The Core i5 is a CPU series manufactured by Intel aimed at mid-range computers. In this tutorial, we will present a series of quick reference tables for you to compare the main differences between all models released to date.
By the way, the correct name of this line of processors is “Core i5,” not “Intel i5.”
Currently, there are four different generations of Core i5 processors available. In the table below, we describe the main differences between these generations.
Model |
7xx |
6xx |
4xx and 5xx |
2xxx |
2xxx |
Market |
Desktop |
Desktop |
Mobile |
Desktop |
Mobile |
Generation |
First |
First |
First |
Second |
Second |
Microarchitecture | |||||
Manufacturing Process |
45 nm |
32 nm |
32 nm |
32 nm |
32 nm |
Number of Cores |
4 |
2 |
2 |
4† |
2 |
Hyper-Threading |
No |
Yes |
Yes |
No† |
Yes |
L1 cache (per core) |
32 kiB+32 kiB |
32 kiB+32 kiB |
32 kiB+32kB |
32 kiB+32 kiB |
32 kiB+32kB |
L2 cache (per core) |
256 kiB |
256 kiB |
256 kiB |
256 kiB |
256 kiB |
L3 cache (total) |
8 MiB |
4 MiB |
3 MiB |
6 MiB† |
3 MiB |
DMI bus |
1 GB/s |
1 GB/s |
1 GB/s |
2 GB/s |
2 GB/s |
Memory (DDR3) |
1066, 1333 |
1066, 1333 |
800, 1066 |
1066, 1333 |
1066, 1333, 1600 |
DDR3L and DDR3L-RS |
No |
No |
No |
No |
No |
Graphics Engine |
No |
HD Graphics |
HD Graphics |
HD 2000 or HD 3000‡ |
HD 3000 |
DirectX |
No |
10 |
10 |
10.1‡ |
10.1 |
Graphics Processors |
No |
12 |
6 |
6 or 12‡ |
12 |
Graphics Base Clock |
No |
733 MHz or 900 MHz |
166 MHz or 500 MHz |
650 MHz or 850 MHz‡ |
350 MHz or 650 MHz |
Graphics Boost Clock |
No |
No |
500 MHz or 766 MHz |
1.25 GHz or 1.1 GHz‡ |
1.2 GHz or 1.3 GHz |
Displays Supported |
None |
2 |
2 |
2‡ |
2 |
PCIe Controller |
2.0 |
2.0 |
2.0 |
2.0 |
2.0 |
PCIe Configuration |
1×16, 2×8 |
1×16, 2×8 |
1×16 |
1×16, 2×8, 1×8, 2×4 |
1×16, 2×8, 1×8, 2×4 |
1.0 |
1.0 |
1.0 |
2.0 |
2.0 | |
Yes |
Yes |
Yes |
Yes |
Yes | |
Yes |
Yes |
Yes |
Yes |
Yes | |
SSE4.2 |
Yes |
Yes |
Yes |
Yes |
Yes |
AES-NI |
No |
Yes |
Yes |
Yes |
Yes |
No |
No |
No |
Yes |
Yes | |
No |
No |
No |
No |
No | |
Base Clock |
133 MHz |
133 MHz |
133 MHz |
100 MHz |
100 MHz |
Pinout |
LGA1156 |
LGA1156 |
G1 or BGA1288 |
LGA1155 |
G2 or BGA1023 |
Model |
3xxx |
3xxx |
4xxx |
4xxx |
Market |
Desktop |
Mobile |
Desktop |
Portátil |
Generation |
Third |
Third |
Quarta |
Quarta |
Microarchitecture | ||||
Manufacturing Process |
22 nm |
22 nm |
22 nm |
22 nm |
Number of Cores |
4 |
2 |
4* |
2 |
Hyper-Threading |
No |
Yes |
No* |
Yes |
L1 cache (per core) |
32 kiB+32kB |
32 kiB+32 kiB |
32 kiB+32 kiB |
32 kiB+32 kiB |
L2 cache (per core) |
256 kiB |
256 kiB |
256 kiB |
256 kiB |
L3 cache (total) |
6 MiB |
3 MiB |
4 MiB or 6 MiB |
3 MiB |
DMI bus |
2 GB/s |
2 GB/s |
2 GB/s |
2 GB/s |
Memory (DDR3) |
1333, 1600 |
1333, 1600 |
1333, 1600 |
1333, 1600 |
DDR3L and DDR3L-RS |
No |
Yes |
Yes |
Yes |
Graphics Engine |
HD 2500 or HD 4000‡ |
HD 4000 |
HD 4600 or Iris Pro 5200 |
HD 4200, HD 4400, HD 4600, HD 5000 or Iris 5100 |
DirectX |
11‡ |
11 |
11.1 |
11.1 |
Graphics Processors |
6 or 12‡ |
12 |
20 or 40 |
10, 20 or 40 |
Graphics Base Clock |
650 MHz‡ |
350 MHz or 650 MHz |
200 MHz or 350 MHz |
200 MHz or 400 MHz |
Graphics Boost Clock |
1.05 GHz, 1.1 GHz or 1.15 GHz‡ |
1.05 GHz, 1.15 GHz or 1.2 GHz |
1,1 GHz, 1,15 GHz, 1,2 GHz ou 1,3 GHz |
850 GHz, 1 GHz, 1,1 GHz, 1,15 GHz ou 1,25 GHz |
Displays Supported |
3‡ |
3 |
3 |
3 |
PCIe Controller |
3.0 |
3.0 |
3.0 |
3.0 |
PCIe Configuration |
1×16, 2×8, 1×8, 2×4 |
1×16, 2×8, 1×8, 2×4 |
1×16, 2×8, 1×8, 2×4 |
1×16, 2×8, 1×8, 2×4 ou 1×4, 4×1 |
2.0 |
2.0 |
2.0 |
2.0 | |
Yes |
Yes |
Yes |
Yes | |
Yes |
Yes |
Yes |
Yes | |
SSE4.2 |
Yes |
Yes |
Yes |
Yes |
AES-NI |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes |
Yes | |
No |
No |
Yes |
Yes | |
Base Clock |
100 MHz |
100 MHz |
100 MHz |
100 MHz |
Pinout |
LGA1155 |
G2 or BGA1023 |
LGA1150 |
FCPGA946, FCBGA1168 or FCBGA1364 |
† Except for the model 2390T, which has two cores, supports the Hyper-Threading technology, and has 3 MiB of cache L3.
‡ The 2550K model and models ending with a “P” don’t have integrated video.
* Except for the 4570T model, which has two cores and supports the Hyper-Threading technology.
Let’s now take a detailed look at all Core i5 models launched so far.
In the table below, we listed all Core i5 6xx and Core i5 7xx CPU models. These are desktop models based on the Nehalem microarchitecture and are also called first-generation Core i5 processors. These models use the socket LGA1156. The integrated memory controller supports dual-channel architecture as well as 1,066 MHz and 1,333 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 datapath or two x8 datapaths. Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, listed as 2.5 GT/s by Intel). All 6xx models have an integrated DirectX 10 video controller with 12 execution units running at 733 MHz or 900 MHz, using an engine that is known as “Intel HD Graphics,” a feature not present on the 7xx models. Models with integrated video support two video monitors.
The 7xx models are quad-core CPUs without the Hyper-Threading technology, while the 6xx models are dual-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having four cores. However, while on the 7xx models these cores are all “real,” on the 6xx models two of these cores are “real” and the other two are simulated.
sSpec | Model | Clock | Turbo Boost | Cores | HT | Video |
SLBRP | 760 | 2.80 GHz | 3.46 GHz | 4 | No | No |
SLBLH | 750S | 2.40 GHz | 3.20 GHz | 4 | No | No |
SLBLC | 750 | 2.66 GHz | 3.20 GHz | 4 | No | No |
SLBTM | 680 | 3.60 GHz | 3.86 GHz | 2 | Yes | HD Graphics |
SLBLT | 670 | 3.56 GHz | 3.73 GHz | 2 | Yes | HD Graphics |
SLBTB | 661 | 3.33 GHz | 3.60 GHz | 2 | Yes | HD Graphics |
SLBNE | 661 | 3.33 GHz | 3.60 GHz | 2 | Yes | HD Graphics |
SLBTK | 660 | 3.33 GHz | 3.60 GHz | 2 | Yes | HD Graphics |
SLBLV | 660 | 3.33 GHz | 3.60 GHz | 2 | Yes | HD Graphics |
SLBXL | 655K | 3.20 GHz | 3.46 GHz | 2 | Yes | HD Graphics |
SLBTJ | 650 | 3.20 GHz | 3.46 GHz | 2 | Yes | HD Graphics |
SLBLK | 650 | 3.20 GHz | 3.46 GHz | 2 | Yes | HD Graphics |
sSpec | Model | Video Clock | L3 Cache | Tech. | TDP (W) | Max. Temp. (°C)* | Voltage (V) |
SLBRP | 760 | No | 8 MiB | 45 nm | 95 | 72.7 | 0.65 – 1.4 |
SLBLH | 750S | No | 8 MiB | 45 nm | 82 | 76.7 | 0.65 – 1.4 |
SLBLC | 750 | No | 8 MiB | 45 nm | 95 | 72.7 | 0.65 – 1.4 |
SLBTM | 680 | 733 MHz | 4 MiB | 32 nm | 73 | 72.6 | 0.65 – 1.4 |
SLBLT | 670 | 733 MHz | 4 MiB | 32 nm | 73 | 72.6 | 0.65 – 1.4 |
SLBTB | 661 | 900 MHz | 4 MiB | 32 nm | 87 | 69.8 | 0.65 – 1.4 |
SLBNE | 661 | 900 MHz | 4 MiB | 32 nm | 87 | 69.8 | 0.65 – 1.4 |
SLBTK | 660 | 733 MHz | 4 MiB | 32 nm | 73 | 72.6 | 0.65 – 1.4 |
SLBLV | 660 | 733 MHz | 4 MiB | 32 nm | 73 | 72.6 | 0.65 – 1.4 |
SLBXL | 655K | 733 MHz | 4 MiB | 32 nm | 73 | 72.6 | 0.65 – 1.4 |
SLBTJ | 650 | 733 MHz | 4 MiB | 32 nm | 73 | 72.6 | 0.65 – 1.4 |
SLBLK | 650 | 733 MHz | 4 MiB | 32 nm | 73 | 72.6 | 0.65 – 1.4 |
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.
The first-generation Core i5 targeted to laptops, named 4xx and 5xx, uses the Nehalem microarchitecture. They can use two different pinouts, BGA1288 or socket G1, and have an integrated dual-channel DDR3 memory controller supporting 800 MHz and 1,066 MHz DDR3 memories. (“UM” models support only DDR3-800 memories.) They have an integrated PCI Express 2.0 controller supporting one x16 connection and an integrated DirectX 10 video controller running at 500 MHz with a 766 MHz “boost” clock (166 MHz with a 500 MHz “boost” clock in “UM” models). Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, which is listed as 2.5 GT/s by Intel). The models listed below support two video monitors.
All Core i5 mobile CPUs are dual-core processors supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.
sSpec | Model | Clock | Turbo Boost | Cores | HT | Video |
SLC28 | 580M | 2.66 GHz | 3.33 GHz | 2 | Yes | HD Graphics |
SLC29 | 580M | 2.66 GHz | 3.33 GHz | 2 | Yes | HD Graphics |
SLBSN | 560UM | 1.33 GHz | 2.13 GHz | 2 | Yes | HD Graphics |
SLBTS | 560M | 2.66 GHz | 3.20 GHz | 2 | Yes | HD Graphics |
SLBTT | 560M | 2.66 GHz | 3.20 GHz | 2 | Yes | HD Graphics |
SLBUJ | 540UM | 1.20 GHz | 2.00 GHz | 2 | Yes | HD Graphics |
SLBTV | 540M | 2.53 GHz | 3.06 GHz | 2 | Yes | HD Graphics |
SLBPF | 540M | 2.53 GHz | 3.06 GHz | 2 | Yes | HD Graphics |
SLBPG | 540M | 2.53 GHz | 3.06 GHz | 2 | Yes | HD Graphics |
SLBU3 | 520M | 2.40 GHz | 2.93 GHz | 2 | Yes | HD Graphics |
SLBNA | 520M | 2.40 GHz | 2.93 GHz | 2 | Yes | HD Graphics |
SLBNB | 520M | 2.40 GHz | 2.93 GHz | 2 | Yes | HD Graphics |
SLBQP | 520UM | 1.06 GHz | 1.86 GHz | 2 | Yes | HD Graphics |
SLC27 | 480M | 2.66 GHz | 2.93 GHz | 2 | Yes | HD Graphics |
SLC26 | 480M | 2.66 GHz | 2.93 GHz | 2 | Yes | HD Graphics |
SLBXP | 470UM | 1.33 GHz | 1.86 GHz | 2 | Yes | HD Graphics |
SLBZW | 460M | 2.53 GHz | 2.80 GHz | 2 | Yes | HD Graphics |
SLC22 | 460M | 2.53 GHz | 2.80 GHz | 2 | Yes | HD Graphics |
SLBTZ | 450M | 2.40 GHz | 2.66 GHz | 2 | Yes | HD Graphics |
SLBPM | 430M | 2.26 GHz | 2.53 GHz | 2 | Yes | HD Graphics |
SLBPN | 430M | 2.26 GHz | 2.53 GHz | 2 | Yes | HD Graphics |
SLBVS | 430UM | 1.20 GHz | 1.73 GHz | 2 | Yes | HD Graphics |
sSpec | Model | Video Clock | Video Boost | Tech. | L3 Cache | TDP (W) | Max. Temp. (°C)* | Package |
SLC28 | 580M | 500 MHz | 766 MHz | 32 nm | 3 MiB | 35 | 105 | G1 |
SLC29 | 580M | 500 MHz | 766 MHz | 32 nm | 3 MiB | 35 | 105 | BGA1288 |
SLBSN | 560UM | 166 MHz | 500 MHz | 32 nm | 3 MiB | 18 | 105 | BGA1288 |
SLBTS | 560M | 500 MHz | 766 MHz | 32 nm | 3 MiB | 35 | 105 | G1 |
SLBTT | 560M | 500 MHz | 766 MHz | 32 nm | 3 MiB | 35 | 105 | BGA1288 |
SLBUJ | 540UM | 166 MHz | 500 MHz | 32 nm | 3 MiB | 18 | 105 | BGA1288 |
SLBTV | 540M | 500 MHz | 766 MHz | 32 nm | 3 MiB | 35 | 105 | G1 |
SLBPF | 540M | 500 MHz | 766 MHz | 32 nm | 3 MiB | 35 | 105 | BGA1288 |
SLBPG | 540M | 500 MHz | 766 MHz | 32 nm | 3 MiB | 35 | 105 | G1 |
SLBU3 | 520M | 500 MHz | 766 MHz | 32 nm | 3 MiB | 35 | 105 | G1 |
SLBNA | 520M | 500 MHz | 766 MHz | 32 nm | 3 MiB | 35 | 105 | BGA1288 |
SLBNB | 520M | 500 MHz | 766 MHz | 32 nm | 3 MiB | 35 | 105 | G1 |
SLBQP | 520UM | 166 MHz | 500 MHz | 32 nm | 3 MiB | 18 | 105 | BGA1288 |
SLC27 | 480M | 500 MHz | 766 MHz | 32 nm | 3 MiB | 35 | 105 | G1 |
SLC26 | 480M | 500 MHz | 766 MHz | 32 nm | 3 MiB | 35 | 105 | BGA1288 |
SLBXP | 470UM | 166 MHz | 500 MHz | 32 nm | 3 MiB | 18 | 105 | BGA1288 |
SLBZW | 460M | 500 MHz | 766 MHz | 32 nm | 3 MiB | 35 | 105 | G1 |
SLC22 | 460M | 500 MHz | 766 MHz | 32 nm | 3 MiB | 35 | 105 | BGA1288 |
SLBTZ | 450M | 500 MHz | 766 MHz | 32 nm | 3 MiB | 35 | 105 | G1 |
SLBPM | 430M | 500 MHz | 766 MHz | 32 nm | 3 MiB | 35 | 105 | BGA1288 |
SLBPN | 430M | 500 MHz | 766 MHz | 32 nm | 3 MiB | 35 | 105 | G1 |
SLBVS | 430UM | 166 MHz | 500 MHz | 32 nm | 3 MiB | 18 | 105 | BGA1288 |
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.
In the table below, we listed all Core i5-2xxx desktop CPU models, which are based on the Sandy Bridge microarchitecture. They are also called second-generation Core i5 processors and use the socket LGA1155. The integrated memory controller supports dual-channel architecture as well as 1,066 MHz and 1,333 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). All models (except the 2550K and the “P” models) have an integrated DirectX 10.1 video controller running at 650 MHz with a 1.25 GHz “boost” clock or 850 MHz with a 1.1 GHz “boost” clock, with six (HD 2000) or 12 (HD 3000) processing cores. Models with integrated video support two displays.
Second-generation Core i5 desktop CPUs with four cores don’t support the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having four cores. However, while on quad-core models these cores are all “real,” on the dual-core model two of these cores are “real” and the other two are simulated.
sSpec | Model | Clock | Turbo Boost | Cores | HT | Video |
SR0QH | 2550K | 3.4 GHz | 3.8 GHz | 4 | No | No |
SR00A | 2500T | 2.3 GHz | 3.3 GHz | 4 | No | HD 2000 |
SR009 | 2500S | 2.7 GHz | 3.7 GHz | 4 | No | HD 2000 |
SR008 | 2500K | 3.3 GHz | 3.7 GHz | 4 | No | HD 3000 |
SR00T | 2500 | 3.3 GHz | 3.7 GHz | 4 | No | HD 2000 |
SR0G1 | 2450P | 3.2 GHz | 3.5 GHz | 4 | No | No |
SR0BB | 2405S | 2.5 GHz | 3.3 GHz | 4 | No | HD 3000 |
SR00S | 2400S | 2.5 GHz | 3.3 GHz | 4 | No | HD 2000 |
SR00Q | 2400 | 3.1 GHz | 3.4 GHz | 4 | No | HD 2000 |
SR065 | 2390T | 2.7 GHz | 3.5 GHz | 2 | Yes | HD 2000 |
SR0G2 | 2380P | 3.1 GHz | 3.4 GHz | 4 | No | No |
SR02L | 2320 | 3.0 GHz | 3.3 GHz | 4 | No | HD 2000 |
SR02K | 2310 | 2.9 GHz | 3.2 GHz | 4 | No | HD 2000 |
SR00D | 2300 | 2.8 GHz | 3.1 GHz | 4 | No | HD 2000 |
sSpec | Model | Video Clock | Video Boost | L3 Cache | Tech. | TDP (W) | Max. Temp. (°C)* | Voltage (V) |
SR0QH | 2550K | No | No | 6 MiB | 32 nm | 95 | 72.6 | NA |
SR00A | 2500T | 650 MHz | 1.25 GHz | 6 MiB | 32 nm | 45 | 69.8 | NA |
SR009 | 2500S | 850 MHz | 1.1 GHz | 6 MiB | 32 nm | 65 | 69.1 | NA |
SR008 | 2500K | 850 MHz | 1.1 GHz | 6 MiB | 32 nm | 95 | 72.6 | NA |
SR00T | 2500 | 850 MHz | 1.1 GHz | 6 MiB | 32 nm | 95 | 72.6 | NA |
SR0G1 | 2450P | No | No | 6 MiB | 32 nm | 95 | 72.6 | NA |
SR0BB | 2405S | 850 MHz | 1.1 GHz | 6 MiB | 32 nm | 65 | 69.1 | NA |
SR00S | 2400S | 850 MHz | 1.1 GHz | 6 MiB | 32 nm | 65 | 69.1 | NA |
SR00Q | 2400 | 850 MHz | 1.1 GHz | 6 MiB | 32 nm | 95 | 72.6 | NA |
SR065 | 2390T | 650 MHz | 1.25 GHz | 3 MiB | 32 nm | 35 | 65.0 | NA |
SR0G2 | 2380P | No | No | 6 MiB | 32 nm | 95 | 72.6 | NA |
SR02L | 2320 | 850 MHz | 1.1 GHz | 6 MiB | 32 nm | 95 | 72.6 | NA |
SR02K | 2310 | 850 MHz | 1.1 GHz | 6 MiB | 32 nm | 95 | 72.6 | NA |
SR00D | 2300 | 850 MHz | 1.1 GHz | 6 MiB | 32 nm | 95 | 72.6 | NA |
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.
[nextpage title=”Core i5-2xxx Models (Mobile)”]
The second-generation Core i5 targeted to laptops, which use the Sandy Bridge microarchitecture, can use two different pinouts, BGA1023 or socket G2, and have an integrated dual-channel DDR3 memory controller supporting 1,066 MHz, 1,333 MHz, and 1,600 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an integrated DirectX 10.1 video controller running at 350 MHz with a 1.2 GHz “boost” clock on models with a TDP of 17 W, or 650 MHz with a 1.3 GHz “boost” clock on models with a TDP of 35 W, all with 12 processing cores (HD 3000 graphics engine).
All Core i5 mobile CPUs are dual-core processors supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.
sSpec | Model | Clock | Turbo Boost | Cores | HT | Video |
SR0CS | 2557M | 1.7 GHz | 2.7 GHz | 2 | Yes | HD 3000 |
SR044 | 2540M | 2.6 GHz | 3.3 GHz | 2 | Yes | HD 3000 |
SR046 | 2540M | 2.6 GHz | 3.3 GHz | 2 | Yes | HD 3000 |
SR03W | 2537M | 1.4 GHz | 2.3 GHz | 2 | Yes | HD 3000 |
SR048 | 2520M | 2.5 GHz | 3.2 GHz | 2 | Yes | HD 3000 |
NA | 2520M | 2.5 GHz | 3.2 GHz | 2 | Yes | HD 3000 |
SR02U | 2510E | 2.5 GHz | 3.1 GHz | 2 | Yes | HD 3000 |
SR0D6 | 2467M | 1.6 GHz | 2.3 GHz | 2 | Yes | HD 3000 |
SR0CH | 2450M | 2.5 GHz | 3.1 GHz | 2 | Yes | HD 3000 |
SR06Z | 2450M | 2.5 GHz | 3.1 GHz | 2 | Yes | HD 3000 |
SR04Z | 2450M | 2.5 GHz | 3.1 GHz | 2 | Yes | HD 3000 |
NA | 2435M | 2.4 GHz | 3 GHz | 2 | Yes | HD 3000 |
NA | 2435M | 2.4 GHz | 3 GHz | 2 | Yes | HD 3000 |
SR04W | 2430M | 2.4 GHz | 3 GHz | 2 | Yes | HD 3000 |
NA | 2430M | 2.4 GHz | 3 GHz | 2 | Yes | HD 3000 |
SR04B | 2410M | 2.3 GHz | 2.9 GHz | 2 | Yes | HD 3000 |
SR04G | 2410M | 2.3 GHz | 2.9 GHz | 2 | Yes | HD 3000 |
sSpec | Model | Video Clock | Video Boost | Tech. | L3 Cache | TDP (W) | Max. Temp. (°C)* | Package |
SR0CS | 2557M | 350 MHz | 1.2 GHz | 32 nm | 3 MiB | 17 | 100 | BGA1023 |
SR044 | 2540M | 650 MHz | 1.3 GHz | 32 nm | 3 MiB | 35 | 100 | G2 |
SR046 | 2540M | 650 MHz | 1.3 GHz | 32 nm | 3 MiB | 35 | 100 | BGA1023 |
SR03W | 2537M | 350 MHz | 1.2 GHz | 32 nm | 3 MiB | 17 | 100 | BGA1023 |
SR048 | 2520M | 650 MHz | 1.3 GHz | 32 nm | 3 MiB | 35 | 100 | G2 |
NA | 2520M | 650 MHz | 1.3 GHz | 32 nm | 3 MiB | 35 | 100 | BGA1023 |
SR02U | 2510E | 650 MHz | 1.3 GHz | 32 nm | 3 MiB | 35 | 100 | G2 |
SR0D6 | 2467M | 350 MHz | 1.2 GHz | 32 nm | 3 MiB | 17 | 100 | BGA1023 |
SR0CH | 2450M | 650 MHz | 1.3 GHz | 32 nm | 3 MiB | 35 | 100 | G2 |
SR06Z | 2450M | 650 MHz | 1.3 GHz | 32 nm | 3 MiB | 35 | 100 | BGA1023 |
SR04Z | 2450M | 650 MHz | 1.3 GHz | 32 nm | 3 MiB | 35 | 100 | BGA1023 |
NA | 2435M | 650 MHz | 1.3 GHz | 32 nm | 3 MiB | 35 | 100 | G2 |
NA | 2435M | 650 MHz | 1.3 GHz | 32 nm | 3 MiB | 35 | 100 | BGA1023 |
SR04W | 2430M | 650 MHz | 1.3 GHz | 32 nm | 3 MiB | 35 | 100 | G2 |
NA | 2430M | 650 MHz | 1.3 GHz | 32 nm | 3 MiB | 35 | 100 | BGA1023 |
SR04B | 2410M | 650 MHz | 1.3 GHz | 32 nm | 3 MiB | 35 | 100 | G2 |
SR04G | 2410M | 650 MHz | 1.3 GHz | 32 nm | 3 MiB | 35 | 100 | BGA1023 |
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.
The Core i5-3xxx models are based on the Ivy Bridge microarchitecture and are also known as the third-generation Core i5 processors. They use the socket LGA1155, the same used by the second-generation Core i5 processors. The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). All models (except the “P” models) have an integrated DirectX 11 video controller with six (Intel HD 2500 graphics) or 12 (Intel HD 4000 graphics) processing units, running at 650 MHz with a “boost” clock of 1.25 GHz on 35xx models, 1.1 GHz on 34xx models or 1.05 GHz on 33xx models. Models with integrated video support three displays (previous generations support two).
sSpec | Model | Clock | Turbo Boost | Cores | HT | Video |
SR0PM | 3570K | 3.4 GHz | 3.8 GHz | 4 | No | HD 4000 |
SR0T7 | 3570 | 3.4 GHz | 3.8 GHz | 4 | No | HD 2500 |
SR0P1 | 3570T | 2.3 GHz | 3.3 GHz | 4 | No | HD 2500 |
SR0T9 | 3570S | 3.1 GHz | 3.8 GHz | 4 | No | HD 2500 |
SR0P0 | 3550 | 3.3 GHz | 3.7 GHz | 4 | No | HD 2500 |
SR0P3 | 3550S | 3 GHz | 3.7 GHz | 4 | No | HD 2500 |
SR0PP | 3475S | 2.9 GHz | 3.6 GHz | 4 | No | HD 2500 |
SR0T8 | 3470 | 3.2 GHz | 3.6 GHz | 4 | No | HD 2500 |
SR0RJ | 3470T | 2.9 GHz | 3.6 GHz | 4 | No | HD 2500 |
SR0TA | 3470S | 2.9 GHz | 3.6 GHz | 4 | No | HD 2500 |
SR0PF | 3450 | 3.1 GHz | 3.5 GHz | 4 | No | HD 2500 |
SR0P2 | 3450S | 2.8 GHz | 3.5 GHz | 4 | No | HD 2500 |
SR0WS | 3350P | 3.1 GHz | 3.3 GHz | 4 | No | No |
SR0RQ | 3330 | 3 GHz | 3.2 GHz | 4 | No | HD 2500 |
SR0RR | 3330S | 2.7 GHz | 3.2 GHz | 4 | No | HD 2500 |
sSpec | Model | Video Clock | Video Boost | Tech. | L3 Cache | TDP (W) | Max. Temp. (°C)* | Voltage (V) |
SR0PM | 3570K | 650 MHz | 1.15 GHz | 22 nm | 6 MiB | 77 | 67.4 | NA |
SR0T7 | 3570 | 650 MHz | 1.15 GHz | 22 nm | 6 MiB | 77 | 67.4 | NA |
SR0P1 | 3570T | 650 MHz | 1.15 GHz | 22 nm | 6 MiB | 45 | 69.8 | NA |
SR0T9 | 3570S | 650 MHz | 1.15 GHz | 22 nm | 6 MiB | 65 | 69.1 | NA |
SR0P0 | 3550 | 650 MHz | 1.15 GHz | 22 nm | 6 MiB | 77 | 67.4 | NA |
SR0P3 | 3550S | 650 MHz | 1.1 GHz | 22 nm | 6 MiB | 65 | 69.1 | NA |
SR0PP | 3475S | 650 MHz | 1.1 GHz | 22 nm | 6 MiB | 65 | 69.1 | NA |
SR0T8 | 3470 | 650 MHz | 1.1 GHz | 22 nm | 6 MiB | 77 | 67.4 | NA |
SR0RJ | 3470T | 650 MHz | 1.1 GHz | 22 nm | 6 MiB | 35 | 65.0 | NA |
SR0TA | 3470S | 650 MHz | 1.1 GHz | 22 nm | 6 MiB | 65 | 69.1 | NA |
SR0PF | 3450 | 650 MHz | 1.1 GHz | 22 nm | 6 MiB | 77 | 67.4 | NA |
SR0P2 | 3450S | 650 MHz | 1.1 GHz | 22 nm | 6 MiB | 65 | 69.1 | NA |
SR0WS | 3350P | No | 1.05 GHz | 22 nm | 6 MiB | 69 | 67.4 | NA |
SR0RQ | 3330 | 650 MHz | 1.05 GHz | 22 nm | 6 MiB | 77 | 67.4 | NA |
SR0RR | 3330S | 650 MHz | 1.05 GHz | 22 nm | 6 MiB | 65 | NA | NA |
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.
As their desktop counterparts, the Core i5-3xxx models targeted to mobile computers are based on the Ivy Bridge microarchitecture and are also known as the third-generation Core i5 processors. They can use either the BGA1023 pinout or the socket S2 pinout. The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3, DDR3L, and DDR3L-RS memories. They also have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). All models have an integrated DirectX 11 video controller with 12 execution units (Intel HD 4000 graphics). This is one of the main differences between the mobile and the desktop models, since desktop models use the Intel HD 2500 graphics (six execution units). On “M” models, the graphics engine works at 650 MHz with 1.2 GHz at “boost” mode, while on “U” models, the graphics engine works at 350 MHz with a “boost” mode of 1.15 GHz on 34xx models or 1.05 GHz on 33xx models. All models support three displays (previous generations support two).
Differently from the desktop models, mobile third-generation Core i5 processors are dual-core CPUs with Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.
sSpec | Model | Clock | Turbo Boost | Cores | HT | Video |
SR0N7 | 3427U | 1.8 GHz | 2.8 GHz | 2 | Yes | HD 4000 |
SR0MV | 3360M | 2.8 GHz | 3.5 GHz | 2 | Yes | HD 4000 |
SR0MW | 3360M | 2.8 GHz | 3.5 GHz | 2 | Yes | HD 4000 |
SR0MX | 3320M | 2.6 GHz | 3.3 GHz | 2 | Yes | HD 4000 |
SR0MY | 3320M | 2.6 GHz | 3.3 GHz | 2 | Yes | HD 4000 |
SR0N8 | 3317U | 1.7 GHz | 2.6 GHz | 2 | Yes | HD 4000 |
SR0MZ | 3210M | 2.5 GHz | 3.1 GHz | 2 | Yes | HD 4000 |
NA | 3210M | 2.5 GHz | 3.1 GHz | 2 | Yes | HD 4000 |
sSpec | Model | Video Clock | Video Boost | Tech. | L3 Cache | TDP (W) | Max. Temp. (°C)* | Package |
SR0N7 | 3427U | 350 MHz | 1.15 GHz | 22 nm | 3 MiB | 17 | 105 | BGA1023 |
SR0MV | 3360M | 650 MHz | 1.2 GHz | 22 nm | 3 MiB | 35 | 105 | G2 |
SR0MW | 3360M | 650 MHz | 1.2 GHz | 22 nm | 3 MiB | 35 | 105 | BGA1023 |
SR0MX | 3320M | 650 MHz | 1.2 GHz | 22 nm | 3 MiB | 35 | 105 | G2 |
SR0MY | 3320M | 650 MHz | 1.2 GHz | 22 nm | 3 MiB | 35 | 105 | BGA1023 |
SR0N8 | 3317U | 350 MHz | 1.05 GHz | 22 nm | 3 MiB | 17 | 105 | BGA1023 |
SR0MZ | 3210M | 650 MHz | 1.2 GHz | 22 nm | 3 MiB | 35 | 105 | G2 |
NA | 3210M | 650 MHz | 1.2 GHz | 22 nm | 3 MiB | 35 | 105 | BGA1023 |
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.
Core i5-4xxx models are based on the Haswell microarchitecture and are also known as the fourth-generation Core i5 processors. They use a new socket, LGA1150, which is not compatible with motherboards developed for previous models.
The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).
These processors support AVX2 instructions, not available on previous models.
All models have an integrated DirectX 11.1 video controller, and two engines are available at the moment: HD 4600 (codenamed “GT2”, 20 processing units) and Iris Pro 5200 (codenamed “GT3e”, 40 processing units, and video memory integrated into the CPU).
sSpec | Model | Clock | Turbo Clock | Cores | HT | Video |
SR14D | 4670 | 3.4 GHz | 3.8 GHz | 4 | No | HD 4600 |
SR14A | 4670K | 3.4 GHz | 3.8 GHz | 4 | No | HD 4600 |
SR14K | 4670S | 3.1 GHz | 3.8 GHz | 4 | No | HD 4600 |
NA | 4670R | 3.0 GHz | 3.7 GHz | 4 | No | Iris Pro 5200 |
SR14P | 4670T | 2.3 GHz | 3.3 GHz | 4 | No | HD 4600 |
SR14E | 4570 | 3.2 GHz | 3.6 GHz | 4 | No | HD 4600 |
SR14J | 4570S | 2.9 GHz | 3.6 GHz | 4 | No | HD 4600 |
SR1CA | 4570T | 2.9 GHz | 3.6 GHz | 2 | Sim | HD 4600 |
NA | 4570R | 2.7 GHz | 3.2 GHz | 4 | No | Iris Pro 5200 |
SR14F | 4440 | 3.1 GHz | 3.3 GHz | 4 | No | HD 4600 |
SR14L | 4440S | 2.8 GHz | 3.3 GHz | 4 | No | HD 4600 |
SR14G | 4430 | 3.0 GHz | 3.2 GHz | 4 | No | HD 4600 |
SR14M | 4430S | 2.7 GHz | 3.2 GHz | 4 | No | HD 4600 |
sSpec | Model | Video Clock | Video Boost | Tech. | L3 Cache | TDP (W) | Max. Temp. (°C)* |
SR14D | 4670 | 350 MHz | 1.2 GHz | 22 nm | 6 MiB | 84 | 72.72 |
SR14A | 4670K | 350 MHz | 1.2 GHz | 22 nm | 6 MiB | 84 | 72.72 |
SR14K | 4670S | 350 MHz | 1.2 GHz | 22 nm | 6 MiB | 65 | 71.35 |
NA | 4670R | 200 MHz | 1.3 GHz | 22 nm | 4 MiB | 65 | 71.35 |
SR14P | 4670T | 350 MHz | 1.2 GHz | 22 nm | 6 MiB | 45 | 71.45 |
SR14E | 4570 | 350 MHz | 1.15 GHz | 22 nm | 6 MiB | 84 | 72.72 |
SR14J | 4570S | 350 MHz | 1.15 GHz | 22 nm | 6 MiB | 65 | 71.35 |
SR1CA | 4570T | 200 MHz | 1.15 GHz | 22 nm | 4 MiB | 35 | 66.35 |
NA | 4570R | 200 MHz | 1.15 GHz | 22 nm | 4 MiB | 65 | 71.35 |
SR14F | 4440 | 350 MHz | 1.1 GHz | 22 nm | 6 MiB | 84 | NA |
SR14L | 4440S | 350 MHz | 1.1 GHz | 22 nm | 6 MiB | 65 | NA |
SR14G | 4430 | 350 MHz | 1.1 GHz | 22 nm | 6 MiB | 84 | 72.72 |
SR14M | 4430S | 350 MHz | 1.1 GHz | 22 nm | 6 MiB | 65 | 71.35 |
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.
The fourth-generation Core i3 processors targeted to mobile computers are based on the Haswell microarchitecture.
These processors support AVX2 instructions, not available on previous models.
The “U” and “Y” models carry an integrated south bridge chip with a four-port USB 3.0 controller and a four-port SATA-600 controller. On these models, the PCI Express controller supports only one x4 connection or four x1 connections. On the other models, the PCI Express controller supports one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).
Several graphics engines are available, all DirectX 11.1: HD 4200 (codenamed “GT1”, 10 processing units), HD 4400 (codenamed “GT2”, 20 processing units), HD 4600 (codenamed “GT2”, 20 processing units), HD 5000 (codenamed “GT3”, 40 processing units), and Iris 5100 (codenamed “GT3”, 40 processing units).
The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3L and LPDDR3 (on models “U” and “Y”) memories.
Differently from the desktop models, mobile third-generation Core i5 processors are dual-core CPUs with Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.
sSpec | Model | Clock | Turbo Clock | Cores | HT | Video |
SR17Q | 4402E | 1.6 GHz | 2.7 GHz | 2 | Yes | HD 4600 |
SR17M | 4400E | 2.7 GHz | 3.3 GHz | 2 | Yes | HD 4600 |
SR16L | 4350U | 1.4 GHz | 2.9 GHz | 2 | Yes | HD 5000 |
NA | 4330M | 2.8 GHz | 3.5 GHz | 2 | Yes | HD 4600 |
NA | 4302Y | 1.6 GHz | 2.3 GHz | 2 | Yes | HD 4200 |
NA | 4300M | 2.6 GHz | 3.3 GHz | 2 | Yes | HD 4600 |
SR1ED | 4300U | 1.9 GHz | 2.9 GHz | 2 | Yes | HD 4400 |
SR192 | 4300Y | 1.6 GHz | 2.3 GHz | 2 | Yes | HD 4200 |
SR189 | 4288U | 2.6 GHz | 3.1 GHz | 2 | Yes | Iris 5100 |
SR18A | 4358U | 2.4 GHz | 2.9 GHz | 2 | Yes | Iris 5100 |
SR16M | 4250U | 1.3 GHz | 2.6 GHz | 2 | Yes | HD 5000 |
SR191 | 4210Y | 1.5 GHz | 1.9 GHz | 2 | Yes | HD 4200 |
NA | 4202Y | 1.6 GHz | 2.0 GHz | 2 | Yes | HD 4200 |
SR15G | 4200H | 2.8 GHz | 3.4 GHz | 2 | Yes | HD 4600 |
SR1HA | 4200M | 2.5 GHz | 3.1 GHz | 2 | Yes | HD 4600 |
SR170 | 4200U | 1.6 GHz | 2.6 GHz | 2 | Yes | HD 4400 |
SR18T | 4200Y | 1.4 GHz | 1.9 GHz | 2 | Yes | HD 4200 |
sSpec | Model | Video Clock | Video Boost | Tech. | L3 Cache | TDP (W) | Max. Temp. (°C)* | Package |
SR17Q | 4402E | NA | NA | 22 nm | 3 MiB | 25 | 100 | FCBGA1364 |
SR17M | 4400E | 400 MHz | 1 GHz | 22 nm | 3 MiB | 37 | 100 | FCBGA1364 |
SR16L | 4350U | 200 MHz | 1.1 GHz | 22 nm | 3 MiB | 15 | 100 | FCBGA1168 |
NA | 4330M | 400 MHz | 1.25 GHz | 22 nm | 3 MiB | 37 | 100 | NA |
NA | 4302Y | 200 MHz | 850 MHz | 22 nm | 3 MiB | 11.5 | 100 | NA |
NA | 4300M | 400 MHz | 1.25 GHz | 22 nm | 3 MiB | 37 | 100 | NA |
SR1ED | 4300U | 200 MHz | 1.1 GHz | 22 nm | 3 MiB | 15 | 100 | FCBGA1168 |
SR192 | 4300Y | 200 MHz | 850 MHz | 22 nm | 3 MiB | 11.5 | 100 | FCBGA1168 |
SR189 | 4288U | 200 MHz | 1.2 GHz | 22 nm | 3 MiB | 28 | 100 | FCBGA1168 |
SR18A | 4358U | 200 MHz | 1.1 GHz | 22 nm | 3 MiB | 28 | 100 | FCBGA1168 |
SR16M | 4250U | 200 MHz | 1 GHz | 22 nm | 3 MiB | 15 | 100 | FCBGA1168 |
SR191 | 4210Y | 200 MHz | 850 MHz | 22 nm | 3 MiB | 11.5 | 100 | FCBGA1168 |
NA | 4202Y | 200 MHz | 850 MHz | 22 nm | 3 MiB | 11.5 | 100 | NA |
SR15G | 4200H | 400 MHz | 1.15 GHz | 22 nm | 3 MiB | 47 | 100 | FCBGA1364 |
SR1HA | 4200M | 400 MHz | 1.15 GHz | 22 nm | 3 MiB | 37 | 100 | FCPGA946 |
SR170 | 4200U | 200 MHz | 1 GHz | 22 nm | 3 MiB | 15 | 100 | FCBGA1168 |
SR18T | 4200Y | 200 MHz | 850 MHz | 22 nm | 3 MiB | 11.5 | 100 | FCBGA1168 |
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.
Last update on 2023-03-22 at 22:26 / Affiliate links / Images from Amazon Product Advertising API
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