[nextpage title=”Introduction”]

The Core i7 is a CPU series manufactured by Intel aimed at high-range computers. In this tutorial, we will present a series of quick reference tables for you to compare the main differences between all models released to date.

By the way, the correct name of this line of processors is “Core i7,” not “Intel i7.”

Currently, there are four different generations of Core i7 processors available. In the tables below, we describe the main differences between these generations and the model series within each generation.

Model

8xx

9xx

6xx

7xx

8xx and 9xx

Market

Desktop

Desktop

Mobile

Mobile

Mobile

Generation

First

First

First

First

First

Microarchitecture

Nehalem

Nehalem

Nehalem

Nehalem

Nehalem

Manufacturing Process

45 nm

45 nm or 32 nm

32 nm

45 nm

45 nm

Number of Cores

4

4 or 6

2

4

4

Hyper-Threading

Yes

Yes

Yes

Yes

Yes

L1 cache (per core)

32 kiB+32 kiB

32 kiB+32 kiB

32 kiB+32kB

32 kiB+32 kiB

32 kiB+32 kiB

L2 cache (per core)

256 kiB

256 kiB

256 kiB

256 kiB

256 kiB

L3 cache (total)

8 MiB

8 MiB or 12 MiB

4 MiB

6 MiB

8 MiB

DMI bus

1 GB/s

No

1 GB/s

1 GB/s

1 GB/s

Memory (DDR3)

1066, 1333

1066

800, 1066†

1066, 1333 

1066, 1333

Memory Channels

2

3

2

2

2

DDR3L and DDR3L-RS

No

No

No

No

No

Graphics Engine

No

No

HD Graphics

No

No

DirectX

No

No

10

No

No

Graphics Processors

No

No

6

No

No

Graphics Base Clock

No

No

166, 266 or 500 MHz

No

No

Graphics Boost Clock

No

No

500, 566 or 766 MHz

No

No

Displays Supported

None

None

2

None

None

PCIe Controller

2.0

No

2.0

2.0

2.0

PCIe Configuration

1×16, 2×8

NA

1×16

1×16

1×16

Turbo Boost

1.0

1.0

1.0

1.0

1.0

EM64T

Yes

Yes

Yes

Yes

Yes

Virtualization

Yes

Yes

Yes

Yes

Yes

SSE4.2

Yes

Yes

Yes

Yes

Yes

AES-NI

No

On 32 nm models

Yes

No

No

AVX

No

No

No

No

No

AVX2

No

No

No

No

No

Base Clock

133 MHz

133 MHz

133 MHz

133 MHz

133 MHz

Pinout

LGA1156

LGA1366

G1 or BGA1288

G1

G1

† Except for “UM” and “UE” models, which only support DDR3-800 memory.

Model

2xxx

38xx

39xx

2xxx

Market

Desktop

Desktop

Desktop

Mobile

Generation

Second

Second

Second

Second

Microarchitecture

Sandy Bridge

Sandy Bridge

Sandy Bridge

Sandy Bridge

Manufacturing Process

32 nm

32 nm

32 nm

32 nm

Number of Cores

4

4

6

2 or 4

Hyper-Threading

Yes

Yes

Yes

Yes

L1 cache (per core)

32 kiB+32 kiB

32 kiB+32 kiB

32 kiB+32 kiB

32 kiB+32kB

L2 cache (per core)

256 kiB

256 kiB

256 kiB

256 kiB

L3 cache (total)

8 MiB

10 MiB

12 MiB or 15 MiB

4 MiB, 6 MiB or 8 MiB

DMI bus

2 GB/s

2 GB/2

2 GB/s

2 GB/s

Memory (DDR3)

1066, 1333

1066, 1333, 1600

1066, 1333, 1600

1066, 1333, 1600 

Memory Channels

2

4

4

2

DDR3L and DDR3L-RS

No

No

No

No

Graphics Engine

HD 2000 or HD 3000

No

No

HD 3000

DirectX

10.1

No

No

10.1

Graphics Processors

6 or 12

No

No

12

Graphics Base Clock

850 MHz

No

No

350, 500 or 650 MHz

Graphics Boost Clock

1.35 GHz

No

No

950 MHz, 1 GHz, 1.1 GHz, 1.2 GHz or 1.3 GHz

Displays Supported

2

No

None

2

PCIe Controller

2.0

3.0

3.0

2.0

PCIe Configuration

1×16, 2×8

40 lanes‡

40 lanes‡

1×16, 2×8, 1×8, 2×4

Turbo Boost

2.0

2.0

2.0

2.0

EM64T

Yes

Yes

Yes

Yes

Virtualization

Yes

Yes

Yes

Yes

SSE4.2

Yes

Yes

Yes

Yes

AES-NI

Yes

Yes

Yes

Yes

AVX

Yes

Yes

Yes

Yes

AVX2

No

No

No

No

Base Clock

100 MHz

100 MHz

100 MHz

100 MHz

Pinout

LGA1155

LGA2011

LGA2011

G2, BGA1023 or BGA1224

‡ There are three ports, two of them supporting 1×16, 2×8, 4×4, 8×2, and 16×1 speeds, and one of them supporting 1×8, 4×2, and 8×1 speeds. The “best” configuration allowed is x16/x16/x8, however other configurations are supported, such as x8/x8/x8/x8/x8.

Model 37xx 3xxx

4xxx

4xxx

Market Desktop Mobile

Desktop

Mobile

Generation Third Third

Fourth

Fourth

Microarchitecture Ivy Bridge Ivy Bridge

Haswell

Haswell

Manufacturing Process 22 nm 22 nm

22 nm

22 mm

Number of Cores 4 2 or 4

4

2 or 4

Hyper-Threading Yes Yes Yes Yes
L1 cache (per core) 32 kiB+32kB 32 kiB+32 kiB 32 kiB+32 kiB 32 kiB+32 kiB
L2 cache (per core) 256 kiB 256 kiB 256 kiB 256 kiB
L3 cache (total) 8 MiB 4 MiB, 6 MiB or 8 MiB 8 MiB 4 MiB, 6 MiB or 8 MiB
DMI bus 2 GB/s 2 GB/s

2 GB/s

2 GB/s

Memory (DDR3) 1333, 1600 1333, 1600 1333, 1600 1333, 1600
Memory Channels 2 2 2 2
DDR3L and DDR3L-RS No Yes Yes Yes
Graphics Engine HD 4000 HD 4000 HD 4600 or Iris Pro 5200  HD 4200, HD 4400, HD 4600, HD 5000, Iris 5100 or Iris Pro 5200
DirectX 11 11

11.1

11.1

Graphics Processors 12 12 20 or 40 10, 20 or 40 
Graphics Base Clock 650 MHz 350 MHz or 650 MHz 200 or 350 MHz 200 or 400 MHz
Graphics Boost Clock 1.15 GHz 1.1, 1.2, 1.25, 1.3 or 1.35 GHz 1.2, 1.25 or 1.3 GHz 850 MHz, 1 GHz, 1.1 GHz, 1.15 GHz, 1.2 GHz or 1.3 GHz
Displays Supported 3 3

3

3

PCIe Controller 3.0 3.0* 3.0 2.0 or 3.0 
PCIe Configuration 1×16, 2×8, 1×8, 2×4 1×16, 2×8, 1×8, 2×4 1×16, 2×8, 1×8, 2×4 1×4, 4×1 or 1×16, 2×8, 1×8, 2×4
Turbo Boost 2.0 2.0

2.0

2.0

EM64T Yes Yes Yes Yes
Virtualization Yes Yes Yes Yes
SSE4.2 Yes Yes Yes Yes
AES-NI Yes Yes Yes Yes
AVX Yes Yes Yes Yes
AVX2 No No Yes Yes
Base Clock 100 MHz 100 MHz 100 MHz 100 MHz
Pinout LGA1155 G2, BGA1023 or BGA1224

LGA1150

FCPGA946, FCBGA1168 or FCBGA1364 

* Except for “U” models, which have a PCI Express 2.0 controller.

Let’s now take a detailed look at all Core i7 models launched so far.

[nextpage title=”First-Generation Core i7 Desktop Models”]

In the table below, we listed all Core i7-8xx and Core i7-9xx CPU models. These are desktop models based on the Nehalem microarchitecture. They are also called first-generation Core i7 processors.

The 8xx models are based on socket LGA1156 and support 1,066 MHz and 1,333 MHz DDR3 memories under dual-channel architecture. These models have an integrated PCI Express 2.0 controller supporting one x16 datapath or two x8 datapaths. On these CPUs, communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, listed as 2.5 GT/s by Intel).

The 9xx models are based on socket LGA1366 and support 1,066 MHz memories under triple-channel architecture. These models don’t have an integrated PCI Express controller and they talk to the motherboard chipset using a QPI bus working at 2.4 GHz (4.8 GB/s) on the “regular” models or at 3.2 GHz (6.4 GB/s) on the “Extreme” models, which are listed in a separate table below.

The first-generation Core i7 desktop models are quad-core or six-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having eight or 12 cores. However, only half the cores are “real;” the other half is simulated.

sSpec Model Clock Turbo Boost Cores HT Video L3 Cache Tech. TDP (W) Max. Temp. (°C)* Socket
SLBYU 980 3.33 GHz 3.60 GHz 6 Yes No 12 MiB 32 nm 130 68.8 LGA1366
SLBVF 970 3.20 GHz 3.46 GHz 6 Yes No 12 MiB 32 nm 130 67.9 LGA1366
SLBEU 960 3.20 GHz 3.46 GHz 4 Yes No 8 MiB 45 nm 130 67.9 LGA1366
SLBEN 950 3.06 GHz 3.32 GHz 4 Yes No 8 MiB 45 nm 130 67.9 LGA1366
SLBCK 940 2.93 GHz 3.20 GHz 4 Yes No 8 MiB 45 nm 130 67.9 LGA1366
SLBKP 930 2.80 GHz 3.06 GHz 4 Yes No 8 MiB 45 nm 130 67.9 LGA1366
SLBEJ 920 2.66 GHz 2.93 GHz 4 Yes No 8 MiB 45 nm 130 67.9 LGA1366
SLBCH 920 2.66 GHz 2.93 GHz 4 Yes No 8 MiB 45 nm 130 67.9 LGA1366
SLBPS 880 3.06 GHz 3.74 GHz 4 Yes No 8 MiB 45 nm 95 72.7 LGA1156
SLBS2 875K 2.93 GHz 3.60 GHz 4 Yes No 8 MiB 45 nm 95 72.7 LGA1156
SLBQ7 870S 2.66 GHz 3.60 GHz 4 Yes No 8 MiB 45 nm 82 NA LGA1156
SLBJG 870 2.93 GHz 3.60 GHz 4 Yes No 8 MiB 45 nm 95 72.7 LGA1156
SLBLG 860s 2.53 GHz 3.46 GHz 4 Yes No 8 MiB 45 nm 82 76.7 LGA1156
SLBJJ 860 2.80 GHz 3.46 GHz 4 Yes No 8 MiB 45 nm 95 72.7 LGA1156

In the table below, you will find all first-generation Core i7 Extreme models for desktops. These models have the QPI bus running at a higher clock rate (3.2 GHz, 6.4 GB/s) and come with their clock multiplier and Turbo Boost options unlocked, providing additional overclocking options.

sSpec Model Internal Clock Turbo Boost Cores HT Video L3 Cache Tech. TDP (W) Max. Temp. (°C)* Socket
SLBVZ 990X 3.46 GHz 3.73 GHz 6 Yes No 12 MiB 32 nm 130 67.9 LGA1366
SLBUZ 980X 3.33 GHz 3.60 GHz 6 Yes No 12 MiB 32 nm 130 67.9 LGA1366
SLBEQ 975 3.33 GHz 3.60 GHz 4 Yes No 8 MiB 45 nm 130 67.9 LGA1366
SLBCJ 965 3.20 GHz 3.46 GHz 4 Yes No 8 MiB 45 nm 130 67.9 LGA1366

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

[nextpage title=”First-Generation Core i7 Mobile Models”]

The first-generation Core i7 processors targeted to laptops are based on the Nehalem microarchitecture. They can use two different pinouts, G1 or BGA1288, and have an integrated dual-channel DDR3 memory controller supporting 800 MHz and 1,066 MHz DDR3 memories on models 6xx (except for models “UM” and “UE,” which only support DDR3-800 memories), and 1,066 MHz and 1,333 MHz DDR3 memories on models 7xx, 8xx, and 9xx. They have an integrated PCI Express 2.0 controller, supporting one x16 connection. Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, which is listed as 2.5 GT/s by Intel). The 6xx models have an integrated DirectX 10 video controller running at 166 MHz with a 500 MHz “boost” clock on “UM” and “UE” models, 266 MHz with a 566 MHz “boost” clock on “LM” models, or 500 MHz with a 766 MHz “boost” clock on “M” and “E” models. This video controller uses an engine called “Intel HD Graphics,” and models with integrated video support two video monitors.

First-generation Core i7 mobile CPUs can have two (6xx models) or four (all other models) processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated.

sSpec Model Clock Turbo Boost Cores HT Video Video Clock Video Boost L3 Cache Tech. TDP (W) Max. Temp. (°C)* Pinout
SLBMP 840QM 1.86 MHz 3.20 GHz 4 Yes No No No 8 MiB 45 nm 45 100 G1
SLBLX 820QM 1.73 GHz 3.06 GHz 4 Yes No No No 8 MiB 45 nm 45 100 G1
SLBQG 740QM 1.73 GHz 2.93 GHz 4 Yes No No No 6 MiB 45 nm 45 100 G1
SLBLY 720QM 1.60 GHz 2.80 GHz 4 Yes No No No 6 MiB 45 nm 45 100 G1
SLBST 680UM 1.46 GHz 2.53 GHz 2 Yes HD Graphics 166 MHz 500 MHz 4 MiB 32 nm 18 105 BGA1288
SLBSS 660UM 1.33 GHz 2.40 GHz 2 Yes HD Graphics 166 MHz 500 MHz 4 MiB 32 nm 18 105 BGA1288
SLBWV 660UE 1.33 GHz 2.40 GHz 2 Yes HD Graphics 166 MHz 500 MHz 4 MiB 32 nm 18 105 BGA1288
SLBMM 640UM 1.20 GHz 2.26 GHz 2 Yes HD Graphics 166 MHz 500 MHz 4 MiB 32 nm 18 105 BGA1288
SLBMK 640LM 2.13 GHz 2.93 GHz 2 Yes HD Graphics 266 MHz 566 MHz 4 MiB 32 nm 25 105 BGA1288
SLBTN 640M 2.80 GHz 3.46 GHz 2 Yes HD Graphics 500 MHz 766 MHz 4 MiB 32 nm 35 105 G1
SLBZU 640M 2.80 GHz 3.46 GHz 2 Yes HD Graphics 500 MHz 766 MHz 4 MiB 32 nm 35 105 BGA1288
SLBMN 620UM 1.06 GHz 2.13 GHz 2 Yes HD Graphics 166 MHz 500 MHz 4 MiB 32 nm 18 105 BGA1288
SLBTQ 620M 2.66 GHz 3.33 GHz 2 Yes HD Graphics 500 MHz 766 MHz 4 MiB 32 nm 35 105 G1
SLBPE 620M 2.66 GHz 3.33 GHz 2 Yes HD Graphics 500 MHz 766 MHz 4 MiB 32 nm 35 105 BGA1288
SLBPD 620M 2.66 GHz 3.33 GHz 2 Yes HD Graphics 500 MHz 766 MHz 4 MiB 32 nm 35 105 G1
SLBSU 620LM 2.00 GHz 2.80 GHz 2 Yes HD Graphics 266 MHz 566 MHz 4 MiB 32 nm 25 105 BGA1288
SLBML 620LM 2.00 GHz 2.80 GHz 2 Yes HD Graphics 266 MHz 566 MHz 4 MiB 32 nm 25 105 BGA1288
SLBXX 610E 2.53 GHz 3.20 GHz 2 Yes HD Graphics 500 MHz 766 MHz 4 MiB 32 nm 35 105 BGA1288

In the table below, you will find all first-generation mobile Core i7 Extreme models. They come with their cock multipliers and Turbo Boost options unlocked, adding more overclocking options for the enthusiast. 

sSpec Model Clock Turbo Boost Cores HT Video L3 Cache Tech. TDP (W) Max. Temp. (°C)* Pinout
SLBSC 940XM 2.13 GHz 3.33 GHz 4 Yes No 8 MiB 45 nm 55 100 G1
SLBLW 920XM 2.00 GHz 3.20 GHz 4 Yes No 8 MiB 45 nm 55 100 G1

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

[nextpage title=”Second-Generation Core i7 Desktop Models”]

In the table below, we listed all second-generation Core i7 desktop processors, which are based on the Sandy Bridge microarchitecture.

The 3xxx models are based on socket LGA2011 and have an integrated memory controller supporting four channels as well as 1,066 MHz, 1,333 MHz, and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller with 40 lanes, available through two x16 ports and one x8 port. This way, the CPU can be directly connected to two PCI Express 3.0 x16 slots and one PCI Express 3.0 x8 slot. Each port can be “broken down,” so the CPU also has direct support for five PCI Express 3.0 x8 slots, for example. These models don’t have integrated video. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel).

The 2xxx models are based on socket LGA1155 and have a dual-channel memory controller supporting 1,066 MHz and 1,333 MHz DDR3 memories. They have an integrated PCI Express 2.0 controller supporting one x16 connection or two x8 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). These models have an integrated DirectX 10.1 video controller running at 850 MHz with a 1.35 GHz “boost” clock, with six (HD 2000) or 12 (HD 3000) processing cores. Models with integrated video support two displays.

The second-generation Core i7 desktop models are quad-core or six-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having eight or 12 cores. However, only half the cores are “real;” the other half is simulated.

sSpec Model Clock Turbo Boost Cores HT Video Video Clock Video Boost L3 Cache Tech. TDP (W) Max. Temp. (°C)* Socket
SR0KF 3960X 3.3 GHz 3.9 GHz 6 Yes No No No 15 MiB 32 nm 130 66.8 LGA2011
SR0GW 3960X 3.3 GHz 3.9 GHz 6 Yes No No No 15 MiB 32 nm 130 66.8 LGA2011
SR0KY 3930K 3.2 GHz 3.8 GHz 6 Yes No No No 12 MiB 32 nm 130 66.8 LGA2011
SR0H9 3930K  3.2 GHz  3.8 GHz  6 Yes No No No 12 MiB 32 nm 130 66.8 LGA2011
SR0LD 3820 3.6 GHz 3.8 GHz 4 Yes No No No 10 MiB 32 nm 130 66.8 LGA2011
SR0DG 2700K 3.5 GHz 3.9 GHz 4 Yes HD 3000 850 MHz 1.35 GHz 8 MiB 32 nm 95 72.6 LGA1155
SR00E 2600S 2.80 GHz 3.80 GHz 4 Yes HD 2000 850 MHz 1.35 GHz 8 MiB 32 nm 65 69.1 LGA1155
SR00C 2600K 3.40 GHz 3.80 GHz 4 Yes HD 3000 850 MHz 1.35 GHz 8 MiB 32 nm 95 72.6 LGA1155
SR00B 2600 3.40 GHz 3.80 GHz 4 Yes HD 2000 850 MHz 1.35 GHz 8 MiB 32 nm 95 72.6 LGA1155

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

[nextpage title=”Second-Generation Core i7 Mobile Models”]

The second-generation Core i7 processors targeted to laptops are based on the Sandy Bridge microarchitecture and can be based on three different pinouts: BGA1023, BGA1224 or socket G2. These processors have an integrated dual-channel DDR3 memory controller, supporting 1,066 MHz, 1,333 MHz and, on 27xx, 28xx, and 29xx models, 1,600 MHz memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an integrated DirectX 10.1 video controller running at 350 MHz, 500 MHz or 650 MHz (see table below for specific clock rates), with 12 processing cores (HD 3000 graphics engine).

Second-generation Core i7 mobile CPUs can have two or four processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated.

sSpec Model Clock Turbo Boost Cores HT Video Video Clock Video Boost L3 Cache Tech. TDP (W) Max. Temp. (°C)* Pinout
SR02X 2860QM 2.5 GHz 3.6 GHz 4 Yes HD 3000 650 MHz 1.3 GHz 8 MiB 32 nm 45 100 G2
SR02Q 2860QM 2.5 GHz 3.6 GHz 4 Yes HD 3000 650 MHz 1.3 GHz 8 MiB 32 nm 45 100 BGA1224
SR00U 2820QM 2.3 GHz 3.40 GHz 4 Yes HD 3000 650 MHz 1.3 GHz 8 MiB 32 nm 45 100 BGA1224
SR012 2820QM 2.3 GHz 3.4 GHz 4 Yes HD 3000 650 MHz 1.3 GHz 8 MiB 32 nm 45 100 G2
SR02W 2760QM 2.4 GHz 3.5 GHz 4 Yes HD 3000 650 MHz 1.3 GHz 6 MiB 32 nm 45 100 G2
SR02R 2760QM 2.4 GHz 3.5 GHz 4 Yes HD 3000 650 MHz 1.3 GHz 6 MiB 32 nm 45 100 BGA1224
SR00W 2720QM 2.2 GHz 3.3 GHz 4 Yes HD 3000 650 MHz 1.3 GHz 6 MiB 32 nm 45 100 BGA1224
SR014 2720QM 2.2 GHz 3.3 GHz 4 Yes HD 3000 650 MHz 1.3 GHz 6 MiB 32 nm 45 100 G2
SR02T 2710QE 2.1 GHz 3.0 GHz 4 Yes HD 3000 650 MHz 1.2 GHz 6 MiB 32 nm 45 100 G2
SR0D2 2677M 1.8 GHz 2.9 GHz 2 Yes HD 3000 350 MHz 1.2 GHz 4 MiB 32 nm 17 100 BGA1023
SR02S 2675QM 2.2 GHz 3.1 GHz 4 Yes HD 3000 650 MHz 1.2 GHz 6 MiB 32 nm 45 100 BGA1224
SR02N 2670QM 2.2 GHz 3.1 GHz 4 Yes HD 3000 650 MHz 1.1 GHz 6 MiB 32 nm 45 100 G2
SR03S 2657M 2.6 GHz 2.7 GHz 2 Yes HD 3000 350 MHz 1 GHz 6 MiB 32 nm 17 100 BGA1023
SR04N 2649M 2.3 GHz 3.2 GHz 2 Yes HD 3000 500 MHz 1.1 GHz 4 MiB 32 nm 25 100 BGA1023
 SR043 2640M 2.8 GHz 3.5 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 4 MiB 32 nm 35 100 BGA1023
SR03R 2640M 2.8 GHz 3.5 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 4 MiB 32 nm 35 100 G2
 SR0D3 2637M 1.7 GHz 2.8 GHz 2 Yes HD 3000 350 MHz 1.2 GHz 4 MiB 32 nm 17 100 BGA1023
SR030 2635QM 2.0 GHz 2.9 GHz 4 Yes HD 3000 650 MHz 1.2 GHz 6 MiB 32 nm 45 100 BGA1224
SR02Y 2630QM 2.0 GHz 2.9 GHz 4 Yes HD 3000 650 MHz 1.1 GHz 6 MiB 32 nm 45 100 G2
SR04D 2629M 2.1 GHz 3.0 GHz 2 Yes HD 3000 500 MHz 1.1 GHz 4 MiB 32 nm 25 100 BGA1023
SR03F 2620M 2.7 GHz 3.4 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 4 MiB 32 nm 35 100 G2
SR041 2620M 2.7 GHz 3.4 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 4 MiB 32 nm 35 100 BGA1023
SR03T 2617M 1.5 GHz 2.6 GHz 2 Yes HD 3000 350 MHz 950 MHz 4 MiB 32 nm 17 100 BGA1023

In the table below, you will find the only second-generation mobile Core i7 Extreme processor model released so far. It comes with its clock multiplier and Turbo Boost options unlocked, adding more overclocking options for the enthusiast.

sSpec Model Clock Turbo Boost Cores HT Video Video Clock Video Boost L3 Cache Tech. TDP (W) Max. Temp. (°C)* Pinout
SR02F 2960XM 2.70 GHz 3.70 GHz 4 Yes HD 3000 650 MHz 1.3 GHz 8 MiB 32 nm 55 100 G2
SR02E 2920XM 2.50 GHz 3.50 GHz 4 Yes HD 3000 650 MHz 1.3 GHz 8 MiB 32 nm 55 100 G2

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

[nextpage title=”Third-Generation Core i7 Desktop Models”]

In the table below, we listed all third-generation Core i7 desktop processors, which are based on the Ivy Bridge microarchitecture. The models released so far are based on socket LGA1155 and have a dual-channel memory controller supporting 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). These models have an integrated DirectX 11 video controller running at 650 MHz with a 1.15 GHz “boost” clock, with 12 (HD 4000) processing cores. All models support three displays (previous generations support two).

The third-generation Core i7 desktop models are quad- or six-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having either eight or twelve cores. However, only half the cores are “real;” the other half is simulated.

sSpec Model Clock Turbo Boost Cores HT Video Video Clock Video Boost L3 Cache Tech. TDP (W) Max. Temp. (°C)* Socket
SR1AS 4960X 3.6 GHz 4.0 GHz 6 Yes No 15 MiB 22 nm 130 66.8 LGA2011
SR1AT 4930K 3.4 GHz 3.9 GHz 6 Yes No 12 MiB 22 nm 130 66.8 LGA2011
SR1AU 4920K 3.7 GHz 3.9 GHz 4 Yes No 10 MiB 22 nm 130 88.8 LGA2011
SR0PL 3770K 3.5 GHz 3.9 GHz 4 Yes HD 4000 650 MHz 1.15 GHz 8 MiB 22 nm 77 67.4 LGA1155
SR0PK 3770 3.4 GHz 3.9 GHz 4 Yes HD 4000 650 MHz 1.15 GHz 8 MiB 22 nm 77 67.4 LGA1155
SR0PN 3770S 3.1 GHz 3.9 GHz 4 Yes HD 4000 650 MHz 1.15 GHz 8 MiB 22 nm 65 69.1 LGA1155
SR0PQ 3770T 2.5 GHz 3.7 GHz 4 Yes HD 4000 650 MHz 1.15 GHz 8 MiB 22 nm 45 69.8 LGA1155

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

[nextpage title=”Third-Generation Core i7 Mobile Models”]

The third-generation Core i7 processors targeted to laptops are based on the Ivy Bridge microarchitecture and can be based on three different pinouts: BGA1023, BGA1224 or socket G2. These processors have an integrated dual-channel DDR3 memory controller, supporting 1,333 MHz and 1,600 MHz memories. They also have an integrated PCI Express 3.0 controller (in the “U” models, this controller is 2.0) supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an integrated DirectX 11 video controller running at 650 MHz (350 MHz on “U” models), with a “boost” clock that depends on the model (see table below for specific clock rates), all with 12 processing cores (HD 4000 graphics engine).

Third-generation Core i7 mobile CPUs can have two or four processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated.

sSpec Model Clock Turbo Boost Cores HT Video Video Clock Video Boost L3 Cache Tech. TDP (W) Max. Temp. (°C)* Pinout
NA 3840QM 2.8 GHz 3.8 GHz 4 Yes HD 4000 650 MHz 1.3 GHz 8 MiB 22 nm 45 105 G2
NA 3840QM 2.8 GHz 3.8 GHz 4 Yes HD 4000 650 MHz 1.3 GHz 8 MiB 22 nm 45 105 BGA1224
SR0MK 3820QM 2.7 GHz 3.7 GHz 4 Yes HD 4000 650 MHz 1.25 GHz 8 MiB 22 nm 45 105 BGA1224
SR0MJ 3820QM 2.7 GHz 3.7 GHz 4 Yes HD 4000 650 MHz 1.25 GHz 8 MiB 22 nm 45 105 G2
SR0UV 3740QM 2.7 GHz 3.7 GHz 4 Yes HD 4000 650 MHz 1.3 GHz 6 MiB 22 nm 45 105 G2
SR0MM 3720QM 2.6 GHz 3.6 GHz 4 Yes HD 4000 650 MHz 1.25 GHz 6 MiB 22 nm 45 105 BGA1224
SR0ML 3720QM 2.6 GHz 3.6 GHz 4 Yes HD 4000 650 MHz 1.25 GHz 6 MiB 22 nm 45 105 G2

SR12R

3689Y

1.5 GHz

2.6 GHz

2

Yes

HD 4000

350 MHz

850 MHz

4 MiB

22 nm

13

105

BGA1023

SR0XH

3687U

2.1 GHz 3.3 GHz 2 Yes HD 4000 350 MHz 1.2 GHz 4 MiB 22 nm 17 105 BGA1023
SR0N5 3667U 2.0 GHz 3.2 GHz 2 Yes HD 4000 350 MHz 1.15 GHz 4 MiB 22 nm 17 105 BGA1023
NA 3635QM 2.4 GHz 3.4 GHz 4 Yes HD 4000 650 MHz 1.2 GHz 6 MiB 22 nm 45 105 BGA1224

SR0V0

3632QM

2.2 GHz

3.2 GHz

4

Yes

HD 4000

650 MHz

1.15 GHz

6 MiB

22 nm

35

105

G2

NA

3632QM

2.2 GHz 3.2 GHz 4 Yes HD 4000 650 MHz 1.15 GHz 6 MiB 22 nm 35 105 BGA1224
NA 3630QM 2.4 GHz 3.4 GHz 4 Yes HD 4000 650 MHz 1.15 GHz 6 MiB 22 nm 45 105 G2
SR0MP 3615QM 2.3 GHz 3.3 GHz 4 Yes HD 4000 650 MHz 1.2 GHz 6 MiB 22 nm 45 105 BGA1224
SR0MQ 3612QM 2.1 GHz 3.1 GHz 4 Yes HD 4000 650 MHz 1.1 GHz 6 MiB 22 nm 45 105 G2
SR0MR 3612QM 2.1 GHz 3.1 GHz 4 Yes HD 4000 650 MHz 1.1 GHz 6 MiB 22 nm 45 105 BGA1224
SR0MN 3610QM 2.3 GHz 3.3 GHz 4 Yes HD 4000 650 MHz 1.1 GHz 6 MiB 22 nm 45 105 G2
SR0X8 3540M 3.0 GHz 3.7 GHz 2 Yes HD 4000 650 MHz 1.3 GHz 4 MiB 22 nm 35 105 BGA1023
SR0X6 3540M 3.0 GHz 3.7 GHz 2 Yes HD 4000 650 MHz 1.3 GHz 4 MiB 22 nm 35 105 G2
SR0XG 3537U 2.0 GHz 3.1 GHz 2 Yes HD 4000 350 MHz 1.2 GHz 4 MiB 22 nm 17 105 BGA1023
SR0MU 3520M 2.9 GHz 3.6 GHz 2 Yes HD 4000 650 MHz 1.25 GHz 4 MiB 22 nm 35 105 BGA1023
SR0MT 3520M 2.9 GHz 3.6 GHz 2 Yes HD 4000 650 MHz 1.25 GHz 4 MiB 22 nm 35 105 G2
SR0N6 3517U 1.9 GHz 3.0 GHz 2 Yes HD 4000 350 MHz 1.15 GHz 4 MiB 22 nm 17 105 BGA1023

In the table below, you will find all third-generation mobile Core i7 Extreme models. They come with their clock multipliers and Turbo Boost options unlocked, adding more overclocking options for the enthusiast.

sSpec Model Clock Turbo Boost Cores HT Video Video Clock Video Boost L3 Cache Tech. TDP (W) Max. Temp. (°C)* Pinout
SR0US 3940XM 3.0 GHz 3.9 GHz 4 Yes HD 4000 650 MHz 1.35 GHz 8 MiB 22 nm 55 105 G2
SR0T2 3920XM 2.9 GHz 3.8 GHz 4 Yes HD 4000 650 MHz 1.3 GHz 8 MiB 22 nm 55 105 G2
SR0MH 3920XM 2.9 GHz 3.8 GHz 4 Yes HD 4000 650 MHz 1.3 GHz 8 MiB 22 nm 55 105 G2

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

[nextpage title=”Fourth-Generation Core i7 Desktop Models”]

In the table below, we listed all fourth-generation Core i7 desktop processors, which are based on the Haswell microarchitecture. The models released so far are based on socket LGA1150 and, therefore, incompatible with motherboards designed for previous models.

These processors have a dual-channel memory controller supporting 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel).

A new feature brought by these models is the support for AVX2 instructions.

All models have an integrated DirectX 11.1 video controller and two graphics engines are available at the moment: HD 4600 (codenamed “GT2”, 20 processing units), and Iris Pro 5200 (codenamed “GT3e”, 40 processing units, and video memory integrated into the CPU).

The fourth-generation Core i7 desktop models are quad-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having eight cores. However, only half the cores are “real;” the other half is simulated.

sSpec Model Clock Turbo Boost Cores HT Video Video Clock Video Boost L3 Cache Tech. TDP (W) Max. Temp. (°C)* Socket
SR1BW 4771 3.5 GHz 3.9 GHz 4 Yes HD 4600 350 MHz 1.2 GHz 8 MiB 22 nm 84 72 LGA1150
SR147 4770K 3.4 GHz 3.9 GHz 4 Yes HD 4600 350 MHz 1.25 GHz 8 MiB 22 nm 84 72.72 LGA1150
SR149 4770 3.4 GHz 3.9 GHz 4 Yes HD 4600 350 MHz 1.2 GHz 8 MiB 22 nm 84 72.72 LGA1150
NA 4770R 3.2 GHz 3.9 GHz 4 Yes Iris Pro 5200 200 MHz 1.3 GHz 6 MiB 22 nm 65 66.45 LGA1150
SR14H 4770S 3.1 GHz 3.9 GHz 4 Yes HD 4600 350 MHz 1.2 GHz 8 MiB 22 nm 65 71.35 LGA1150
SR14N 4770T 2.5 GHz 3.7 GHz 4 Yes HD 4600 350 MHz 1.2 GHz 8 MiB 22 nm 45 71.45 LGA1150
SR14Q   4765T  2.0 GHz 3.0 GHz   4  Yes HD 4600 350 MHz 1.2 GHz 8 MiB 22 nm 35 66.35 LGA1150

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

[nextpage title=”Fourth-Generation Core i7 Mobile Models”]

The fourth-generation Core i7 processors targeted to laptops are based on the Haswell microarchitecture.

A new feature brought by these models is the support for AVX2 instructions.

The “U” and “Y” models carry an integrated south bridge chip with a four-port USB 3.0 controller and a four-port SATA-600 controller. On these models, the PCI Express controller is 2.0 and supports only one x4 connection or four x1 connections. On the other models, the PCI Express controller is 3.0 and supports one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).

Several graphics engines are available, all DirectX 11.1: HD 4200 (codenamed “GT1”, 10 processing units), HD 4400 (codenamed “GT2”, 20 processing units), HD 4600 (codenamed “GT2”, 20 processing units), HD 5000 (codenamed “GT3”, 40 processing units), Iris 5100 (codenamed “GT3”, 40 processing units), and Iris Pro 5200 (codenamed “GT3e”, 40 processing units, and video memory integrated into the CPU).

The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3L and LPDDR3 (on models “U” and “Y”) memories.

Fourth-generation Core i7 mobile CPUs can have two or four processing cores, supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four- or eight-core CPUs. However, only half the cores are “real;” the other half is simulated. 

sSpec Model Clock Turbo Boost Cores HT Video Video Clock Video Boost L3 Cache Tech. TDP (W) Max. Temp. (°C)* Package
NA 4960HQ 2.6 GH 3.8 GHz 4 Yes Iris Pro 5200 200 MHz 1.3 GHz 6 MiB 22 nm 47 100 NA
SR18G 4950HQ 2.4 GHz 3.6 GHz 4 Yes Iris Pro 5200 200 MHz 1.3 GHz 6 MiB 22 nm 47 100 FCBGA1364
SR15K 4900MQ 2.8 GHz 3.8 GHz 4 Yes HD 4600 400 MHz 1.3 GHz 8 MiB 22 nm 47 100 FCPGA946
SR18H 4850HQ 2.3 GHz 3.5 GHz 4 Yes Iris Pro 5200 200 MHz 1.2 GHz 6 MiB 22 nm 47 100 FCBGA1364
SR15L 4800MQ 2.7 GHz 3.7 GHz 4 Yes HD 4600 400 MHz 1.3 GHz 6 MiB 22 nm 47 100 FCPGA946
SR18J 4750HQ 2.0 GHz 3.2 GHz 4 Yes Iris Pro 5200 200 MHz 1.2 GHz 6 MiB 22 nm 47 100 FCBGA1364
SR15F 4702HQ 2.2 GHz 3.2 GHz 4 Yes HD 4600 400 MHz 1.15 GHz 6 MiB 22 nm 37 100 FCBGA1364
SR15J 4702MQ 2.2 GHz 3.2 GHz 4 Yes HD 4600 400 MHz 1.15 GHz 6 MiB 22 nm 37 100 FCPGA946
SR15E 4700HQ 2.4 GHz 3.4 GHz 4 Yes HD 4600 400 MHz 1.2 GHz 6 MiB 22 nm 47 100 FCBGA1364
SR15H 4700MQ 2.4 GHz 3.4 GHz 4 Yes HD 4600 400 MHz 1.15 GHz 6 MiB 22 nm 47 100 FCPGA946
SR17L 4700EQ 2.4 GHz 3.4 GHz 4 Yes HD 4600 400 MHz 1 GHz 6 MiB 22 nm 47 100 FCBGA1364
SR16H 4650U 1.7 GHz 3.3 GHz 2 Yes HD 5000 200 MHz 1.1 GHz 4 MiB 22 nm 15 100 FCBGA1168
NA 4610Y 1.7 GHz 2.9 GHz 2 Yes HD 4200 200 MHz 850 MHz 4 MiB 22 nm 11.5 100 NA
NA 4600M 2.9 GHz 3.6 GHz 2 Yes HD 4600 400 MHz 1.3 GHz 4 MiB 22 nm 37 100 NA
SR1EA 4600U 2.1 GHz 3.3 GHz 2 Yes HD 4400 200 MHz 1.1 GHz 4 MiB 22 nm 15 100 FCBGA1168
SR188 4558U 2.8 GHz 3.3 GHz 2 Yes Iris 5100 200 MHz 1.2 GHz 4 MiB 22 nm 28 100 FCBGA1168
SR16J 4550U 1.5 GHz 3.0 GHz 2 Yes HD 5000 200 MHz 1.1 GHz 4 MiB 22 nm 15 100 FCBGA1168
SR16Z 4500U 1.8 GHz 3.0 GHz 2 Yes HD 4400 200 MHz 1.1 GHz 4 MiB 22 nm 15 100 FCBGA1168

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.