[nextpage title=”Introduction”]
The Core i5 is a CPU series manufactured by Intel aimed at mid-range computers. In this tutorial, we will present a series of quick reference tables for you to compare the main differences between all models released to date.
By the way, the correct name of this line of processors is “Core i5,” not “Intel i5.”
Currently, there are four different generations of Core i5 processors available. In the table below, we describe the main differences between these generations.

No products found.

Model

7xx

6xx

4xx and 5xx

2xxx

2xxx

Market

Desktop

Desktop

Mobile

Desktop

Mobile

Generation

First

First

First

Second

Second

Microarchitecture

Nehalem

Nehalem

Nehalem

Sandy Bridge

Sandy Bridge

Manufacturing Process

45 nm

32 nm

32 nm

32 nm

32 nm

Number of Cores

4

2

2

4†

2

Hyper-Threading

No

Yes

Yes

No†

Yes

L1 cache (per core)

32 kiB+32 kiB

32 kiB+32 kiB

32 kiB+32kB

32 kiB+32 kiB

32 kiB+32kB

L2 cache (per core)

256 kiB

256 kiB

256 kiB

256 kiB

256 kiB

L3 cache (total)

8 MiB

4 MiB

3 MiB

6 MiB†

3 MiB

DMI bus

1 GB/s

1 GB/s

1 GB/s

2 GB/s

2 GB/s

Memory (DDR3)

1066, 1333

1066, 1333

800, 1066

1066, 1333

1066, 1333, 1600 

DDR3L and DDR3L-RS

No

No

No

No

No

Graphics Engine

No

HD Graphics

HD Graphics

HD 2000 or HD 3000‡

HD 3000

DirectX

No

10

10

10.1‡

10.1

Graphics Processors

No

12

6

6 or 12‡

12

Graphics Base Clock

No

733 MHz or 900 MHz

166 MHz or 500 MHz

650 MHz or 850 MHz‡

350 MHz or 650 MHz

Graphics Boost Clock

No

No

500 MHz or 766 MHz

1.25 GHz or 1.1 GHz‡

1.2 GHz or 1.3 GHz

Displays Supported

None

2

2

2‡

2

PCIe Controller

2.0

2.0

2.0

2.0

2.0

PCIe Configuration

1×16, 2×8

1×16, 2×8

1×16

1×16, 2×8, 1×8, 2×4

1×16, 2×8, 1×8, 2×4

Turbo Boost

1.0

1.0

1.0

2.0

2.0

EM64T

Yes

Yes

Yes

Yes

Yes

Virtualization

Yes

Yes

Yes

Yes

Yes

SSE4.2

Yes

Yes

Yes

Yes

Yes

AES-NI

No

Yes

Yes

Yes

Yes

AVX

No

No

No

Yes

Yes

AVX2

No

No

No

No

No

Base Clock

133 MHz

133 MHz

133 MHz

100 MHz

100 MHz

Pinout

LGA1156

LGA1156

G1 or BGA1288

LGA1155

G2 or BGA1023

 

Model

3xxx

3xxx

4xxx

4xxx

Market

Desktop

Mobile

Desktop

Portátil

Generation

Third

Third

Quarta

Quarta

Microarchitecture

Ivy Bridge

Ivy Bridge

Haswell

Haswell

Manufacturing Process

22 nm

22 nm

22 nm

22 nm

Number of Cores

4

2

4*

2

Hyper-Threading

No

Yes

No*

Yes

L1 cache (per core)

32 kiB+32kB

32 kiB+32 kiB

32 kiB+32 kiB

32 kiB+32 kiB

L2 cache (per core)

256 kiB

256 kiB

256 kiB

256 kiB

L3 cache (total)

6 MiB

3 MiB

4 MiB or 6 MiB

3 MiB

DMI bus

2 GB/s

2 GB/s

2 GB/s

2 GB/s

Memory (DDR3)

1333, 1600

1333, 1600

1333, 1600

1333, 1600

DDR3L and DDR3L-RS

No

Yes

Yes

Yes

Graphics Engine

HD 2500 or HD 4000‡

HD 4000

HD 4600 or Iris Pro 5200

HD 4200, HD 4400, HD 4600, HD 5000 or Iris 5100

DirectX

11‡

11

11.1

11.1

Graphics Processors

6 or 12‡

12

20 or 40

10, 20 or 40

Graphics Base Clock

650 MHz‡

350 MHz or 650 MHz

200 MHz or 350 MHz

200 MHz or 400 MHz

Graphics Boost Clock

1.05 GHz, 1.1 GHz or 1.15 GHz‡

1.05 GHz, 1.15 GHz or 1.2 GHz

1,1 GHz, 1,15 GHz, 1,2 GHz ou 1,3 GHz

850 GHz, 1 GHz, 1,1 GHz, 1,15 GHz ou 1,25 GHz

Displays Supported

3‡

3

3

3

PCIe Controller

3.0

3.0

3.0

3.0

PCIe Configuration

1×16, 2×8, 1×8, 2×4

1×16, 2×8, 1×8, 2×4

1×16, 2×8, 1×8, 2×4

1×16, 2×8, 1×8, 2×4 ou 1×4, 4×1

Turbo Boost

2.0

2.0

2.0

2.0

EM64T

Yes

Yes

Yes

Yes

Virtualization

Yes

Yes

Yes

Yes

SSE4.2

Yes

Yes

Yes

Yes

AES-NI

Yes

Yes

Yes

Yes

AVX

Yes

Yes

Yes

Yes

AVX2

No

No

Yes

Yes

Base Clock

100 MHz

100 MHz

100 MHz

100 MHz

Pinout

LGA1155

G2 or BGA1023

LGA1150

FCPGA946, FCBGA1168 or FCBGA1364

 
† Except for the model 2390T, which has two cores, supports the Hyper-Threading technology, and has 3 MiB of cache L3.
‡ The 2550K model and models ending with a “P” don’t have integrated video.
* Except for the 4570T model, which has two cores and supports the Hyper-Threading technology.
Let’s now take a detailed look at all Core i5 models launched so far.
 
[nextpage title=”Core i5-6xx and 7xx Models (Desktop)”]
In the table below, we listed all Core i5 6xx and Core i5 7xx CPU models. These are desktop models based on the Nehalem microarchitecture and are also called first-generation Core i5 processors. These models use the socket LGA1156. The integrated memory controller supports dual-channel architecture as well as 1,066 MHz and 1,333 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 datapath or two x8 datapaths. Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, listed as 2.5 GT/s by Intel). All 6xx models have an integrated DirectX 10 video controller with 12 execution units running at 733 MHz or 900 MHz, using an engine that is known as “Intel HD Graphics,” a feature not present on the 7xx models. Models with integrated video support two video monitors.
The 7xx models are quad-core CPUs without the Hyper-Threading technology, while the 6xx models are dual-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having four cores. However, while on the 7xx models these cores are all “real,” on the 6xx models two of these cores are “real” and the other two are simulated.

sSpec Model Clock Turbo Boost Cores HT Video Video Clock L3 Cache Tech. TDP (W) Max. Temp. (°C)* Voltage (V)
SLBRP 760 2.80 GHz 3.46 GHz 4 No No No 8 MiB 45 nm 95 72.7 0.65 – 1.4
SLBLH 750S 2.40 GHz 3.20 GHz 4 No No No 8 MiB 45 nm 82 76.7 0.65 – 1.4
SLBLC 750 2.66 GHz 3.20 GHz 4 No No No 8 MiB 45 nm 95 72.7 0.65 – 1.4
SLBTM 680 3.60 GHz 3.86 GHz 2 Yes HD Graphics 733 MHz 4 MiB 32 nm 73 72.6 0.65 – 1.4
SLBLT 670 3.56 GHz 3.73 GHz 2 Yes HD Graphics 733 MHz 4 MiB 32 nm 73 72.6 0.65 – 1.4
SLBTB 661 3.33 GHz 3.60 GHz 2 Yes HD Graphics 900 MHz 4 MiB 32 nm 87 69.8 0.65 – 1.4
SLBNE 661 3.33 GHz 3.60 GHz 2 Yes HD Graphics 900 MHz 4 MiB 32 nm 87 69.8 0.65 – 1.4
SLBTK 660 3.33 GHz 3.60 GHz 2 Yes HD Graphics 733 MHz 4 MiB 32 nm 73 72.6 0.65 – 1.4
SLBLV 660 3.33 GHz 3.60 GHz 2 Yes HD Graphics 733 MHz 4 MiB 32 nm 73 72.6 0.65 – 1.4
SLBXL 655K 3.20 GHz 3.46 GHz 2 Yes HD Graphics 733 MHz 4 MiB 32 nm 73 72.6 0.65 – 1.4
SLBTJ 650 3.20 GHz 3.46 GHz 2 Yes HD Graphics 733 MHz 4 MiB 32 nm 73 72.6 0.65 – 1.4
SLBLK 650 3.20 GHz 3.46 GHz 2 Yes HD Graphics 733 MHz 4 MiB 32 nm 73 72.6 0.65 – 1.4

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.
[nextpage title=”Core i5-4xx and 5xx Models (Mobile)”]
The first-generation Core i5 targeted to laptops, named 4xx and 5xx, uses the Nehalem microarchitecture. They can use two different pinouts, BGA1288 or socket G1, and have an integrated dual-channel DDR3 memory controller supporting 800 MHz and 1,066 MHz DDR3 memories. (“UM” models support only DDR3-800 memories.) They have an integrated PCI Express 2.0 controller supporting one x16 connection and an integrated DirectX 10 video controller running at 500 MHz with a 766 MHz “boost” clock (166 MHz with a 500 MHz “boost” clock in “UM” models). Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, which is listed as 2.5 GT/s by Intel). The models listed below support two video monitors.
All Core i5 mobile CPUs are dual-core processors supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec Model Clock Turbo Boost Cores HT Video Video Clock Video Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)* Package
SLC28 580M 2.66 GHz 3.33 GHz 2 Yes HD Graphics 500 MHz 766 MHz 32 nm 3 MiB 35 105 G1
SLC29 580M 2.66 GHz 3.33 GHz 2 Yes HD Graphics 500 MHz 766 MHz 32 nm 3 MiB 35 105 BGA1288
SLBSN 560UM 1.33 GHz 2.13 GHz 2 Yes HD Graphics 166 MHz 500 MHz 32 nm 3 MiB 18 105 BGA1288
SLBTS 560M 2.66 GHz 3.20 GHz 2 Yes HD Graphics 500 MHz 766 MHz 32 nm 3 MiB 35 105 G1
SLBTT 560M 2.66 GHz 3.20 GHz 2 Yes HD Graphics 500 MHz 766 MHz 32 nm 3 MiB 35 105 BGA1288
SLBUJ 540UM 1.20 GHz 2.00 GHz 2 Yes HD Graphics 166 MHz 500 MHz 32 nm 3 MiB 18 105 BGA1288
SLBTV 540M 2.53 GHz 3.06 GHz 2 Yes HD Graphics 500 MHz 766 MHz 32 nm 3 MiB 35 105 G1
SLBPF 540M 2.53 GHz 3.06 GHz 2 Yes HD Graphics 500 MHz 766 MHz 32 nm 3 MiB 35 105 BGA1288
SLBPG 540M 2.53 GHz 3.06 GHz 2 Yes HD Graphics 500 MHz 766 MHz 32 nm 3 MiB 35 105 G1
SLBU3 520M 2.40 GHz 2.93 GHz 2 Yes HD Graphics 500 MHz 766 MHz 32 nm 3 MiB 35 105 G1
SLBNA 520M 2.40 GHz 2.93 GHz 2 Yes HD Graphics 500 MHz 766 MHz 32 nm 3 MiB 35 105 BGA1288
SLBNB 520M 2.40 GHz 2.93 GHz 2 Yes HD Graphics 500 MHz 766 MHz 32 nm 3 MiB 35 105 G1
SLBQP 520UM 1.06 GHz 1.86 GHz 2 Yes HD Graphics 166 MHz 500 MHz 32 nm 3 MiB 18 105 BGA1288
SLC27 480M 2.66 GHz 2.93 GHz 2 Yes HD Graphics 500 MHz 766 MHz 32 nm 3 MiB 35 105 G1
SLC26 480M 2.66 GHz 2.93 GHz 2 Yes HD Graphics 500 MHz 766 MHz 32 nm 3 MiB 35 105 BGA1288
SLBXP 470UM 1.33 GHz 1.86 GHz 2 Yes HD Graphics 166 MHz 500 MHz 32 nm 3 MiB 18 105 BGA1288
SLBZW 460M 2.53 GHz 2.80 GHz 2 Yes HD Graphics 500 MHz 766 MHz 32 nm 3 MiB 35 105 G1
SLC22 460M 2.53 GHz 2.80 GHz 2 Yes HD Graphics 500 MHz 766 MHz 32 nm 3 MiB 35 105 BGA1288
SLBTZ 450M 2.40 GHz 2.66 GHz 2 Yes HD Graphics 500 MHz 766 MHz 32 nm 3 MiB 35 105 G1
SLBPM 430M 2.26 GHz 2.53 GHz 2 Yes HD Graphics 500 MHz 766 MHz 32 nm 3 MiB 35 105 BGA1288
SLBPN 430M 2.26 GHz 2.53 GHz 2 Yes HD Graphics 500 MHz 766 MHz 32 nm 3 MiB 35 105 G1
SLBVS 430UM 1.20 GHz 1.73 GHz 2 Yes HD Graphics 166 MHz 500 MHz 32 nm 3 MiB 18 105 BGA1288

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.
[nextpage title=”Core i5-2xxx Models (Desktop)”]
In the table below, we listed all Core i5-2xxx desktop CPU models, which are based on the Sandy Bridge microarchitecture. They are also called second-generation Core i5 processors and use the socket LGA1155. The integrated memory controller supports dual-channel architecture as well as 1,066 MHz and 1,333 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). All models (except the 2550K and the “P” models) have an integrated DirectX 10.1 video controller running at 650 MHz with a 1.25 GHz “boost” clock or 850 MHz with a 1.1 GHz “boost” clock, with six (HD 2000) or 12 (HD 3000) processing cores. Models with integrated video support two displays.
Second-generation Core i5 desktop CPUs with four cores don’t support the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having four cores. However, while on quad-core models these cores are all “real,” on the dual-core model two of these cores are “real” and the other two are simulated.

sSpec Model Clock Turbo Boost Cores HT Video Video Clock Video Boost L3 Cache Tech. TDP (W) Max. Temp. (°C)* Voltage (V)
SR0QH 2550K 3.4 GHz 3.8 GHz 4 No No No No 6 MiB 32 nm 95 72.6 NA
SR00A 2500T 2.3 GHz 3.3 GHz 4 No HD 2000 650 MHz 1.25 GHz 6 MiB 32 nm 45 69.8 NA
SR009 2500S 2.7 GHz 3.7 GHz 4 No HD 2000 850 MHz 1.1 GHz 6 MiB 32 nm 65 69.1 NA
SR008 2500K 3.3 GHz 3.7 GHz 4 No HD 3000 850 MHz 1.1 GHz 6 MiB 32 nm 95 72.6 NA
SR00T 2500 3.3 GHz 3.7 GHz 4 No HD 2000 850 MHz 1.1 GHz 6 MiB 32 nm 95 72.6 NA
SR0G1 2450P 3.2 GHz 3.5 GHz 4 No No No No 6 MiB 32 nm 95 72.6 NA
SR0BB 2405S 2.5 GHz 3.3 GHz 4 No HD 3000 850 MHz 1.1 GHz 6 MiB 32 nm 65 69.1 NA
SR00S 2400S 2.5 GHz 3.3 GHz 4 No HD 2000 850 MHz 1.1 GHz 6 MiB 32 nm 65 69.1 NA
SR00Q 2400 3.1 GHz 3.4 GHz 4 No HD 2000 850 MHz 1.1 GHz 6 MiB 32 nm 95 72.6 NA
SR065 2390T 2.7 GHz 3.5 GHz 2 Yes HD 2000 650 MHz 1.25 GHz 3 MiB 32 nm 35 65.0 NA
SR0G2 2380P 3.1 GHz 3.4 GHz 4 No No No No 6 MiB 32 nm 95 72.6 NA
SR02L 2320 3.0 GHz 3.3 GHz 4 No HD 2000 850 MHz 1.1 GHz 6 MiB 32 nm 95 72.6 NA
SR02K 2310 2.9 GHz 3.2 GHz 4 No HD 2000 850 MHz 1.1 GHz 6 MiB 32 nm 95 72.6 NA
SR00D 2300 2.8 GHz 3.1 GHz 4 No HD 2000 850 MHz 1.1 GHz 6 MiB 32 nm 95 72.6 NA

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.
[nextpage title=”Core i5-2xxx Models (Mobile)”]
The second-generation Core i5 targeted to laptops, which use the Sandy Bridge microarchitecture, can use two different pinouts, BGA1023 or socket G2, and have an integrated dual-channel DDR3 memory controller supporting 1,066 MHz, 1,333 MHz, and 1,600 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an integrated DirectX 10.1 video controller running at 350 MHz with a 1.2 GHz “boost” clock on models with a TDP of 17 W, or 650 MHz with a 1.3 GHz “boost” clock on models with a TDP of 35 W, all with 12 processing cores (HD 3000 graphics engine).
All Core i5 mobile CPUs are dual-core processors supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec Model Clock Turbo Boost Cores HT Video Video Clock Video Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)* Package
SR0CS 2557M 1.7 GHz 2.7 GHz 2 Yes HD 3000 350 MHz 1.2 GHz 32 nm 3 MiB 17 100 BGA1023
SR044 2540M 2.6 GHz 3.3 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 G2
SR046 2540M 2.6 GHz 3.3 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 BGA1023
SR03W 2537M 1.4 GHz 2.3 GHz 2 Yes HD 3000 350 MHz 1.2 GHz 32 nm 3 MiB 17 100 BGA1023
SR048 2520M 2.5 GHz 3.2 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 G2
NA 2520M 2.5 GHz 3.2 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 BGA1023
SR02U 2510E 2.5 GHz 3.1 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 G2
SR0D6 2467M 1.6 GHz 2.3 GHz 2 Yes HD 3000 350 MHz 1.2 GHz 32 nm 3 MiB 17 100 BGA1023
SR0CH 2450M 2.5 GHz 3.1 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 G2
SR06Z 2450M 2.5 GHz 3.1 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 BGA1023
SR04Z 2450M 2.5 GHz 3.1 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 BGA1023
NA 2435M 2.4 GHz 3 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 G2
NA 2435M 2.4 GHz 3 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 BGA1023
SR04W 2430M 2.4 GHz 3 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 G2
NA 2430M 2.4 GHz 3 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 BGA1023
SR04B 2410M 2.3 GHz 2.9 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 G2
SR04G 2410M 2.3 GHz 2.9 GHz 2 Yes HD 3000 650 MHz 1.3 GHz 32 nm 3 MiB 35 100 BGA1023

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.
[nextpage title=”Core i5-3xxx Models (Desktop)”]
The Core i5-3xxx models are based on the Ivy Bridge microarchitecture and are also known as the third-generation Core i5 processors. They use the socket LGA1155, the same used by the second-generation Core i5 processors. The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). All models (except the “P” models) have an integrated DirectX 11 video controller with six (Intel HD 2500 graphics) or 12 (Intel HD 4000 graphics) processing units, running at 650 MHz with a “boost” clock of 1.25 GHz on 35xx models, 1.1 GHz on 34xx models or 1.05 GHz on 33xx models. Models with integrated video support three displays (previous generations support two).

sSpec Model Clock Turbo Boost Cores HT Video Video Clock Video Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)* Voltage (V)
SR0PM 3570K 3.4 GHz 3.8 GHz 4 No HD 4000 650 MHz 1.15 GHz 22 nm 6 MiB 77 67.4 NA
SR0T7 3570 3.4 GHz 3.8 GHz 4 No HD 2500 650 MHz 1.15 GHz 22 nm 6 MiB 77 67.4 NA
SR0P1 3570T 2.3 GHz 3.3 GHz 4 No HD 2500 650 MHz 1.15 GHz 22 nm 6 MiB 45 69.8 NA
SR0T9 3570S 3.1 GHz 3.8 GHz 4 No HD 2500 650 MHz 1.15 GHz 22 nm 6 MiB 65 69.1 NA
SR0P0 3550 3.3 GHz 3.7 GHz 4 No HD 2500 650 MHz 1.15 GHz 22 nm 6 MiB 77 67.4 NA
SR0P3 3550S 3 GHz 3.7 GHz 4 No HD 2500 650 MHz 1.1 GHz 22 nm 6 MiB 65 69.1 NA
SR0PP 3475S 2.9 GHz 3.6 GHz 4 No HD 2500 650 MHz 1.1 GHz 22 nm 6 MiB 65 69.1 NA
SR0T8 3470 3.2 GHz 3.6 GHz 4 No HD 2500 650 MHz 1.1 GHz 22 nm 6 MiB 77 67.4 NA
SR0RJ 3470T 2.9 GHz 3.6 GHz 4 No HD 2500 650 MHz 1.1 GHz 22 nm 6 MiB 35 65.0 NA
SR0TA 3470S 2.9 GHz 3.6 GHz 4 No HD 2500 650 MHz 1.1 GHz 22 nm 6 MiB 65 69.1 NA
SR0PF 3450 3.1 GHz 3.5 GHz 4 No HD 2500 650 MHz 1.1 GHz 22 nm 6 MiB 77 67.4 NA
SR0P2 3450S 2.8 GHz 3.5 GHz 4 No HD 2500 650 MHz 1.1 GHz 22 nm 6 MiB 65 69.1 NA
SR0WS 3350P 3.1 GHz 3.3 GHz 4 No No No 1.05 GHz 22 nm 6 MiB 69 67.4 NA
SR0RQ 3330 3 GHz 3.2 GHz 4 No HD 2500 650 MHz 1.05 GHz 22 nm 6 MiB 77 67.4 NA
SR0RR 3330S 2.7 GHz 3.2 GHz 4 No HD 2500 650 MHz 1.05 GHz 22 nm 6 MiB 65 NA NA

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.
[nextpage title=”Core i5-3xxx Models (Mobile)”]
As their desktop counterparts, the Core i5-3xxx models targeted to mobile computers are based on the Ivy Bridge microarchitecture and are also known as the third-generation Core i5 processors. They can use either the BGA1023 pinout or the socket S2 pinout. The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3, DDR3L, and DDR3L-RS memories. They also have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). All models have an integrated DirectX 11 video controller with 12 execution units (Intel HD 4000 graphics). This is one of the main differences between the mobile and the desktop models, since desktop models use the Intel HD 2500 graphics (six execution units). On “M” models, the graphics engine works at 650 MHz with 1.2 GHz at “boost” mode, while on “U” models, the graphics engine works at 350 MHz with a “boost” mode of 1.15 GHz on 34xx models or 1.05 GHz on 33xx models. All models support three displays (previous generations support two).
Differently from the desktop models, mobile third-generation Core i5 processors are dual-core CPUs with Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec Model Clock Turbo Boost Cores HT Video Video Clock Video Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)* Package
SR0N7 3427U 1.8 GHz 2.8 GHz 2 Yes HD 4000 350 MHz 1.15 GHz 22 nm 3 MiB 17 105 BGA1023
SR0MV 3360M 2.8 GHz 3.5 GHz 2 Yes HD 4000 650 MHz 1.2 GHz 22 nm 3 MiB 35 105 G2
SR0MW 3360M 2.8 GHz 3.5 GHz 2 Yes HD 4000 650 MHz 1.2 GHz 22 nm 3 MiB 35 105 BGA1023
SR0MX 3320M 2.6 GHz 3.3 GHz 2 Yes HD 4000 650 MHz 1.2 GHz 22 nm 3 MiB 35 105 G2
SR0MY 3320M 2.6 GHz 3.3 GHz 2 Yes HD 4000 650 MHz 1.2 GHz 22 nm 3 MiB 35 105 BGA1023
SR0N8 3317U 1.7 GHz 2.6 GHz 2 Yes HD 4000 350 MHz 1.05 GHz 22 nm 3 MiB 17 105 BGA1023
SR0MZ 3210M 2.5 GHz 3.1 GHz 2 Yes HD 4000 650 MHz 1.2 GHz 22 nm 3 MiB 35 105 G2
NA 3210M 2.5 GHz 3.1 GHz 2 Yes HD 4000 650 MHz 1.2 GHz 22 nm 3 MiB 35 105 BGA1023

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.
[nextpage title=”Core i5-4xxx Models (Desktop)”]
Core i5-4xxx models are based on the Haswell microarchitecture and are also known as the fourth-generation Core i5 processors. They use a new socket, LGA1150, which is not compatible with motherboards developed for previous models.
The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).
These processors support AVX2 instructions, not available on previous models.
All models have an integrated DirectX 11.1 video controller, and two engines are available at the moment: HD 4600 (codenamed “GT2”, 20 processing units) and Iris Pro 5200 (codenamed “GT3e”, 40 processing units, and video memory integrated into the CPU).

sSpec Model Clock Turbo Clock Cores HT Video Video Clock Video Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)*
SR14D 4670 3.4 GHz 3.8 GHz 4 No HD 4600 350 MHz 1.2 GHz 22 nm 6 MiB 84 72.72
SR14A 4670K 3.4 GHz 3.8 GHz 4 No HD 4600 350 MHz 1.2 GHz 22 nm 6 MiB 84 72.72
SR14K 4670S 3.1 GHz 3.8 GHz 4 No HD 4600 350 MHz 1.2 GHz 22 nm 6 MiB 65 71.35
NA 4670R 3.0 GHz 3.7 GHz 4 No Iris Pro 5200 200 MHz 1.3 GHz 22 nm 4 MiB 65 71.35
SR14P 4670T 2.3 GHz 3.3 GHz 4 No HD 4600 350 MHz 1.2 GHz 22 nm 6 MiB 45 71.45
SR14E 4570 3.2 GHz 3.6 GHz 4 No HD 4600 350 MHz 1.15 GHz 22 nm 6 MiB 84 72.72
SR14J 4570S 2.9 GHz 3.6 GHz 4 No HD 4600 350 MHz 1.15 GHz 22 nm 6 MiB 65 71.35
SR1CA 4570T 2.9 GHz 3.6 GHz 2 Sim HD 4600 200 MHz 1.15 GHz 22 nm 4 MiB 35 66.35
NA 4570R 2.7 GHz 3.2 GHz 4 No Iris Pro 5200 200 MHz 1.15 GHz 22 nm 4 MiB 65 71.35
SR14F 4440 3.1 GHz 3.3 GHz 4 No HD 4600 350 MHz 1.1 GHz 22 nm 6 MiB 84 NA
SR14L 4440S 2.8 GHz 3.3 GHz 4 No HD 4600 350 MHz 1.1 GHz 22 nm 6 MiB 65 NA
SR14G 4430 3.0 GHz 3.2 GHz 4 No HD 4600 350 MHz 1.1 GHz 22 nm 6 MiB 84 72.72
SR14M 4430S 2.7 GHz 3.2 GHz 4 No HD 4600 350 MHz 1.1 GHz 22 nm 6 MiB 65 71.35

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.
[nextpage title=”Core i5-4xxx Models (Mobile)”]
The fourth-generation Core i3 processors targeted to mobile computers are based on the Haswell microarchitecture.
These processors support AVX2 instructions, not available on previous models.
The “U” and “Y” models carry an integrated south bridge chip with a four-port USB 3.0 controller and a four-port SATA-600 controller. On these models, the PCI Express controller supports only one x4 connection or four x1 connections. On the other models, the PCI Express controller supports one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).
Several graphics engines are available, all DirectX 11.1: HD 4200 (codenamed “GT1”, 10 processing units), HD 4400 (codenamed “GT2”, 20 processing units), HD 4600 (codenamed “GT2”, 20 processing units), HD 5000 (codenamed “GT3”, 40 processing units), and Iris 5100 (codenamed “GT3”, 40 processing units).
The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3L and LPDDR3 (on models “U” and “Y”) memories.
Differently from the desktop models, mobile third-generation Core i5 processors are dual-core CPUs with Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec Model Clock Turbo Clock Cores HT Video Video Clock Video Boost Tech. L3 Cache TDP (W) Max. Temp. (°C)* Package
SR17Q 4402E 1.6 GHz 2.7 GHz 2 Yes HD 4600 NA NA 22 nm 3 MiB 25 100 FCBGA1364
SR17M 4400E 2.7 GHz 3.3 GHz 2 Yes HD 4600 400 MHz 1 GHz 22 nm 3 MiB 37 100 FCBGA1364
SR16L 4350U 1.4 GHz 2.9 GHz 2 Yes HD 5000 200 MHz 1.1 GHz 22 nm 3 MiB 15 100 FCBGA1168
NA 4330M 2.8 GHz 3.5 GHz 2 Yes HD 4600 400 MHz 1.25 GHz 22 nm 3 MiB 37 100 NA
NA 4302Y 1.6 GHz 2.3 GHz 2 Yes HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 NA
NA 4300M 2.6 GHz 3.3 GHz 2 Yes HD 4600 400 MHz 1.25 GHz 22 nm 3 MiB 37 100 NA
SR1ED 4300U 1.9 GHz 2.9 GHz 2 Yes HD 4400 200 MHz 1.1 GHz 22 nm 3 MiB 15 100 FCBGA1168
SR192 4300Y 1.6 GHz 2.3 GHz 2 Yes HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 FCBGA1168
SR189 4288U 2.6 GHz 3.1 GHz 2 Yes Iris 5100 200 MHz 1.2 GHz 22 nm 3 MiB 28 100 FCBGA1168
SR18A 4358U 2.4 GHz 2.9 GHz 2 Yes Iris 5100 200 MHz 1.1 GHz 22 nm 3 MiB 28 100 FCBGA1168
SR16M 4250U 1.3 GHz 2.6 GHz 2 Yes HD 5000 200 MHz 1 GHz 22 nm 3 MiB 15 100 FCBGA1168
SR191 4210Y 1.5 GHz 1.9 GHz 2 Yes HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 FCBGA1168
NA 4202Y 1.6 GHz 2.0 GHz 2 Yes HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 NA
SR15G 4200H 2.8 GHz 3.4 GHz 2 Yes HD 4600 400 MHz 1.15 GHz 22 nm 3 MiB 47 100 FCBGA1364
SR1HA 4200M 2.5 GHz 3.1 GHz 2 Yes HD 4600 400 MHz 1.15 GHz 22 nm 3 MiB 37 100 FCPGA946
SR170 4200U 1.6 GHz 2.6 GHz 2 Yes HD 4400 200 MHz 1 GHz 22 nm 3 MiB 15 100 FCBGA1168
SR18T 4200Y 1.4 GHz 1.9 GHz 2 Yes HD 4200 200 MHz 850 MHz 22 nm 3 MiB 11.5 100 FCBGA1168

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

Last update on 2021-10-12 at 20:31 / Affiliate links / Images from Amazon Product Advertising API