[nextpage title=”Introduction”]
The Core i7 is a CPU series manufactured by Intel aimed at high-range computers. In this tutorial, we will present a series of quick reference tables for you to compare the main differences between all models released to date.
By the way, the correct name of this line of processors is “Core i7,” not “Intel i7.”
Currently, there are four different generations of Core i7 processors available. In the tables below, we describe the main differences between these generations and the model series within each generation.
|
Model |
8xx |
9xx |
6xx |
7xx |
8xx and 9xx |
|
Market |
Desktop |
Desktop |
Mobile |
Mobile |
Mobile |
|
Generation |
First |
First |
First |
First |
First |
|
Microarchitecture |
|||||
|
Manufacturing Process |
45 nm |
45 nm or 32 nm |
32 nm |
45 nm |
45 nm |
|
Number of Cores |
4 |
4 or 6 |
2 |
4 |
4 |
|
Hyper-Threading |
Yes |
Yes |
Yes |
Yes |
Yes |
|
L1 cache (per core) |
32 kiB+32 kiB |
32 kiB+32 kiB |
32 kiB+32kB |
32 kiB+32 kiB |
32 kiB+32 kiB |
|
L2 cache (per core) |
256 kiB |
256 kiB |
256 kiB |
256 kiB |
256 kiB |
|
L3 cache (total) |
8 MiB |
8 MiB or 12 MiB |
4 MiB |
6 MiB |
8 MiB |
|
DMI bus |
1 GB/s |
No |
1 GB/s |
1 GB/s |
1 GB/s |
|
Memory (DDR3) |
1066, 1333 |
1066 |
800, 1066† |
1066, 1333 |
1066, 1333 |
|
Memory Channels |
2 |
3 |
2 |
2 |
2 |
|
DDR3L and DDR3L-RS |
No |
No |
No |
No |
No |
|
Graphics Engine |
No |
No |
HD Graphics |
No |
No |
|
DirectX |
No |
No |
10 |
No |
No |
|
Graphics Processors |
No |
No |
6 |
No |
No |
|
Graphics Base Clock |
No |
No |
166, 266 or 500 MHz |
No |
No |
|
Graphics Boost Clock |
No |
No |
500, 566 or 766 MHz |
No |
No |
|
Displays Supported |
None |
None |
2 |
None |
None |
|
PCIe Controller |
2.0 |
No |
2.0 |
2.0 |
2.0 |
|
PCIe Configuration |
1×16, 2×8 |
NA |
1×16 |
1×16 |
1×16 |
|
1.0 |
1.0 |
1.0 |
1.0 |
1.0 |
|
|
Yes |
Yes |
Yes |
Yes |
Yes |
|
|
Yes |
Yes |
Yes |
Yes |
Yes |
|
|
SSE4.2 |
Yes |
Yes |
Yes |
Yes |
Yes |
|
AES-NI |
No |
On 32 nm models |
Yes |
No |
No |
|
No |
No |
No |
No |
No |
|
|
No |
No |
No |
No |
No |
|
|
Base Clock |
133 MHz |
133 MHz |
133 MHz |
133 MHz |
133 MHz |
|
Pinout |
LGA1156 |
LGA1366 |
G1 or BGA1288 |
G1 |
G1 |
† Except for “UM” and “UE” models, which only support DDR3-800 memory.
|
Model |
2xxx |
38xx |
39xx |
2xxx |
|
Market |
Desktop |
Desktop |
Desktop |
Mobile |
|
Generation |
Second |
Second |
Second |
Second |
|
Microarchitecture |
||||
|
Manufacturing Process |
32 nm |
32 nm |
32 nm |
32 nm |
|
Number of Cores |
4 |
4 |
6 |
2 or 4 |
|
Hyper-Threading |
Yes |
Yes |
Yes |
Yes |
|
L1 cache (per core) |
32 kiB+32 kiB |
32 kiB+32 kiB |
32 kiB+32 kiB |
32 kiB+32kB |
|
L2 cache (per core) |
256 kiB |
256 kiB |
256 kiB |
256 kiB |
|
L3 cache (total) |
8 MiB |
10 MiB |
12 MiB or 15 MiB |
4 MiB, 6 MiB or 8 MiB |
|
DMI bus |
2 GB/s |
2 GB/2 |
2 GB/s |
2 GB/s |
|
Memory (DDR3) |
1066, 1333 |
1066, 1333, 1600 |
1066, 1333, 1600 |
1066, 1333, 1600 |
|
Memory Channels |
2 |
4 |
4 |
2 |
|
DDR3L and DDR3L-RS |
No |
No |
No |
No |
|
Graphics Engine |
HD 2000 or HD 3000 |
No |
No |
HD 3000 |
|
DirectX |
10.1 |
No |
No |
10.1 |
|
Graphics Processors |
6 or 12 |
No |
No |
12 |
|
Graphics Base Clock |
850 MHz |
No |
No |
350, 500 or 650 MHz |
|
Graphics Boost Clock |
1.35 GHz |
No |
No |
950 MHz, 1 GHz, 1.1 GHz, 1.2 GHz or 1.3 GHz |
|
Displays Supported |
2 |
No |
None |
2 |
|
PCIe Controller |
2.0 |
3.0 |
3.0 |
2.0 |
|
PCIe Configuration |
1×16, 2×8 |
40 lanes‡ |
40 lanes‡ |
1×16, 2×8, 1×8, 2×4 |
|
2.0 |
2.0 |
2.0 |
2.0 |
|
|
Yes |
Yes |
Yes |
Yes |
|
|
Yes |
Yes |
Yes |
Yes |
|
|
SSE4.2 |
Yes |
Yes |
Yes |
Yes |
|
AES-NI |
Yes |
Yes |
Yes |
Yes |
|
Yes |
Yes |
Yes |
Yes |
|
|
No |
No |
No |
No |
|
|
Base Clock |
100 MHz |
100 MHz |
100 MHz |
100 MHz |
|
Pinout |
LGA1155 |
LGA2011 |
LGA2011 |
G2, BGA1023 or BGA1224 |
‡ There are three ports, two of them supporting 1×16, 2×8, 4×4, 8×2, and 16×1 speeds, and one of them supporting 1×8, 4×2, and 8×1 speeds. The “best” configuration allowed is x16/x16/x8, however other configurations are supported, such as x8/x8/x8/x8/x8.
| Model | 37xx | 3xxx |
4xxx |
4xxx |
| Market | Desktop | Mobile |
Desktop |
Mobile |
| Generation | Third | Third |
Fourth |
Fourth |
| Microarchitecture | Ivy Bridge | Ivy Bridge | ||
| Manufacturing Process | 22 nm | 22 nm |
22 nm |
22 mm |
| Number of Cores | 4 | 2 or 4 |
4 |
2 or 4 |
| Hyper-Threading | Yes | Yes | Yes | Yes |
| L1 cache (per core) | 32 kiB+32kB | 32 kiB+32 kiB | 32 kiB+32 kiB | 32 kiB+32 kiB |
| L2 cache (per core) | 256 kiB | 256 kiB | 256 kiB | 256 kiB |
| L3 cache (total) | 8 MiB | 4 MiB, 6 MiB or 8 MiB | 8 MiB | 4 MiB, 6 MiB or 8 MiB |
| DMI bus | 2 GB/s | 2 GB/s |
2 GB/s |
2 GB/s |
| Memory (DDR3) | 1333, 1600 | 1333, 1600 | 1333, 1600 | 1333, 1600 |
| Memory Channels | 2 | 2 | 2 | 2 |
| DDR3L and DDR3L-RS | No | Yes | Yes | Yes |
| Graphics Engine | HD 4000 | HD 4000 | HD 4600 or Iris Pro 5200 | HD 4200, HD 4400, HD 4600, HD 5000, Iris 5100 or Iris Pro 5200 |
| DirectX | 11 | 11 |
11.1 |
11.1 |
| Graphics Processors | 12 | 12 | 20 or 40 | 10, 20 or 40 |
| Graphics Base Clock | 650 MHz | 350 MHz or 650 MHz | 200 or 350 MHz | 200 or 400 MHz |
| Graphics Boost Clock | 1.15 GHz | 1.1, 1.2, 1.25, 1.3 or 1.35 GHz | 1.2, 1.25 or 1.3 GHz | 850 MHz, 1 GHz, 1.1 GHz, 1.15 GHz, 1.2 GHz or 1.3 GHz |
| Displays Supported | 3 | 3 |
3 |
3 |
| PCIe Controller | 3.0 | 3.0* | 3.0 | 2.0 or 3.0 |
| PCIe Configuration | 1×16, 2×8, 1×8, 2×4 | 1×16, 2×8, 1×8, 2×4 | 1×16, 2×8, 1×8, 2×4 | 1×4, 4×1 or 1×16, 2×8, 1×8, 2×4 |
| Turbo Boost | 2.0 | 2.0 |
2.0 |
2.0 |
| EM64T | Yes | Yes | Yes | Yes |
| Virtualization | Yes | Yes | Yes | Yes |
| SSE4.2 | Yes | Yes | Yes | Yes |
| AES-NI | Yes | Yes | Yes | Yes |
| AVX | Yes | Yes | Yes | Yes |
| AVX2 | No | No | Yes | Yes |
| Base Clock | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Pinout | LGA1155 | G2, BGA1023 or BGA1224 |
LGA1150 |
FCPGA946, FCBGA1168 or FCBGA1364 |
* Except for “U” models, which have a PCI Express 2.0 controller.
Let’s now take a detailed look at all Core i7 models launched so far.
[nextpage title=”First-Generation Core i7 Desktop Models”]
In the table below, we listed all Core i7-8xx and Core i7-9xx CPU models. These are desktop models based on the Nehalem microarchitecture. They are also called first-generation Core i7 processors.
The 8xx models are based on socket LGA1156 and support 1,066 MHz and 1,333 MHz DDR3 memories under dual-channel architecture. These models have an integrated PCI Express 2.0 controller supporting one x16 datapath or two x8 datapaths. On these CPUs, communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, listed as 2.5 GT/s by Intel).
The 9xx models are based on socket LGA1366 and support 1,066 MHz memories under triple-channel architecture. These models don’t have an integrated PCI Express controller and they talk to the motherboard chipset using a QPI bus working at 2.4 GHz (4.8 GB/s) on the “regular” models or at 3.2 GHz (6.4 GB/s) on the “Extreme” models, which are listed in a separate table below.
The first-generation Core i7 desktop models are quad-core or six-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having eight or 12 cores. However, only half the cores are “real;” the other half is simulated.
| sSpec | Model | Clock | Turbo Boost | Cores | HT | Video | L3 Cache | Tech. | TDP (W) | Max. Temp. (°C)* | Socket |
| SLBYU | 980 | 3.33 GHz | 3.60 GHz | 6 | Yes | No | 12 MiB | 32 nm | 130 | 68.8 | LGA1366 |
| SLBVF | 970 | 3.20 GHz | 3.46 GHz | 6 | Yes | No | 12 MiB | 32 nm | 130 | 67.9 | LGA1366 |
| SLBEU | 960 | 3.20 GHz | 3.46 GHz | 4 | Yes | No | 8 MiB | 45 nm | 130 | 67.9 | LGA1366 |
| SLBEN | 950 | 3.06 GHz | 3.32 GHz | 4 | Yes | No | 8 MiB | 45 nm | 130 | 67.9 | LGA1366 |
| SLBCK | 940 | 2.93 GHz | 3.20 GHz | 4 | Yes | No | 8 MiB | 45 nm | 130 | 67.9 | LGA1366 |
| SLBKP | 930 | 2.80 GHz | 3.06 GHz | 4 | Yes | No | 8 MiB | 45 nm | 130 | 67.9 | LGA1366 |
| SLBEJ | 920 | 2.66 GHz | 2.93 GHz | 4 | Yes | No | 8 MiB | 45 nm | 130 | 67.9 | LGA1366 |
| SLBCH | 920 | 2.66 GHz | 2.93 GHz | 4 | Yes | No | 8 MiB | 45 nm | 130 | 67.9 | LGA1366 |
| SLBPS | 880 | 3.06 GHz | 3.74 GHz | 4 | Yes | No | 8 MiB | 45 nm | 95 | 72.7 | LGA1156 |
| SLBS2 | 875K | 2.93 GHz | 3.60 GHz | 4 | Yes | No | 8 MiB | 45 nm | 95 | 72.7 | LGA1156 |
| SLBQ7 | 870S | 2.66 GHz | 3.60 GHz | 4 | Yes | No | 8 MiB | 45 nm | 82 | NA | LGA1156 |
| SLBJG | 870 | 2.93 GHz | 3.60 GHz | 4 | Yes | No | 8 MiB | 45 nm | 95 | 72.7 | LGA1156 |
| SLBLG | 860s | 2.53 GHz | 3.46 GHz | 4 | Yes | No | 8 MiB | 45 nm | 82 | 76.7 | LGA1156 |
| SLBJJ | 860 | 2.80 GHz | 3.46 GHz | 4 | Yes | No | 8 MiB | 45 nm | 95 | 72.7 | LGA1156 |
In the table below, you will find all first-generation Core i7 Extreme models for desktops. These models have the QPI bus running at a higher clock rate (3.2 GHz, 6.4 GB/s) and come with their clock multiplier and Turbo Boost options unlocked, providing additional overclocking options.
| sSpec | Model | Internal Clock | Turbo Boost | Cores | HT | Video | L3 Cache | Tech. | TDP (W) | Max. Temp. (°C)* | Socket |
| SLBVZ | 990X | 3.46 GHz | 3.73 GHz | 6 | Yes | No | 12 MiB | 32 nm | 130 | 67.9 | LGA1366 |
| SLBUZ | 980X | 3.33 GHz | 3.60 GHz | 6 | Yes | No | 12 MiB | 32 nm | 130 | 67.9 | LGA1366 |
| SLBEQ | 975 | 3.33 GHz | 3.60 GHz | 4 | Yes | No | 8 MiB | 45 nm | 130 | 67.9 | LGA1366 |
| SLBCJ | 965 | 3.20 GHz | 3.46 GHz | 4 | Yes | No | 8 MiB | 45 nm | 130 | 67.9 | LGA1366 |
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.
[nextpage title=”First-Generation Core i7 Mobile Models”]
The first-generation Core i7 processors targeted to laptops are based on the Nehalem microarchitecture. They can use two different pinouts, G1 or BGA1288, and have an integrated dual-channel DDR3 memory controller supporting 800 MHz and 1,066 MHz DDR3 memories on models 6xx (except for models “UM” and “UE,” which only support DDR3-800 memories), and 1,066 MHz and 1,333 MHz DDR3 memories on models 7xx, 8xx, and 9xx. They have an integrated PCI Express 2.0 controller, supporting one x16 connection. Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, which is listed as 2.5 GT/s by Intel). The 6xx models have an integrated DirectX 10 video controller running at 166 MHz with a 500 MHz “boost” clock on “UM” and “UE” models, 266 MHz with a 566 MHz “boost” clock on “LM” models, or 500 MHz with a 766 MHz “boost” clock on “M” and “E” models. This video controller uses an engine called “Intel HD Graphics,” and models with integrated video support two video monitors.
First-generation Core i7 mobile CPUs can have two (6xx models) or four (all other models) processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated.
| sSpec | Model | Clock | Turbo Boost | Cores | HT | Video | Video Clock | Video Boost | L3 Cache | Tech. | TDP (W) | Max. Temp. (°C)* | Pinout |
| SLBMP | 840QM | 1.86 MHz | 3.20 GHz | 4 | Yes | No | No | No | 8 MiB | 45 nm | 45 | 100 | G1 |
| SLBLX | 820QM | 1.73 GHz | 3.06 GHz | 4 | Yes | No | No | No | 8 MiB | 45 nm | 45 | 100 | G1 |
| SLBQG | 740QM | 1.73 GHz | 2.93 GHz | 4 | Yes | No | No | No | 6 MiB | 45 nm | 45 | 100 | G1 |
| SLBLY | 720QM | 1.60 GHz | 2.80 GHz | 4 | Yes | No | No | No | 6 MiB | 45 nm | 45 | 100 | G1 |
| SLBST | 680UM | 1.46 GHz | 2.53 GHz | 2 | Yes | HD Graphics | 166 MHz | 500 MHz | 4 MiB | 32 nm | 18 | 105 | BGA1288 |
| SLBSS | 660UM | 1.33 GHz | 2.40 GHz | 2 | Yes | HD Graphics | 166 MHz | 500 MHz | 4 MiB | 32 nm | 18 | 105 | BGA1288 |
| SLBWV | 660UE | 1.33 GHz | 2.40 GHz | 2 | Yes | HD Graphics | 166 MHz | 500 MHz | 4 MiB | 32 nm | 18 | 105 | BGA1288 |
| SLBMM | 640UM | 1.20 GHz | 2.26 GHz | 2 | Yes | HD Graphics | 166 MHz | 500 MHz | 4 MiB | 32 nm | 18 | 105 | BGA1288 |
| SLBMK | 640LM | 2.13 GHz | 2.93 GHz | 2 | Yes | HD Graphics | 266 MHz | 566 MHz | 4 MiB | 32 nm | 25 | 105 | BGA1288 |
| SLBTN | 640M | 2.80 GHz | 3.46 GHz | 2 | Yes | HD Graphics | 500 MHz | 766 MHz | 4 MiB | 32 nm | 35 | 105 | G1 |
| SLBZU | 640M | 2.80 GHz | 3.46 GHz | 2 | Yes | HD Graphics | 500 MHz | 766 MHz | 4 MiB | 32 nm | 35 | 105 | BGA1288 |
| SLBMN | 620UM | 1.06 GHz | 2.13 GHz | 2 | Yes | HD Graphics | 166 MHz | 500 MHz | 4 MiB | 32 nm | 18 | 105 | BGA1288 |
| SLBTQ | 620M | 2.66 GHz | 3.33 GHz | 2 | Yes | HD Graphics | 500 MHz | 766 MHz | 4 MiB | 32 nm | 35 | 105 | G1 |
| SLBPE | 620M | 2.66 GHz | 3.33 GHz | 2 | Yes | HD Graphics | 500 MHz | 766 MHz | 4 MiB | 32 nm | 35 | 105 | BGA1288 |
| SLBPD | 620M | 2.66 GHz | 3.33 GHz | 2 | Yes | HD Graphics | 500 MHz | 766 MHz | 4 MiB | 32 nm | 35 | 105 | G1 |
| SLBSU | 620LM | 2.00 GHz | 2.80 GHz | 2 | Yes | HD Graphics | 266 MHz | 566 MHz | 4 MiB | 32 nm | 25 | 105 | BGA1288 |
| SLBML | 620LM | 2.00 GHz | 2.80 GHz | 2 | Yes | HD Graphics | 266 MHz | 566 MHz | 4 MiB | 32 nm | 25 | 105 | BGA1288 |
| SLBXX | 610E | 2.53 GHz | 3.20 GHz | 2 | Yes | HD Graphics | 500 MHz | 766 MHz | 4 MiB | 32 nm | 35 | 105 | BGA1288 |
In the table below, you will find all first-generation mobile Core i7 Extreme models. They come with their cock multipliers and Turbo Boost options unlocked, adding more overclocking options for the enthusiast.
| sSpec | Model | Clock | Turbo Boost | Cores | HT | Video | L3 Cache | Tech. | TDP (W) | Max. Temp. (°C)* | Pinout |
| SLBSC | 940XM | 2.13 GHz | 3.33 GHz | 4 | Yes | No | 8 MiB | 45 nm | 55 | 100 | G1 |
| SLBLW | 920XM | 2.00 GHz | 3.20 GHz | 4 | Yes | No | 8 MiB | 45 nm | 55 | 100 | G1 |
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.
[nextpage title=”Second-Generation Core i7 Desktop Models”]
In the table below, we listed all second-generation Core i7 desktop processors, which are based on the Sandy Bridge microarchitecture.
The 3xxx models are based on socket LGA2011 and have an integrated memory controller supporting four channels as well as 1,066 MHz, 1,333 MHz, and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller with 40 lanes, available through two x16 ports and one x8 port. This way, the CPU can be directly connected to two PCI Express 3.0 x16 slots and one PCI Express 3.0 x8 slot. Each port can be “broken down,” so the CPU also has direct support for five PCI Express 3.0 x8 slots, for example. These models don’t have integrated video. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel).
The 2xxx models are based on socket LGA1155 and have a dual-channel memory controller supporting 1,066 MHz and 1,333 MHz DDR3 memories. They have an integrated PCI Express 2.0 controller supporting one x16 connection or two x8 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). These models have an integrated DirectX 10.1 video controller running at 850 MHz with a 1.35 GHz “boost” clock, with six (HD 2000) or 12 (HD 3000) processing cores. Models with integrated video support two displays.
The second-generation Core i7 desktop models are quad-core or six-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having eight or 12 cores. However, only half the cores are “real;” the other half is simulated.
| sSpec | Model | Clock | Turbo Boost | Cores | HT | Video | Video Clock | Video Boost | L3 Cache | Tech. | TDP (W) | Max. Temp. (°C)* | Socket |
| SR0KF | 3960X | 3.3 GHz | 3.9 GHz | 6 | Yes | No | No | No | 15 MiB | 32 nm | 130 | 66.8 | LGA2011 |
| SR0GW | 3960X | 3.3 GHz | 3.9 GHz | 6 | Yes | No | No | No | 15 MiB | 32 nm | 130 | 66.8 | LGA2011 |
| SR0KY | 3930K | 3.2 GHz | 3.8 GHz | 6 | Yes | No | No | No | 12 MiB | 32 nm | 130 | 66.8 | LGA2011 |
| SR0H9 | 3930K | 3.2 GHz | 3.8 GHz | 6 | Yes | No | No | No | 12 MiB | 32 nm | 130 | 66.8 | LGA2011 |
| SR0LD | 3820 | 3.6 GHz | 3.8 GHz | 4 | Yes | No | No | No | 10 MiB | 32 nm | 130 | 66.8 | LGA2011 |
| SR0DG | 2700K | 3.5 GHz | 3.9 GHz | 4 | Yes | HD 3000 | 850 MHz | 1.35 GHz | 8 MiB | 32 nm | 95 | 72.6 | LGA1155 |
| SR00E | 2600S | 2.80 GHz | 3.80 GHz | 4 | Yes | HD 2000 | 850 MHz | 1.35 GHz | 8 MiB | 32 nm | 65 | 69.1 | LGA1155 |
| SR00C | 2600K | 3.40 GHz | 3.80 GHz | 4 | Yes | HD 3000 | 850 MHz | 1.35 GHz | 8 MiB | 32 nm | 95 | 72.6 | LGA1155 |
| SR00B | 2600 | 3.40 GHz | 3.80 GHz | 4 | Yes | HD 2000 | 850 MHz | 1.35 GHz | 8 MiB | 32 nm | 95 | 72.6 | LGA1155 |
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.
[nextpage title=”Second-Generation Core i7 Mobile Models”]
The second-generation Core i7 processors targeted to laptops are based on the Sandy Bridge microarchitecture and can be based on three different pinouts: BGA1023, BGA1224 or socket G2. These processors have an integrated dual-channel DDR3 memory controller, supporting 1,066 MHz, 1,333 MHz and, on 27xx, 28xx, and 29xx models, 1,600 MHz memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an integrated DirectX 10.1 video controller running at 350 MHz, 500 MHz or 650 MHz (see table below for specific clock rates), with 12 processing cores (HD 3000 graphics engine).
Second-generation Core i7 mobile CPUs can have two or four processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated.
| sSpec | Model | Clock | Turbo Boost | Cores | HT | Video | Video Clock | Video Boost | L3 Cache | Tech. | TDP (W) | Max. Temp. (°C)* | Pinout |
| SR02X | 2860QM | 2.5 GHz | 3.6 GHz | 4 | Yes | HD 3000 | 650 MHz | 1.3 GHz | 8 MiB | 32 nm | 45 | 100 | G2 |
| SR02Q | 2860QM | 2.5 GHz | 3.6 GHz | 4 | Yes | HD 3000 | 650 MHz | 1.3 GHz | 8 MiB | 32 nm | 45 | 100 | BGA1224 |
| SR00U | 2820QM | 2.3 GHz | 3.40 GHz | 4 | Yes | HD 3000 | 650 MHz | 1.3 GHz | 8 MiB | 32 nm | 45 | 100 | BGA1224 |
| SR012 | 2820QM | 2.3 GHz | 3.4 GHz | 4 | Yes | HD 3000 | 650 MHz | 1.3 GHz | 8 MiB | 32 nm | 45 | 100 | G2 |
| SR02W | 2760QM | 2.4 GHz | 3.5 GHz | 4 | Yes | HD 3000 | 650 MHz | 1.3 GHz | 6 MiB | 32 nm | 45 | 100 | G2 |
| SR02R | 2760QM | 2.4 GHz | 3.5 GHz | 4 | Yes | HD 3000 | 650 MHz | 1.3 GHz | 6 MiB | 32 nm | 45 | 100 | BGA1224 |
| SR00W | 2720QM | 2.2 GHz | 3.3 GHz | 4 | Yes | HD 3000 | 650 MHz | 1.3 GHz | 6 MiB | 32 nm | 45 | 100 | BGA1224 |
| SR014 | 2720QM | 2.2 GHz | 3.3 GHz | 4 | Yes | HD 3000 | 650 MHz | 1.3 GHz | 6 MiB | 32 nm | 45 | 100 | G2 |
| SR02T | 2710QE | 2.1 GHz | 3.0 GHz | 4 | Yes | HD 3000 | 650 MHz | 1.2 GHz | 6 MiB | 32 nm | 45 | 100 | G2 |
| SR0D2 | 2677M | 1.8 GHz | 2.9 GHz | 2 | Yes | HD 3000 | 350 MHz | 1.2 GHz | 4 MiB | 32 nm | 17 | 100 | BGA1023 |
| SR02S | 2675QM | 2.2 GHz | 3.1 GHz | 4 | Yes | HD 3000 | 650 MHz | 1.2 GHz | 6 MiB | 32 nm | 45 | 100 | BGA1224 |
| SR02N | 2670QM | 2.2 GHz | 3.1 GHz | 4 | Yes | HD 3000 | 650 MHz | 1.1 GHz | 6 MiB | 32 nm | 45 | 100 | G2 |
| SR03S | 2657M | 2.6 GHz | 2.7 GHz | 2 | Yes | HD 3000 | 350 MHz | 1 GHz | 6 MiB | 32 nm | 17 | 100 | BGA1023 |
| SR04N | 2649M | 2.3 GHz | 3.2 GHz | 2 | Yes | HD 3000 | 500 MHz | 1.1 GHz | 4 MiB | 32 nm | 25 | 100 | BGA1023 |
| SR043 | 2640M | 2.8 GHz | 3.5 GHz | 2 | Yes | HD 3000 | 650 MHz | 1.3 GHz | 4 MiB | 32 nm | 35 | 100 | BGA1023 |
| SR03R | 2640M | 2.8 GHz | 3.5 GHz | 2 | Yes | HD 3000 | 650 MHz | 1.3 GHz | 4 MiB | 32 nm | 35 | 100 | G2 |
| SR0D3 | 2637M | 1.7 GHz | 2.8 GHz | 2 | Yes | HD 3000 | 350 MHz | 1.2 GHz | 4 MiB | 32 nm | 17 | 100 | BGA1023 |
| SR030 | 2635QM | 2.0 GHz | 2.9 GHz | 4 | Yes | HD 3000 | 650 MHz | 1.2 GHz | 6 MiB | 32 nm | 45 | 100 | BGA1224 |
| SR02Y | 2630QM | 2.0 GHz | 2.9 GHz | 4 | Yes | HD 3000 | 650 MHz | 1.1 GHz | 6 MiB | 32 nm | 45 | 100 | G2 |
| SR04D | 2629M | 2.1 GHz | 3.0 GHz | 2 | Yes | HD 3000 | 500 MHz | 1.1 GHz | 4 MiB | 32 nm | 25 | 100 | BGA1023 |
| SR03F | 2620M | 2.7 GHz | 3.4 GHz | 2 | Yes | HD 3000 | 650 MHz | 1.3 GHz | 4 MiB | 32 nm | 35 | 100 | G2 |
| SR041 | 2620M | 2.7 GHz | 3.4 GHz | 2 | Yes | HD 3000 | 650 MHz | 1.3 GHz | 4 MiB | 32 nm | 35 | 100 | BGA1023 |
| SR03T | 2617M | 1.5 GHz | 2.6 GHz | 2 | Yes | HD 3000 | 350 MHz | 950 MHz | 4 MiB | 32 nm | 17 | 100 | BGA1023 |
In the table below, you will find the only second-generation mobile Core i7 Extreme processor model released so far. It comes with its clock multiplier and Turbo Boost options unlocked, adding more overclocking options for the enthusiast.
| sSpec | Model | Clock | Turbo Boost | Cores | HT | Video | Video Clock | Video Boost | L3 Cache | Tech. | TDP (W) | Max. Temp. (°C)* | Pinout |
| SR02F | 2960XM | 2.70 GHz | 3.70 GHz | 4 | Yes | HD 3000 | 650 MHz | 1.3 GHz | 8 MiB | 32 nm | 55 | 100 | G2 |
| SR02E | 2920XM | 2.50 GHz | 3.50 GHz | 4 | Yes | HD 3000 | 650 MHz | 1.3 GHz | 8 MiB | 32 nm | 55 | 100 | G2 |
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.
[nextpage title=”Third-Generation Core i7 Desktop Models”]
In the table below, we listed all third-generation Core i7 desktop processors, which are based on the Ivy Bridge microarchitecture. The models released so far are based on socket LGA1155 and have a dual-channel memory controller supporting 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). These models have an integrated DirectX 11 video controller running at 650 MHz with a 1.15 GHz “boost” clock, with 12 (HD 4000) processing cores. All models support three displays (previous generations support two).
The third-generation Core i7 desktop models are quad- or six-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having either eight or twelve cores. However, only half the cores are “real;” the other half is simulated.
| sSpec | Model | Clock | Turbo Boost | Cores | HT | Video | Video Clock | Video Boost | L3 Cache | Tech. | TDP (W) | Max. Temp. (°C)* | Socket |
| SR1AS | 4960X | 3.6 GHz | 4.0 GHz | 6 | Yes | No | – | – | 15 MiB | 22 nm | 130 | 66.8 | LGA2011 |
| SR1AT | 4930K | 3.4 GHz | 3.9 GHz | 6 | Yes | No | – | – | 12 MiB | 22 nm | 130 | 66.8 | LGA2011 |
| SR1AU | 4920K | 3.7 GHz | 3.9 GHz | 4 | Yes | No | – | – | 10 MiB | 22 nm | 130 | 88.8 | LGA2011 |
| SR0PL | 3770K | 3.5 GHz | 3.9 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.15 GHz | 8 MiB | 22 nm | 77 | 67.4 | LGA1155 |
| SR0PK | 3770 | 3.4 GHz | 3.9 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.15 GHz | 8 MiB | 22 nm | 77 | 67.4 | LGA1155 |
| SR0PN | 3770S | 3.1 GHz | 3.9 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.15 GHz | 8 MiB | 22 nm | 65 | 69.1 | LGA1155 |
| SR0PQ | 3770T | 2.5 GHz | 3.7 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.15 GHz | 8 MiB | 22 nm | 45 | 69.8 | LGA1155 |
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.
[nextpage title=”Third-Generation Core i7 Mobile Models”]
The third-generation Core i7 processors targeted to laptops are based on the Ivy Bridge microarchitecture and can be based on three different pinouts: BGA1023, BGA1224 or socket G2. These processors have an integrated dual-channel DDR3 memory controller, supporting 1,333 MHz and 1,600 MHz memories. They also have an integrated PCI Express 3.0 controller (in the “U” models, this controller is 2.0) supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an integrated DirectX 11 video controller running at 650 MHz (350 MHz on “U” models), with a “boost” clock that depends on the model (see table below for specific clock rates), all with 12 processing cores (HD 4000 graphics engine).
Third-generation Core i7 mobile CPUs can have two or four processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated.
| sSpec | Model | Clock | Turbo Boost | Cores | HT | Video | Video Clock | Video Boost | L3 Cache | Tech. | TDP (W) | Max. Temp. (°C)* | Pinout |
| NA | 3840QM | 2.8 GHz | 3.8 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.3 GHz | 8 MiB | 22 nm | 45 | 105 | G2 |
| NA | 3840QM | 2.8 GHz | 3.8 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.3 GHz | 8 MiB | 22 nm | 45 | 105 | BGA1224 |
| SR0MK | 3820QM | 2.7 GHz | 3.7 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.25 GHz | 8 MiB | 22 nm | 45 | 105 | BGA1224 |
| SR0MJ | 3820QM | 2.7 GHz | 3.7 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.25 GHz | 8 MiB | 22 nm | 45 | 105 | G2 |
| SR0UV | 3740QM | 2.7 GHz | 3.7 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.3 GHz | 6 MiB | 22 nm | 45 | 105 | G2 |
| SR0MM | 3720QM | 2.6 GHz | 3.6 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.25 GHz | 6 MiB | 22 nm | 45 | 105 | BGA1224 |
| SR0ML | 3720QM | 2.6 GHz | 3.6 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.25 GHz | 6 MiB | 22 nm | 45 | 105 | G2 |
|
SR12R |
3689Y |
1.5 GHz |
2.6 GHz |
2 |
Yes |
HD 4000 |
350 MHz |
850 MHz |
4 MiB |
22 nm |
13 |
105 |
BGA1023 |
| SR0XH |
3687U |
2.1 GHz | 3.3 GHz | 2 | Yes | HD 4000 | 350 MHz | 1.2 GHz | 4 MiB | 22 nm | 17 | 105 | BGA1023 |
| SR0N5 | 3667U | 2.0 GHz | 3.2 GHz | 2 | Yes | HD 4000 | 350 MHz | 1.15 GHz | 4 MiB | 22 nm | 17 | 105 | BGA1023 |
| NA | 3635QM | 2.4 GHz | 3.4 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.2 GHz | 6 MiB | 22 nm | 45 | 105 | BGA1224 |
|
SR0V0 |
3632QM |
2.2 GHz |
3.2 GHz |
4 |
Yes |
HD 4000 |
650 MHz |
1.15 GHz |
6 MiB |
22 nm |
35 |
105 |
G2 |
| NA |
3632QM |
2.2 GHz | 3.2 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.15 GHz | 6 MiB | 22 nm | 35 | 105 | BGA1224 |
| NA | 3630QM | 2.4 GHz | 3.4 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.15 GHz | 6 MiB | 22 nm | 45 | 105 | G2 |
| SR0MP | 3615QM | 2.3 GHz | 3.3 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.2 GHz | 6 MiB | 22 nm | 45 | 105 | BGA1224 |
| SR0MQ | 3612QM | 2.1 GHz | 3.1 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.1 GHz | 6 MiB | 22 nm | 45 | 105 | G2 |
| SR0MR | 3612QM | 2.1 GHz | 3.1 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.1 GHz | 6 MiB | 22 nm | 45 | 105 | BGA1224 |
| SR0MN | 3610QM | 2.3 GHz | 3.3 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.1 GHz | 6 MiB | 22 nm | 45 | 105 | G2 |
| SR0X8 | 3540M | 3.0 GHz | 3.7 GHz | 2 | Yes | HD 4000 | 650 MHz | 1.3 GHz | 4 MiB | 22 nm | 35 | 105 | BGA1023 |
| SR0X6 | 3540M | 3.0 GHz | 3.7 GHz | 2 | Yes | HD 4000 | 650 MHz | 1.3 GHz | 4 MiB | 22 nm | 35 | 105 | G2 |
| SR0XG | 3537U | 2.0 GHz | 3.1 GHz | 2 | Yes | HD 4000 | 350 MHz | 1.2 GHz | 4 MiB | 22 nm | 17 | 105 | BGA1023 |
| SR0MU | 3520M | 2.9 GHz | 3.6 GHz | 2 | Yes | HD 4000 | 650 MHz | 1.25 GHz | 4 MiB | 22 nm | 35 | 105 | BGA1023 |
| SR0MT | 3520M | 2.9 GHz | 3.6 GHz | 2 | Yes | HD 4000 | 650 MHz | 1.25 GHz | 4 MiB | 22 nm | 35 | 105 | G2 |
| SR0N6 | 3517U | 1.9 GHz | 3.0 GHz | 2 | Yes | HD 4000 | 350 MHz | 1.15 GHz | 4 MiB | 22 nm | 17 | 105 | BGA1023 |
In the table below, you will find all third-generation mobile Core i7 Extreme models. They come with their clock multipliers and Turbo Boost options unlocked, adding more overclocking options for the enthusiast.
| sSpec | Model | Clock | Turbo Boost | Cores | HT | Video | Video Clock | Video Boost | L3 Cache | Tech. | TDP (W) | Max. Temp. (°C)* | Pinout |
| SR0US | 3940XM | 3.0 GHz | 3.9 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.35 GHz | 8 MiB | 22 nm | 55 | 105 | G2 |
| SR0T2 | 3920XM | 2.9 GHz | 3.8 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.3 GHz | 8 MiB | 22 nm | 55 | 105 | G2 |
| SR0MH | 3920XM | 2.9 GHz | 3.8 GHz | 4 | Yes | HD 4000 | 650 MHz | 1.3 GHz | 8 MiB | 22 nm | 55 | 105 | G2 |
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.
[nextpage title=”Fourth-Generation Core i7 Desktop Models”]
In the table below, we listed all fourth-generation Core i7 desktop processors, which are based on the Haswell microarchitecture. The models released so far are based on socket LGA1150 and, therefore, incompatible with motherboards designed for previous models.
These processors have a dual-channel memory controller supporting 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel).
A new feature brought by these models is the support for AVX2 instructions.
All models have an integrated DirectX 11.1 video controller and two graphics engines are available at the moment: HD 4600 (codenamed “GT2”, 20 processing units), and Iris Pro 5200 (codenamed “GT3e”, 40 processing units, and video memory integrated into the CPU).
The fourth-generation Core i7 desktop models are quad-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having eight cores. However, only half the cores are “real;” the other half is simulated.
| sSpec | Model | Clock | Turbo Boost | Cores | HT | Video | Video Clock | Video Boost | L3 Cache | Tech. | TDP (W) | Max. Temp. (°C)* | Socket |
| SR1BW | 4771 | 3.5 GHz | 3.9 GHz | 4 | Yes | HD 4600 | 350 MHz | 1.2 GHz | 8 MiB | 22 nm | 84 | 72 | LGA1150 |
| SR147 | 4770K | 3.4 GHz | 3.9 GHz | 4 | Yes | HD 4600 | 350 MHz | 1.25 GHz | 8 MiB | 22 nm | 84 | 72.72 | LGA1150 |
| SR149 | 4770 | 3.4 GHz | 3.9 GHz | 4 | Yes | HD 4600 | 350 MHz | 1.2 GHz | 8 MiB | 22 nm | 84 | 72.72 | LGA1150 |
| NA | 4770R | 3.2 GHz | 3.9 GHz | 4 | Yes | Iris Pro 5200 | 200 MHz | 1.3 GHz | 6 MiB | 22 nm | 65 | 66.45 | LGA1150 |
| SR14H | 4770S | 3.1 GHz | 3.9 GHz | 4 | Yes | HD 4600 | 350 MHz | 1.2 GHz | 8 MiB | 22 nm | 65 | 71.35 | LGA1150 |
| SR14N | 4770T | 2.5 GHz | 3.7 GHz | 4 | Yes | HD 4600 | 350 MHz | 1.2 GHz | 8 MiB | 22 nm | 45 | 71.45 | LGA1150 |
| SR14Q | 4765T | 2.0 GHz | 3.0 GHz | 4 | Yes | HD 4600 | 350 MHz | 1.2 GHz | 8 MiB | 22 nm | 35 | 66.35 | LGA1150 |
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.
[nextpage title=”Fourth-Generation Core i7 Mobile Models”]
The fourth-generation Core i7 processors targeted to laptops are based on the Haswell microarchitecture.
A new feature brought by these models is the support for AVX2 instructions.
The “U” and “Y” models carry an integrated south bridge chip with a four-port USB 3.0 controller and a four-port SATA-600 controller. On these models, the PCI Express controller is 2.0 and supports only one x4 connection or four x1 connections. On the other models, the PCI Express controller is 3.0 and supports one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).
Several graphics engines are available, all DirectX 11.1: HD 4200 (codenamed “GT1”, 10 processing units), HD 4400 (codenamed “GT2”, 20 processing units), HD 4600 (codenamed “GT2”, 20 processing units), HD 5000 (codenamed “GT3”, 40 processing units), Iris 5100 (codenamed “GT3”, 40 processing units), and Iris Pro 5200 (codenamed “GT3e”, 40 processing units, and video memory integrated into the CPU).
The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3L and LPDDR3 (on models “U” and “Y”) memories.
Fourth-generation Core i7 mobile CPUs can have two or four processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated.
| sSpec | Model | Clock | Turbo Boost | Cores | HT | Video | Video Clock | Video Boost | L3 Cache | Tech. | TDP (W) | Max. Temp. (°C)* | Package |
| NA | 4960HQ | 2.6 GH | 3.8 GHz | 4 | Yes | Iris Pro 5200 | 200 MHz | 1.3 GHz | 6 MiB | 22 nm | 47 | 100 | NA |
| SR18G | 4950HQ | 2.4 GHz | 3.6 GHz | 4 | Yes | Iris Pro 5200 | 200 MHz | 1.3 GHz | 6 MiB | 22 nm | 47 | 100 | FCBGA1364 |
| SR15K | 4900MQ | 2.8 GHz | 3.8 GHz | 4 | Yes | HD 4600 | 400 MHz | 1.3 GHz | 8 MiB | 22 nm | 47 | 100 | FCPGA946 |
| SR18H | 4850HQ | 2.3 GHz | 3.5 GHz | 4 | Yes | Iris Pro 5200 | 200 MHz | 1.2 GHz | 6 MiB | 22 nm | 47 | 100 | FCBGA1364 |
| SR15L | 4800MQ | 2.7 GHz | 3.7 GHz | 4 | Yes | HD 4600 | 400 MHz | 1.3 GHz | 6 MiB | 22 nm | 47 | 100 | FCPGA946 |
| SR18J | 4750HQ | 2.0 GHz | 3.2 GHz | 4 | Yes | Iris Pro 5200 | 200 MHz | 1.2 GHz | 6 MiB | 22 nm | 47 | 100 | FCBGA1364 |
| SR15F | 4702HQ | 2.2 GHz | 3.2 GHz | 4 | Yes | HD 4600 | 400 MHz | 1.15 GHz | 6 MiB | 22 nm | 37 | 100 | FCBGA1364 |
| SR15J | 4702MQ | 2.2 GHz | 3.2 GHz | 4 | Yes | HD 4600 | 400 MHz | 1.15 GHz | 6 MiB | 22 nm | 37 | 100 | FCPGA946 |
| SR15E | 4700HQ | 2.4 GHz | 3.4 GHz | 4 | Yes | HD 4600 | 400 MHz | 1.2 GHz | 6 MiB | 22 nm | 47 | 100 | FCBGA1364 |
| SR15H | 4700MQ | 2.4 GHz | 3.4 GHz | 4 | Yes | HD 4600 | 400 MHz | 1.15 GHz | 6 MiB | 22 nm | 47 | 100 | FCPGA946 |
| SR17L | 4700EQ | 2.4 GHz | 3.4 GHz | 4 | Yes | HD 4600 | 400 MHz | 1 GHz | 6 MiB | 22 nm | 47 | 100 | FCBGA1364 |
| SR16H | 4650U | 1.7 GHz | 3.3 GHz | 2 | Yes | HD 5000 | 200 MHz | 1.1 GHz | 4 MiB | 22 nm | 15 | 100 | FCBGA1168 |
| NA | 4610Y | 1.7 GHz | 2.9 GHz | 2 | Yes | HD 4200 | 200 MHz | 850 MHz | 4 MiB | 22 nm | 11.5 | 100 | NA |
| NA | 4600M | 2.9 GHz | 3.6 GHz | 2 | Yes | HD 4600 | 400 MHz | 1.3 GHz | 4 MiB | 22 nm | 37 | 100 | NA |
| SR1EA | 4600U | 2.1 GHz | 3.3 GHz | 2 | Yes | HD 4400 | 200 MHz | 1.1 GHz | 4 MiB | 22 nm | 15 | 100 | FCBGA1168 |
| SR188 | 4558U | 2.8 GHz | 3.3 GHz | 2 | Yes | Iris 5100 | 200 MHz | 1.2 GHz | 4 MiB | 22 nm | 28 | 100 | FCBGA1168 |
| SR16J | 4550U | 1.5 GHz | 3.0 GHz | 2 | Yes | HD 5000 | 200 MHz | 1.1 GHz | 4 MiB | 22 nm | 15 | 100 | FCBGA1168 |
| SR16Z | 4500U | 1.8 GHz | 3.0 GHz | 2 | Yes | HD 4400 | 200 MHz | 1.1 GHz | 4 MiB | 22 nm | 15 | 100 | FCBGA1168 |
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.