2 GB/s2 GB/s2 GB/s2 GB/s
Memory (DDR3)1333, 16001333, 16001333, 16001333, 1600
Memory Channels2222
DDR3L and DDR3L-RSNoYesYesYes
Graphics EngineHD 4000HD 4000HD 4600 or Iris Pro 5200 HD 4200, HD 4400, HD 4600, HD 5000, Iris 5100 or Iris Pro 5200
DirectX111111.111.1
Graphics Processors121220 or 4010, 20 or 40 
Graphics Base Clock650 MHz350 MHz or 650 MHz200 or 350 MHz200 or 400 MHz
Graphics Boost Clock1.15 GHz1.1, 1.2, 1.25, 1.3 or 1.35 GHz1.2, 1.25 or 1.3 GHz850 MHz, 1 GHz, 1.1 GHz, 1.15 GHz, 1.2 GHz or 1.3 GHz
Displays Supported3333
PCIe Controller3.03.0*3.02.0 or 3.0 
PCIe Configuration1×16, 2×8, 1×8, 2×41×16, 2×8, 1×8, 2×41×16, 2×8, 1×8, 2×41×4, 4×1 or 1×16, 2×8, 1×8, 2×4
Turbo Boost2.02.02.02.0
EM64TYesYesYesYes
VirtualizationYesYesYesYes
SSE4.2YesYesYesYes
AES-NIYesYesYesYes
AVXYesYesYesYes
AVX2NoNoYesYes
Base Clock100 MHz100 MHz100 MHz100 MHz
PinoutLGA1155G2, BGA1023 or BGA1224LGA1150FCPGA946, FCBGA1168 or FCBGA1364 

* Except for “U” models, which have a PCI Express 2.0 controller.

Let’s now take a detailed look at all Core i7 models launched so far.

In the table below, we listed all Core i7-8xx and Core i7-9xx CPU models. These are desktop models based on the Nehalem microarchitecture. They are also called first-generation Core i7 processors.

The 8xx models are based on socket LGA1156 and support 1,066 MHz and 1,333 MHz DDR3 memories under dual-channel architecture. These models have an integrated PCI Express 2.0 controller supporting one x16 datapath or two x8 datapaths. On these CPUs, communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, listed as 2.5 GT/s by Intel).

The 9xx models are based on socket LGA1366 and support 1,066 MHz memories under triple-channel architecture. These models don’t have an integrated PCI Express controller and they talk to the motherboard chipset using a QPI bus working at 2.4 GHz (4.8 GB/s) on the “regular” models or at 3.2 GHz (6.4 GB/s) on the “Extreme” models, which are listed in a separate table below.

The first-generation Core i7 desktop models are quad-core or six-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having eight or 12 cores. However, only half the cores are “real;” the other half is simulated.

sSpecModelClockTurbo BoostCoresHTVideoL3 CacheTech.TDP (W)Max. Temp. (°C)*Socket
SLBYU9803.33 GHz3.60 GHz6YesNo12 MiB32 nm13068.8LGA1366
SLBVF9703.20 GHz3.46 GHz6YesNo12 MiB32 nm13067.9LGA1366
SLBEU9603.20 GHz3.46 GHz4YesNo8 MiB45 nm13067.9LGA1366
SLBEN9503.06 GHz3.32 GHz4YesNo8 MiB45 nm13067.9LGA1366
SLBCK9402.93 GHz3.20 GHz4YesNo8 MiB45 nm13067.9LGA1366
SLBKP9302.80 GHz3.06 GHz4YesNo8 MiB45 nm13067.9LGA1366
SLBEJ9202.66 GHz2.93 GHz4YesNo8 MiB45 nm13067.9LGA1366
SLBCH9202.66 GHz2.93 GHz4YesNo8 MiB45 nm13067.9LGA1366
SLBPS8803.06 GHz3.74 GHz4YesNo8 MiB45 nm9572.7LGA1156
SLBS2875K2.93 GHz3.60 GHz4YesNo8 MiB45 nm9572.7LGA1156
SLBQ7870S2.66 GHz3.60 GHz4YesNo8 MiB45 nm82NALGA1156
SLBJG8702.93 GHz3.60 GHz4YesNo8 MiB45 nm9572.7LGA1156
SLBLG860s2.53 GHz3.46 GHz4YesNo8 MiB45 nm8276.7LGA1156
SLBJJ8602.80 GHz3.46 GHz4YesNo8 MiB45 nm9572.7LGA1156

In the table below, you will find all first-generation Core i7 Extreme models for desktops. These models have the QPI bus running at a higher clock rate (3.2 GHz, 6.4 GB/s) and come with their clock multiplier and Turbo Boost options unlocked, providing additional overclocking options.

sSpecModelInternal ClockTurbo BoostCoresHTVideoL3 CacheTech.TDP (W)Max. Temp. (°C)*Socket
SLBVZ990X3.46 GHz3.73 GHz6YesNo12 MiB32 nm13067.9LGA1366
SLBUZ980X3.33 GHz3.60 GHz6YesNo12 MiB32 nm13067.9LGA1366
SLBEQ9753.33 GHz3.60 GHz4YesNo8 MiB45 nm13067.9LGA1366
SLBCJ9653.20 GHz3.46 GHz4YesNo8 MiB45 nm13067.9LGA1366

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

The first-generation Core i7 processors targeted to laptops are based on the Nehalem microarchitecture. They can use two different pinouts, G1 or BGA1288, and have an integrated dual-channel DDR3 memory controller supporting 800 MHz and 1,066 MHz DDR3 memories on models 6xx (except for models “UM” and “UE,” which only support DDR3-800 memories), and 1,066 MHz and 1,333 MHz DDR3 memories on models 7xx, 8xx, and 9xx. They have an integrated PCI Express 2.0 controller, supporting one x16 connection. Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, which is listed as 2.5 GT/s by Intel). The 6xx models have an integrated DirectX 10 video controller running at 166 MHz with a 500 MHz “boost” clock on “UM” and “UE” models, 266 MHz with a 566 MHz “boost” clock on “LM” models, or 500 MHz with a 766 MHz “boost” clock on “M” and “E” models. This video controller uses an engine called “Intel HD Graphics,” and models with integrated video support two video monitors.

First-generation Core i7 mobile CPUs can have two (6xx models) or four (all other models) processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated.

sSpecModelClockTurbo BoostCoresHTVideoVideo ClockVideo BoostL3 CacheTech.TDP (W)Max. Temp. (°C)*Pinout
SLBMP840QM1.86 MHz3.20 GHz4YesNoNoNo8 MiB45 nm45100G1
SLBLX820QM1.73 GHz3.06 GHz4YesNoNoNo8 MiB45 nm45100G1
SLBQG740QM1.73 GHz2.93 GHz4YesNoNoNo6 MiB45 nm45100G1
SLBLY720QM1.60 GHz2.80 GHz4YesNoNoNo6 MiB45 nm45100G1
SLBST680UM1.46 GHz2.53 GHz2YesHD Graphics166 MHz500 MHz4 MiB32 nm18105BGA1288
SLBSS660UM1.33 GHz2.40 GHz2YesHD Graphics166 MHz500 MHz4 MiB32 nm18105BGA1288
SLBWV660UE1.33 GHz2.40 GHz2YesHD Graphics166 MHz500 MHz4 MiB32 nm18105BGA1288
SLBMM640UM1.20 GHz2.26 GHz2YesHD Graphics166 MHz500 MHz4 MiB32 nm18105BGA1288
SLBMK640LM2.13 GHz2.93 GHz2YesHD Graphics266 MHz566 MHz4 MiB32 nm25105BGA1288
SLBTN640M2.80 GHz3.46 GHz2YesHD Graphics500 MHz766 MHz4 MiB32 nm35105G1
SLBZU640M2.80 GHz3.46 GHz2YesHD Graphics500 MHz766 MHz4 MiB32 nm35105BGA1288
SLBMN620UM1.06 GHz2.13 GHz2YesHD Graphics166 MHz500 MHz4 MiB32 nm18105BGA1288
SLBTQ620M2.66 GHz3.33 GHz2YesHD Graphics500 MHz766 MHz4 MiB32 nm35105G1
SLBPE620M2.66 GHz3.33 GHz2YesHD Graphics500 MHz766 MHz4 MiB32 nm35105BGA1288
SLBPD620M2.66 GHz3.33 GHz2YesHD Graphics500 MHz766 MHz4 MiB32 nm35105G1
SLBSU620LM2.00 GHz2.80 GHz2YesHD Graphics266 MHz566 MHz4 MiB32 nm25105BGA1288
SLBML620LM2.00 GHz2.80 GHz2YesHD Graphics266 MHz566 MHz4 MiB32 nm25105BGA1288
SLBXX610E2.53 GHz3.20 GHz2YesHD Graphics500 MHz766 MHz4 MiB32 nm35105BGA1288

In the table below, you will find all first-generation mobile Core i7 Extreme models. They come with their cock multipliers and Turbo Boost options unlocked, adding more overclocking options for the enthusiast. 

sSpecModelClockTurbo BoostCoresHTVideoL3 CacheTech.TDP (W)Max. Temp. (°C)*Pinout
SLBSC940XM2.13 GHz3.33 GHz4YesNo8 MiB45 nm55100G1
SLBLW920XM2.00 GHz3.20 GHz4YesNo8 MiB45 nm55100G1

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

In the table below, we listed all second-generation Core i7 desktop processors, which are based on the Sandy Bridge microarchitecture.

The 3xxx models are based on socket LGA2011 and have an integrated memory controller supporting four channels as well as 1,066 MHz, 1,333 MHz, and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller with 40 lanes, available through two x16 ports and one x8 port. This way, the CPU can be directly connected to two PCI Express 3.0 x16 slots and one PCI Express 3.0 x8 slot. Each port can be “broken down,” so the CPU also has direct support for five PCI Express 3.0 x8 slots, for example. These models don’t have integrated video. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel).

The 2xxx models are based on socket LGA1155 and have a dual-channel memory controller supporting 1,066 MHz and 1,333 MHz DDR3 memories. They have an integrated PCI Express 2.0 controller supporting one x16 connection or two x8 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). These models have an integrated DirectX 10.1 video controller running at 850 MHz with a 1.35 GHz “boost” clock, with six (HD 2000) or 12 (HD 3000) processing cores. Models with integrated video support two displays.

The second-generation Core i7 desktop models are quad-core or six-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having eight or 12 cores. However, only half the cores are “real;” the other half is simulated.

sSpecModelClockTurbo BoostCoresHTVideoVideo ClockVideo BoostL3 CacheTech.TDP (W)Max. Temp. (°C)*Socket
SR0KF3960X3.3 GHz3.9 GHz6YesNoNoNo15 MiB32 nm13066.8LGA2011
SR0GW3960X3.3 GHz3.9 GHz6YesNoNoNo15 MiB32 nm13066.8LGA2011
SR0KY3930K3.2 GHz3.8 GHz6YesNoNoNo12 MiB32 nm13066.8LGA2011
SR0H93930K 3.2 GHz 3.8 GHz 6YesNoNoNo12 MiB32 nm13066.8LGA2011
SR0LD38203.6 GHz3.8 GHz4YesNoNoNo10 MiB32 nm13066.8LGA2011
SR0DG2700K3.5 GHz3.9 GHz4YesHD 3000850 MHz1.35 GHz8 MiB32 nm9572.6LGA1155
SR00E2600S2.80 GHz3.80 GHz4YesHD 2000850 MHz1.35 GHz8 MiB32 nm6569.1LGA1155
SR00C2600K3.40 GHz3.80 GHz4YesHD 3000850 MHz1.35 GHz8 MiB32 nm9572.6LGA1155
SR00B26003.40 GHz3.80 GHz4YesHD 2000850 MHz1.35 GHz8 MiB32 nm9572.6LGA1155

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

The second-generation Core i7 processors targeted to laptops are based on the Sandy Bridge microarchitecture and can be based on three different pinouts: BGA1023, BGA1224 or socket G2. These processors have an integrated dual-channel DDR3 memory controller, supporting 1,066 MHz, 1,333 MHz and, on 27xx, 28xx, and 29xx models, 1,600 MHz memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an integrated DirectX 10.1 video controller running at 350 MHz, 500 MHz or 650 MHz (see table below for specific clock rates), with 12 processing cores (HD 3000 graphics engine).

Second-generation Core i7 mobile CPUs can have two or four processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated.

sSpecModelClockTurbo BoostCoresHTVideoVideo ClockVideo BoostL3 CacheTech.TDP (W)Max. Temp. (°C)*Pinout
SR02X2860QM2.5 GHz3.6 GHz4YesHD 3000650 MHz1.3 GHz8 MiB32 nm45100G2
SR02Q2860QM2.5 GHz3.6 GHz4YesHD 3000650 MHz1.3 GHz8 MiB32 nm45100BGA1224
SR00U2820QM2.3 GHz3.40 GHz4YesHD 3000650 MHz1.3 GHz8 MiB32 nm45100BGA1224
SR0122820QM2.3 GHz3.4 GHz4YesHD 3000650 MHz1.3 GHz8 MiB32 nm45100G2
SR02W2760QM2.4 GHz3.5 GHz4YesHD 3000650 MHz1.3 GHz6 MiB32 nm45100G2
SR02R2760QM2.4 GHz3.5 GHz4YesHD 3000650 MHz1.3 GHz6 MiB32 nm45100BGA1224
SR00W2720QM2.2 GHz3.3 GHz4YesHD 3000650 MHz1.3 GHz6 MiB32 nm45100BGA1224
SR0142720QM2.2 GHz3.3 GHz4YesHD 3000650 MHz1.3 GHz6 MiB32 nm45100G2
SR02T2710QE2.1 GHz3.0 GHz4YesHD 3000650 MHz1.2 GHz6 MiB32 nm45100G2
SR0D22677M1.8 GHz2.9 GHz2YesHD 3000350 MHz1.2 GHz4 MiB32 nm17100BGA1023
SR02S2675QM2.2 GHz3.1 GHz4YesHD 3000650 MHz1.2 GHz6 MiB32 nm45100BGA1224
SR02N2670QM2.2 GHz3.1 GHz4YesHD 3000650 MHz1.1 GHz6 MiB32 nm45100G2
SR03S2657M2.6 GHz2.7 GHz2YesHD 3000350 MHz1 GHz6 MiB32 nm17100BGA1023
SR04N2649M2.3 GHz3.2 GHz2YesHD 3000500 MHz1.1 GHz4 MiB32 nm25100BGA1023
 SR0432640M2.8 GHz3.5 GHz2YesHD 3000650 MHz1.3 GHz4 MiB32 nm35100BGA1023
SR03R2640M2.8 GHz3.5 GHz2YesHD 3000650 MHz1.3 GHz4 MiB32 nm35100G2
 SR0D32637M1.7 GHz2.8 GHz2YesHD 3000350 MHz1.2 GHz4 MiB32 nm17100BGA1023
SR0302635QM2.0 GHz2.9 GHz4YesHD 3000650 MHz1.2 GHz6 MiB32 nm45100BGA1224
SR02Y2630QM2.0 GHz2.9 GHz4YesHD 3000650 MHz1.1 GHz6 MiB32 nm45100G2
SR04D2629M2.1 GHz3.0 GHz2YesHD 3000500 MHz1.1 GHz4 MiB32 nm25100BGA1023
SR03F2620M2.7 GHz3.4 GHz2YesHD 3000650 MHz1.3 GHz4 MiB32 nm35100G2
SR0412620M2.7 GHz3.4 GHz2YesHD 3000650 MHz1.3 GHz4 MiB32 nm35100BGA1023
SR03T2617M1.5 GHz2.6 GHz2YesHD 3000350 MHz950 MHz4 MiB32 nm17100BGA1023

In the table below, you will find the only second-generation mobile Core i7 Extreme processor model released so far. It comes with its clock multiplier and Turbo Boost options unlocked, adding more overclocking options for the enthusiast.

sSpecModelClockTurbo BoostCoresHTVideoVideo ClockVideo BoostL3 CacheTech.TDP (W)Max. Temp. (°C)*Pinout
SR02F2960XM2.70 GHz3.70 GHz4YesHD 3000650 MHz1.3 GHz8 MiB32 nm55100G2
SR02E2920XM2.50 GHz3.50 GHz4YesHD 3000650 MHz1.3 GHz8 MiB32 nm55100G2

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

In the table below, we listed all third-generation Core i7 desktop processors, which are based on the Ivy Bridge microarchitecture. The models released so far are based on socket LGA1155 and have a dual-channel memory controller supporting 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). These models have an integrated DirectX 11 video controller running at 650 MHz with a 1.15 GHz “boost” clock, with 12 (HD 4000) processing cores. All models support three displays (previous generations support two).

The third-generation Core i7 desktop models are quad- or six-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having either eight or twelve cores. However, only half the cores are “real;” the other half is simulated.

sSpecModelClockTurbo BoostCoresHTVideoVideo ClockVideo BoostL3 CacheTech.TDP (W)Max. Temp. (°C)*Socket
SR1AS4960X3.6 GHz4.0 GHz6YesNo––15 MiB22 nm13066.8LGA2011
SR1AT4930K3.4 GHz3.9 GHz6YesNo––12 MiB22 nm13066.8LGA2011
SR1AU4920K3.7 GHz3.9 GHz4YesNo––10 MiB22 nm13088.8LGA2011
SR0PL3770K3.5 GHz3.9 GHz4YesHD 4000650 MHz1.15 GHz8 MiB22 nm7767.4LGA1155
SR0PK37703.4 GHz3.9 GHz4YesHD 4000650 MHz1.15 GHz8 MiB22 nm7767.4LGA1155
SR0PN3770S3.1 GHz3.9 GHz4YesHD 4000650 MHz1.15 GHz8 MiB22 nm6569.1LGA1155
SR0PQ3770T2.5 GHz3.7 GHz4YesHD 4000650 MHz1.15 GHz8 MiB22 nm4569.8LGA1155

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

The third-generation Core i7 processors targeted to laptops are based on the Ivy Bridge microarchitecture and can be based on three different pinouts: BGA1023, BGA1224 or socket G2. These processors have an integrated dual-channel DDR3 memory controller, supporting 1,333 MHz and 1,600 MHz memories. They also have an integrated PCI Express 3.0 controller (in the “U” models, this controller is 2.0) supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an integrated DirectX 11 video controller running at 650 MHz (350 MHz on “U” models), with a “boost” clock that depends on the model (see table below for specific clock rates), all with 12 processing cores (HD 4000 graphics engine).

Third-generation Core i7 mobile CPUs can have two or four processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated.

sSpecModelClockTurbo BoostCoresHTVideoVideo ClockVideo BoostL3 CacheTech.TDP (W)Max. Temp. (°C)*Pinout
NA3840QM2.8 GHz3.8 GHz4YesHD 4000650 MHz1.3 GHz8 MiB22 nm45105G2
NA3840QM2.8 GHz3.8 GHz4YesHD 4000650 MHz1.3 GHz8 MiB22 nm45105BGA1224
SR0MK3820QM2.7 GHz3.7 GHz4YesHD 4000650 MHz1.25 GHz8 MiB22 nm45105BGA1224
SR0MJ3820QM2.7 GHz3.7 GHz4YesHD 4000650 MHz1.25 GHz8 MiB22 nm45105G2
SR0UV3740QM2.7 GHz3.7 GHz4YesHD 4000650 MHz1.3 GHz6 MiB22 nm45105G2
SR0MM3720QM2.6 GHz3.6 GHz4YesHD 4000650 MHz1.25 GHz6 MiB22 nm45105BGA1224
SR0ML3720QM2.6 GHz3.6 GHz4YesHD 4000650 MHz1.25 GHz6 MiB22 nm45105G2
SR12R3689Y1.5 GHz2.6 GHz2YesHD 4000350 MHz850 MHz4 MiB22 nm13105BGA1023
SR0XH3687U2.1 GHz3.3 GHz2YesHD 4000350 MHz1.2 GHz4 MiB22 nm17105BGA1023
SR0N53667U2.0 GHz3.2 GHz2YesHD 4000350 MHz1.15 GHz4 MiB22 nm17105BGA1023
NA3635QM2.4 GHz3.4 GHz4YesHD 4000650 MHz1.2 GHz6 MiB22 nm45105BGA1224
SR0V03632QM2.2 GHz3.2 GHz4YesHD 4000650 MHz1.15 GHz6 MiB22 nm35105G2
NA3632QM2.2 GHz3.2 GHz4YesHD 4000650 MHz1.15 GHz6 MiB22 nm35105BGA1224
NA3630QM2.4 GHz3.4 GHz4YesHD 4000650 MHz1.15 GHz6 MiB22 nm45105G2
SR0MP3615QM2.3 GHz3.3 GHz4YesHD 4000650 MHz1.2 GHz6 MiB22 nm45105BGA1224
SR0MQ3612QM2.1 GHz3.1 GHz4YesHD 4000650 MHz1.1 GHz6 MiB22 nm45105G2
SR0MR3612QM2.1 GHz3.1 GHz4YesHD 4000650 MHz1.1 GHz6 MiB22 nm45105BGA1224
SR0MN3610QM2.3 GHz3.3 GHz4YesHD 4000650 MHz1.1 GHz6 MiB22 nm45105G2
SR0X83540M3.0 GHz3.7 GHz2YesHD 4000650 MHz1.3 GHz4 MiB22 nm35105BGA1023
SR0X63540M3.0 GHz3.7 GHz2YesHD 4000650 MHz1.3 GHz4 MiB22 nm35105G2
SR0XG3537U2.0 GHz3.1 GHz2YesHD 4000350 MHz1.2 GHz4 MiB22 nm17105BGA1023
SR0MU3520M2.9 GHz3.6 GHz2YesHD 4000650 MHz1.25 GHz4 MiB22 nm35105BGA1023
SR0MT3520M2.9 GHz3.6 GHz2YesHD 4000650 MHz1.25 GHz4 MiB22 nm35105G2
SR0N63517U1.9 GHz3.0 GHz2YesHD 4000350 MHz1.15 GHz4 MiB22 nm17105BGA1023

In the table below, you will find all third-generation mobile Core i7 Extreme models. They come with their clock multipliers and Turbo Boost options unlocked, adding more overclocking options for the enthusiast.

sSpecModelClockTurbo BoostCoresHTVideoVideo ClockVideo BoostL3 CacheTech.TDP (W)Max. Temp. (°C)*Pinout
SR0US3940XM3.0 GHz3.9 GHz4YesHD 4000650 MHz1.35 GHz8 MiB22 nm55105G2
SR0T23920XM2.9 GHz3.8 GHz4YesHD 4000650 MHz1.3 GHz8 MiB22 nm55105G2
SR0MH3920XM2.9 GHz3.8 GHz4YesHD 4000650 MHz1.3 GHz8 MiB22 nm55105G2

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

In the table below, we listed all fourth-generation Core i7 desktop processors, which are based on the Haswell microarchitecture. The models released so far are based on socket LGA1150 and, therefore, incompatible with motherboards designed for previous models.

These processors have a dual-channel memory controller supporting 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel).

A new feature brought by these models is the support for AVX2 instructions.

All models have an integrated DirectX 11.1 video controller and two graphics engines are available at the moment: HD 4600 (codenamed “GT2”, 20 processing units), and Iris Pro 5200 (codenamed “GT3e”, 40 processing units, and video memory integrated into the CPU).

The fourth-generation Core i7 desktop models are quad-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having eight cores. However, only half the cores are “real;” the other half is simulated.

sSpecModelClockTurbo BoostCoresHTVideoVideo ClockVideo BoostL3 CacheTech.TDP (W)Max. Temp. (°C)*Socket
SR1BW47713.5 GHz3.9 GHz4YesHD 4600350 MHz1.2 GHz8 MiB22 nm8472LGA1150
SR1474770K3.4 GHz3.9 GHz4YesHD 4600350 MHz1.25 GHz8 MiB22 nm8472.72LGA1150
SR14947703.4 GHz3.9 GHz4YesHD 4600350 MHz1.2 GHz8 MiB22 nm8472.72LGA1150
NA4770R3.2 GHz3.9 GHz4YesIris Pro 5200200 MHz1.3 GHz6 MiB22 nm6566.45LGA1150
SR14H4770S3.1 GHz3.9 GHz4YesHD 4600350 MHz1.2 GHz8 MiB22 nm6571.35LGA1150
SR14N4770T2.5 GHz3.7 GHz4YesHD 4600350 MHz1.2 GHz8 MiB22 nm4571.45LGA1150
SR14Q  4765T 2.0 GHz3.0 GHz  4 YesHD 4600350 MHz1.2 GHz8 MiB22 nm3566.35LGA1150

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

The fourth-generation Core i7 processors targeted to laptops are based on the Haswell microarchitecture.

A new feature brought by these models is the support for AVX2 instructions.

The “U” and “Y” models carry an integrated south bridge chip with a four-port USB 3.0 controller and a four-port SATA-600 controller. On these models, the PCI Express controller is 2.0 and supports only one x4 connection or four x1 connections. On the other models, the PCI Express controller is 3.0 and supports one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).

Several graphics engines are available, all DirectX 11.1: HD 4200 (codenamed “GT1”, 10 processing units), HD 4400 (codenamed “GT2”, 20 processing units), HD 4600 (codenamed “GT2”, 20 processing units), HD 5000 (codenamed “GT3”, 40 processing units), Iris 5100 (codenamed “GT3”, 40 processing units), and Iris Pro 5200 (codenamed “GT3e”, 40 processing units, and video memory integrated into the CPU).

The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3L and LPDDR3 (on models “U” and “Y”) memories.

Fourth-generation Core i7 mobile CPUs can have two or four processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated. 

sSpecModelClockTurbo BoostCoresHTVideoVideo ClockVideo BoostL3 CacheTech.TDP (W)Max. Temp. (°C)*Package
NA4960HQ2.6 GH3.8 GHz4YesIris Pro 5200200 MHz1.3 GHz6 MiB22 nm47100NA
SR18G4950HQ2.4 GHz3.6 GHz4YesIris Pro 5200200 MHz1.3 GHz6 MiB22 nm47100FCBGA1364
SR15K4900MQ2.8 GHz3.8 GHz4YesHD 4600400 MHz1.3 GHz8 MiB22 nm47100FCPGA946
SR18H4850HQ2.3 GHz3.5 GHz4YesIris Pro 5200200 MHz1.2 GHz6 MiB22 nm47100FCBGA1364
SR15L4800MQ2.7 GHz3.7 GHz4YesHD 4600400 MHz1.3 GHz6 MiB22 nm47100FCPGA946
SR18J4750HQ2.0 GHz3.2 GHz4YesIris Pro 5200200 MHz1.2 GHz6 MiB22 nm47100FCBGA1364
SR15F4702HQ2.2 GHz3.2 GHz4YesHD 4600400 MHz1.15 GHz6 MiB22 nm37100FCBGA1364
SR15J4702MQ2.2 GHz3.2 GHz4YesHD 4600400 MHz1.15 GHz6 MiB22 nm37100FCPGA946
SR15E4700HQ2.4 GHz3.4 GHz4YesHD 4600400 MHz1.2 GHz6 MiB22 nm47100FCBGA1364
SR15H4700MQ2.4 GHz3.4 GHz4YesHD 4600400 MHz1.15 GHz6 MiB22 nm47100FCPGA946
SR17L4700EQ2.4 GHz3.4 GHz4YesHD 4600400 MHz1 GHz6 MiB22 nm47100FCBGA1364
SR16H4650U1.7 GHz3.3 GHz2YesHD 5000200 MHz1.1 GHz4 MiB22 nm15100FCBGA1168
NA4610Y1.7 GHz2.9 GHz2YesHD 4200200 MHz850 MHz4 MiB22 nm11.5100NA
NA4600M2.9 GHz3.6 GHz2YesHD 4600400 MHz1.3 GHz4 MiB22 nm37100NA
SR1EA4600U2.1 GHz3.3 GHz2YesHD 4400200 MHz1.1 GHz4 MiB22 nm15100FCBGA1168
SR1884558U2.8 GHz3.3 GHz2YesIris 5100200 MHz1.2 GHz4 MiB22 nm28100FCBGA1168
SR16J4550U1.5 GHz3.0 GHz2YesHD 5000200 MHz1.1 GHz4 MiB22 nm15100FCBGA1168
SR16Z4500U1.8 GHz3.0 GHz2YesHD 4400200 MHz1.1 GHz4 MiB22 nm15100FCBGA1168

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

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For Performance

  • PCI Express 3.0 vs. 2.0: Is There a Gaming Performance Gain?
  • Does dual-channel memory make difference on integrated video performance?
  • Overclocking Pros and Cons
  • All Core i7 Models
  • Understanding RAM Timings

Everything you need to know

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  • What You Should Know About the SPDIF Connection (2022 Guide)
  • Everything You Need to Know About the Intel Virtualization Technology
  • Everything You Need to Know About the CPU Power Management

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