All Core i5 Models | Hardware Secrets

[nextpage title=”Introduction”]
The Core i5 is a CPU series manufactured by Intel aimed at mid-range computers. In this tutorial, we will present a series of quick reference tables for you to compare the main differences between all models released to date.
By the way, the correct name of this line of processors is “Core i5,” not “Intel i5.”
Currently, there are four different generations of Core i5 processors available. In the table below, we describe the main differences between these generations.

No products found.

Model	7xx	6xx	4xx and 5xx	2xxx	2xxx
Market	Desktop	Desktop	Mobile	Desktop	Mobile
Generation	First	First	First	Second	Second
Microarchitecture	Nehalem	Nehalem	Nehalem	Sandy Bridge	Sandy Bridge
Manufacturing Process	45 nm	32 nm	32 nm	32 nm	32 nm
Number of Cores	4	2	2	4†	2
Hyper-Threading	No	Yes	Yes	No†	Yes
L1 cache (per core)	32 kiB+32 kiB	32 kiB+32 kiB	32 kiB+32kB	32 kiB+32 kiB	32 kiB+32kB
L2 cache (per core)	256 kiB	256 kiB	256 kiB	256 kiB	256 kiB
L3 cache (total)	8 MiB	4 MiB	3 MiB	6 MiB†	3 MiB
DMI bus	1 GB/s	1 GB/s	1 GB/s	2 GB/s	2 GB/s
Memory (DDR3)	1066, 1333	1066, 1333	800, 1066	1066, 1333	1066, 1333, 1600
DDR3L and DDR3L-RS	No	No	No	No	No
Graphics Engine	No	HD Graphics	HD Graphics	HD 2000 or HD 3000‡	HD 3000
DirectX	No	10	10	10.1‡	10.1
Graphics Processors	No	12	6	6 or 12‡	12
Graphics Base Clock	No	733 MHz or 900 MHz	166 MHz or 500 MHz	650 MHz or 850 MHz‡	350 MHz or 650 MHz
Graphics Boost Clock	No	No	500 MHz or 766 MHz	1.25 GHz or 1.1 GHz‡	1.2 GHz or 1.3 GHz
Displays Supported	None	2	2	2‡	2
PCIe Controller	2.0	2.0	2.0	2.0	2.0
PCIe Configuration	1×16, 2×8	1×16, 2×8	1×16	1×16, 2×8, 1×8, 2×4	1×16, 2×8, 1×8, 2×4
Turbo Boost	1.0	1.0	1.0	2.0	2.0
EM64T	Yes	Yes	Yes	Yes	Yes
Virtualization	Yes	Yes	Yes	Yes	Yes
SSE4.2	Yes	Yes	Yes	Yes	Yes
AES-NI	No	Yes	Yes	Yes	Yes
AVX	No	No	No	Yes	Yes
AVX2	No	No	No	No	No
Base Clock	133 MHz	133 MHz	133 MHz	100 MHz	100 MHz
Pinout	LGA1156	LGA1156	G1 or BGA1288	LGA1155	G2 or BGA1023

Model	3xxx	3xxx	4xxx	4xxx
Market	Desktop	Mobile	Desktop	Portátil
Generation	Third	Third	Quarta	Quarta
Microarchitecture	Ivy Bridge	Ivy Bridge	Haswell	Haswell
Manufacturing Process	22 nm	22 nm	22 nm	22 nm
Number of Cores	4	2	4*	2
Hyper-Threading	No	Yes	No*	Yes
L1 cache (per core)	32 kiB+32kB	32 kiB+32 kiB	32 kiB+32 kiB	32 kiB+32 kiB
L2 cache (per core)	256 kiB	256 kiB	256 kiB	256 kiB
L3 cache (total)	6 MiB	3 MiB	4 MiB or 6 MiB	3 MiB
DMI bus	2 GB/s	2 GB/s	2 GB/s	2 GB/s
Memory (DDR3)	1333, 1600	1333, 1600	1333, 1600	1333, 1600
DDR3L and DDR3L-RS	No	Yes	Yes	Yes
Graphics Engine	HD 2500 or HD 4000‡	HD 4000	HD 4600 or Iris Pro 5200	HD 4200, HD 4400, HD 4600, HD 5000 or Iris 5100
DirectX	11‡	11	11.1	11.1
Graphics Processors	6 or 12‡	12	20 or 40	10, 20 or 40
Graphics Base Clock	650 MHz‡	350 MHz or 650 MHz	200 MHz or 350 MHz	200 MHz or 400 MHz
Graphics Boost Clock	1.05 GHz, 1.1 GHz or 1.15 GHz‡	1.05 GHz, 1.15 GHz or 1.2 GHz	1,1 GHz, 1,15 GHz, 1,2 GHz ou 1,3 GHz	850 GHz, 1 GHz, 1,1 GHz, 1,15 GHz ou 1,25 GHz
Displays Supported	3‡	3	3	3
PCIe Controller	3.0	3.0	3.0	3.0
PCIe Configuration	1×16, 2×8, 1×8, 2×4	1×16, 2×8, 1×8, 2×4	1×16, 2×8, 1×8, 2×4	1×16, 2×8, 1×8, 2×4 ou 1×4, 4×1
Turbo Boost	2.0	2.0	2.0	2.0
EM64T	Yes	Yes	Yes	Yes
Virtualization	Yes	Yes	Yes	Yes
SSE4.2	Yes	Yes	Yes	Yes
AES-NI	Yes	Yes	Yes	Yes
AVX	Yes	Yes	Yes	Yes
AVX2	No	No	Yes	Yes
Base Clock	100 MHz	100 MHz	100 MHz	100 MHz
Pinout	LGA1155	G2 or BGA1023	LGA1150	FCPGA946, FCBGA1168 or FCBGA1364

† Except for the model 2390T, which has two cores, supports the Hyper-Threading technology, and has 3 MiB of cache L3.
‡ The 2550K model and models ending with a “P” don’t have integrated video.
* Except for the 4570T model, which has two cores and supports the Hyper-Threading technology.
Let’s now take a detailed look at all Core i5 models launched so far.

[nextpage title=”Core i5-6xx and 7xx Models (Desktop)”]
In the table below, we listed all Core i5 6xx and Core i5 7xx CPU models. These are desktop models based on the Nehalem microarchitecture and are also called first-generation Core i5 processors. These models use the socket LGA1156. The integrated memory controller supports dual-channel architecture as well as 1,066 MHz and 1,333 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 datapath or two x8 datapaths. Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, listed as 2.5 GT/s by Intel). All 6xx models have an integrated DirectX 10 video controller with 12 execution units running at 733 MHz or 900 MHz, using an engine that is known as “Intel HD Graphics,” a feature not present on the 7xx models. Models with integrated video support two video monitors.
The 7xx models are quad-core CPUs without the Hyper-Threading technology, while the 6xx models are dual-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having four cores. However, while on the 7xx models these cores are all “real,” on the 6xx models two of these cores are “real” and the other two are simulated.

sSpec

Model

Clock

Turbo Boost

Cores

Video

Video Clock

L3 Cache

Tech.

TDP (W)

Max. Temp. (°C)*

Voltage (V)

SLBRP

760

2.80 GHz

3.46 GHz

8 MiB

45 nm

72.7

0.65 – 1.4

SLBLH

750S

2.40 GHz

3.20 GHz

8 MiB

45 nm

76.7

0.65 – 1.4

SLBLC

750

2.66 GHz

3.20 GHz

8 MiB

45 nm

72.7

0.65 – 1.4

SLBTM

680

3.60 GHz

3.86 GHz

Yes

HD Graphics

733 MHz

4 MiB

32 nm

72.6

0.65 – 1.4

SLBLT

670

3.56 GHz

3.73 GHz

Yes

HD Graphics

733 MHz

4 MiB

32 nm

72.6

0.65 – 1.4

SLBTB

661

3.33 GHz

3.60 GHz

Yes

HD Graphics

900 MHz

4 MiB

32 nm

69.8

0.65 – 1.4

SLBNE

661

3.33 GHz

3.60 GHz

Yes

HD Graphics

900 MHz

4 MiB

32 nm

69.8

0.65 – 1.4

SLBTK

660

3.33 GHz

3.60 GHz

Yes

HD Graphics

733 MHz

4 MiB

32 nm

72.6

0.65 – 1.4

SLBLV

660

3.33 GHz

3.60 GHz

Yes

HD Graphics

733 MHz

4 MiB

32 nm

72.6

0.65 – 1.4

SLBXL

655K

3.20 GHz

3.46 GHz

Yes

HD Graphics

733 MHz

4 MiB

32 nm

72.6

0.65 – 1.4

SLBTJ

650

3.20 GHz

3.46 GHz

Yes

HD Graphics

733 MHz

4 MiB

32 nm

72.6

0.65 – 1.4

SLBLK

650

3.20 GHz

3.46 GHz

Yes

HD Graphics

733 MHz

4 MiB

32 nm

72.6

0.65 – 1.4

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.
[nextpage title=”Core i5-4xx and 5xx Models (Mobile)”]
The first-generation Core i5 targeted to laptops, named 4xx and 5xx, uses the Nehalem microarchitecture. They can use two different pinouts, BGA1288 or socket G1, and have an integrated dual-channel DDR3 memory controller supporting 800 MHz and 1,066 MHz DDR3 memories. (“UM” models support only DDR3-800 memories.) They have an integrated PCI Express 2.0 controller supporting one x16 connection and an integrated DirectX 10 video controller running at 500 MHz with a 766 MHz “boost” clock (166 MHz with a 500 MHz “boost” clock in “UM” models). Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, which is listed as 2.5 GT/s by Intel). The models listed below support two video monitors.
All Core i5 mobile CPUs are dual-core processors supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec

Model

Clock

Turbo Boost

Cores

Video

Video Clock

Video Boost

Tech.

L3 Cache

TDP (W)

Max. Temp. (°C)*

Package

SLC28

580M

2.66 GHz

3.33 GHz

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

105

SLC29

580M

2.66 GHz

3.33 GHz

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

105

BGA1288

SLBSN

560UM

1.33 GHz

2.13 GHz

Yes

HD Graphics

166 MHz

500 MHz

32 nm

3 MiB

105

BGA1288

SLBTS

560M

2.66 GHz

3.20 GHz

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

105

SLBTT

560M

2.66 GHz

3.20 GHz

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

105

BGA1288

SLBUJ

540UM

1.20 GHz

2.00 GHz

Yes

HD Graphics

166 MHz

500 MHz

32 nm

3 MiB

105

BGA1288

SLBTV

540M

2.53 GHz

3.06 GHz

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

105

SLBPF

540M

2.53 GHz

3.06 GHz

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

105

BGA1288

SLBPG

540M

2.53 GHz

3.06 GHz

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

105

SLBU3

520M

2.40 GHz

2.93 GHz

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

105

SLBNA

520M

2.40 GHz

2.93 GHz

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

105

BGA1288

SLBNB

520M

2.40 GHz

2.93 GHz

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

105

SLBQP

520UM

1.06 GHz

1.86 GHz

Yes

HD Graphics

166 MHz

500 MHz

32 nm

3 MiB

105

BGA1288

SLC27

480M

2.66 GHz

2.93 GHz

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

105

SLC26

480M

2.66 GHz

2.93 GHz

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

105

BGA1288

SLBXP

470UM

1.33 GHz

1.86 GHz

Yes

HD Graphics

166 MHz

500 MHz

32 nm

3 MiB

105

BGA1288

SLBZW

460M

2.53 GHz

2.80 GHz

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

105

SLC22

460M

2.53 GHz

2.80 GHz

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

105

BGA1288

SLBTZ

450M

2.40 GHz

2.66 GHz

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

105

SLBPM

430M

2.26 GHz

2.53 GHz

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

105

BGA1288

SLBPN

430M

2.26 GHz

2.53 GHz

Yes

HD Graphics

500 MHz

766 MHz

32 nm

3 MiB

105

SLBVS

430UM

1.20 GHz

1.73 GHz

Yes

HD Graphics

166 MHz

500 MHz

32 nm

3 MiB

105

BGA1288

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.
[nextpage title=”Core i5-2xxx Models (Desktop)”]
In the table below, we listed all Core i5-2xxx desktop CPU models, which are based on the Sandy Bridge microarchitecture. They are also called second-generation Core i5 processors and use the socket LGA1155. The integrated memory controller supports dual-channel architecture as well as 1,066 MHz and 1,333 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). All models (except the 2550K and the “P” models) have an integrated DirectX 10.1 video controller running at 650 MHz with a 1.25 GHz “boost” clock or 850 MHz with a 1.1 GHz “boost” clock, with six (HD 2000) or 12 (HD 3000) processing cores. Models with integrated video support two displays.
Second-generation Core i5 desktop CPUs with four cores don’t support the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having four cores. However, while on quad-core models these cores are all “real,” on the dual-core model two of these cores are “real” and the other two are simulated.

sSpec

Model

Clock

Turbo Boost

Cores

Video

Video Clock

Video Boost

L3 Cache

Tech.

TDP (W)

Max. Temp. (°C)*

Voltage (V)

SR0QH

2550K

3.4 GHz

3.8 GHz

6 MiB

32 nm

72.6

SR00A

2500T

2.3 GHz

3.3 GHz

HD 2000

650 MHz

1.25 GHz

6 MiB

32 nm

69.8

SR009

2500S

2.7 GHz

3.7 GHz

HD 2000

850 MHz

1.1 GHz

6 MiB

32 nm

69.1

SR008

2500K

3.3 GHz

3.7 GHz

HD 3000

850 MHz

1.1 GHz

6 MiB

32 nm

72.6

SR00T

2500

3.3 GHz

3.7 GHz

HD 2000

850 MHz

1.1 GHz

6 MiB

32 nm

72.6

SR0G1

2450P

3.2 GHz

3.5 GHz

6 MiB

32 nm

72.6

SR0BB

2405S

2.5 GHz

3.3 GHz

HD 3000

850 MHz

1.1 GHz

6 MiB

32 nm

69.1

SR00S

2400S

2.5 GHz

3.3 GHz

HD 2000

850 MHz

1.1 GHz

6 MiB

32 nm

69.1

SR00Q

2400

3.1 GHz

3.4 GHz

HD 2000

850 MHz

1.1 GHz

6 MiB

32 nm

72.6

SR065

2390T

2.7 GHz

3.5 GHz

Yes

HD 2000

650 MHz

1.25 GHz

3 MiB

32 nm

65.0

SR0G2

2380P

3.1 GHz

3.4 GHz

6 MiB

32 nm

72.6

SR02L

2320

3.0 GHz

3.3 GHz

HD 2000

850 MHz

1.1 GHz

6 MiB

32 nm

72.6

SR02K

2310

2.9 GHz

3.2 GHz

HD 2000

850 MHz

1.1 GHz

6 MiB

32 nm

72.6

SR00D

2300

2.8 GHz

3.1 GHz

HD 2000

850 MHz

1.1 GHz

6 MiB

32 nm

72.6

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.
[nextpage title=”Core i5-2xxx Models (Mobile)”]
The second-generation Core i5 targeted to laptops, which use the Sandy Bridge microarchitecture, can use two different pinouts, BGA1023 or socket G2, and have an integrated dual-channel DDR3 memory controller supporting 1,066 MHz, 1,333 MHz, and 1,600 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an integrated DirectX 10.1 video controller running at 350 MHz with a 1.2 GHz “boost” clock on models with a TDP of 17 W, or 650 MHz with a 1.3 GHz “boost” clock on models with a TDP of 35 W, all with 12 processing cores (HD 3000 graphics engine).
All Core i5 mobile CPUs are dual-core processors supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec

Model

Clock

Turbo Boost

Cores

Video

Video Clock

Video Boost

Tech.

L3 Cache

TDP (W)

Max. Temp. (°C)*

Package

SR0CS

2557M

1.7 GHz

2.7 GHz

Yes

HD 3000

350 MHz

1.2 GHz

32 nm

3 MiB

100

BGA1023

SR044

2540M

2.6 GHz

3.3 GHz

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

100

SR046

2540M

2.6 GHz

3.3 GHz

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

100

BGA1023

SR03W

2537M

1.4 GHz

2.3 GHz

Yes

HD 3000

350 MHz

1.2 GHz

32 nm

3 MiB

100

BGA1023

SR048

2520M

2.5 GHz

3.2 GHz

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

100

2520M

2.5 GHz

3.2 GHz

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

100

BGA1023

SR02U

2510E

2.5 GHz

3.1 GHz

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

100

SR0D6

2467M

1.6 GHz

2.3 GHz

Yes

HD 3000

350 MHz

1.2 GHz

32 nm

3 MiB

100

BGA1023

SR0CH

2450M

2.5 GHz

3.1 GHz

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

100

SR06Z

2450M

2.5 GHz

3.1 GHz

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

100

BGA1023

SR04Z

2450M

2.5 GHz

3.1 GHz

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

100

BGA1023

2435M

2.4 GHz

3 GHz

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

100

2435M

2.4 GHz

3 GHz

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

100

BGA1023

SR04W

2430M

2.4 GHz

3 GHz

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

100

2430M

2.4 GHz

3 GHz

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

100

BGA1023

SR04B

2410M

2.3 GHz

2.9 GHz

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

100

SR04G

2410M

2.3 GHz

2.9 GHz

Yes

HD 3000

650 MHz

1.3 GHz

32 nm

3 MiB

100

BGA1023

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.
[nextpage title=”Core i5-3xxx Models (Desktop)”]
The Core i5-3xxx models are based on the Ivy Bridge microarchitecture and are also known as the third-generation Core i5 processors. They use the socket LGA1155, the same used by the second-generation Core i5 processors. The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). All models (except the “P” models) have an integrated DirectX 11 video controller with six (Intel HD 2500 graphics) or 12 (Intel HD 4000 graphics) processing units, running at 650 MHz with a “boost” clock of 1.25 GHz on 35xx models, 1.1 GHz on 34xx models or 1.05 GHz on 33xx models. Models with integrated video support three displays (previous generations support two).

sSpec

Model

Clock

Turbo Boost

Cores

Video

Video Clock

Video Boost

Tech.

L3 Cache

TDP (W)

Max. Temp. (°C)*

Voltage (V)

SR0PM

3570K

3.4 GHz

3.8 GHz

HD 4000

650 MHz

1.15 GHz

22 nm

6 MiB

67.4

SR0T7

3570

3.4 GHz

3.8 GHz

HD 2500

650 MHz

1.15 GHz

22 nm

6 MiB

67.4

SR0P1

3570T

2.3 GHz

3.3 GHz

HD 2500

650 MHz

1.15 GHz

22 nm

6 MiB

69.8

SR0T9

3570S

3.1 GHz

3.8 GHz

HD 2500

650 MHz

1.15 GHz

22 nm

6 MiB

69.1

SR0P0

3550

3.3 GHz

3.7 GHz

HD 2500

650 MHz

1.15 GHz

22 nm

6 MiB

67.4

SR0P3

3550S

3 GHz

3.7 GHz

HD 2500

650 MHz

1.1 GHz

22 nm

6 MiB

69.1

SR0PP

3475S

2.9 GHz

3.6 GHz

HD 2500

650 MHz

1.1 GHz

22 nm

6 MiB

69.1

SR0T8

3470

3.2 GHz

3.6 GHz

HD 2500

650 MHz

1.1 GHz

22 nm

6 MiB

67.4

SR0RJ

3470T

2.9 GHz

3.6 GHz

HD 2500

650 MHz

1.1 GHz

22 nm

6 MiB

65.0

SR0TA

3470S

2.9 GHz

3.6 GHz

HD 2500

650 MHz

1.1 GHz

22 nm

6 MiB

69.1

SR0PF

3450

3.1 GHz

3.5 GHz

HD 2500

650 MHz

1.1 GHz

22 nm

6 MiB

67.4

SR0P2

3450S

2.8 GHz

3.5 GHz

HD 2500

650 MHz

1.1 GHz

22 nm

6 MiB

69.1

SR0WS

3350P

3.1 GHz

3.3 GHz

1.05 GHz

22 nm

6 MiB

67.4

SR0RQ

3330

3 GHz

3.2 GHz

HD 2500

650 MHz

1.05 GHz

22 nm

6 MiB

67.4

SR0RR

3330S

2.7 GHz

3.2 GHz

HD 2500

650 MHz

1.05 GHz

22 nm

6 MiB

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.
[nextpage title=”Core i5-3xxx Models (Mobile)”]
As their desktop counterparts, the Core i5-3xxx models targeted to mobile computers are based on the Ivy Bridge microarchitecture and are also known as the third-generation Core i5 processors. They can use either the BGA1023 pinout or the socket S2 pinout. The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3, DDR3L, and DDR3L-RS memories. They also have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). All models have an integrated DirectX 11 video controller with 12 execution units (Intel HD 4000 graphics). This is one of the main differences between the mobile and the desktop models, since desktop models use the Intel HD 2500 graphics (six execution units). On “M” models, the graphics engine works at 650 MHz with 1.2 GHz at “boost” mode, while on “U” models, the graphics engine works at 350 MHz with a “boost” mode of 1.15 GHz on 34xx models or 1.05 GHz on 33xx models. All models support three displays (previous generations support two).
Differently from the desktop models, mobile third-generation Core i5 processors are dual-core CPUs with Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec

Model

Clock

Turbo Boost

Cores

Video

Video Clock

Video Boost

Tech.

L3 Cache

TDP (W)

Max. Temp. (°C)*

Package

SR0N7

3427U

1.8 GHz

2.8 GHz

Yes

HD 4000

350 MHz

1.15 GHz

22 nm

3 MiB

105

BGA1023

SR0MV

3360M

2.8 GHz

3.5 GHz

Yes

HD 4000

650 MHz

1.2 GHz

22 nm

3 MiB

105

SR0MW

3360M

2.8 GHz

3.5 GHz

Yes

HD 4000

650 MHz

1.2 GHz

22 nm

3 MiB

105

BGA1023

SR0MX

3320M

2.6 GHz

3.3 GHz

Yes

HD 4000

650 MHz

1.2 GHz

22 nm

3 MiB

105

SR0MY

3320M

2.6 GHz

3.3 GHz

Yes

HD 4000

650 MHz

1.2 GHz

22 nm

3 MiB

105

BGA1023

SR0N8

3317U

1.7 GHz

2.6 GHz

Yes

HD 4000

350 MHz

1.05 GHz

22 nm

3 MiB

105

BGA1023

SR0MZ

3210M

2.5 GHz

3.1 GHz

Yes

HD 4000

650 MHz

1.2 GHz

22 nm

3 MiB

105

3210M

2.5 GHz

3.1 GHz

Yes

HD 4000

650 MHz

1.2 GHz

22 nm

3 MiB

105

BGA1023

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.
[nextpage title=”Core i5-4xxx Models (Desktop)”]
Core i5-4xxx models are based on the Haswell microarchitecture and are also known as the fourth-generation Core i5 processors. They use a new socket, LGA1150, which is not compatible with motherboards developed for previous models.
The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).
These processors support AVX2 instructions, not available on previous models.
All models have an integrated DirectX 11.1 video controller, and two engines are available at the moment: HD 4600 (codenamed “GT2”, 20 processing units) and Iris Pro 5200 (codenamed “GT3e”, 40 processing units, and video memory integrated into the CPU).

sSpec

Model

Clock

Turbo Clock

Cores

Video

Video Clock

Video Boost

Tech.

L3 Cache

TDP (W)

Max. Temp. (°C)*

SR14D

4670

3.4 GHz

3.8 GHz

HD 4600

350 MHz

1.2 GHz

22 nm

6 MiB

72.72

SR14A

4670K

3.4 GHz

3.8 GHz

HD 4600

350 MHz

1.2 GHz

22 nm

6 MiB

72.72

SR14K

4670S

3.1 GHz

3.8 GHz

HD 4600

350 MHz

1.2 GHz

22 nm

6 MiB

71.35

4670R

3.0 GHz

3.7 GHz

Iris Pro 5200

200 MHz

1.3 GHz

22 nm

4 MiB

71.35

SR14P

4670T

2.3 GHz

3.3 GHz

HD 4600

350 MHz

1.2 GHz

22 nm

6 MiB

71.45

SR14E

4570

3.2 GHz

3.6 GHz

HD 4600

350 MHz

1.15 GHz

22 nm

6 MiB

72.72

SR14J

4570S

2.9 GHz

3.6 GHz

HD 4600

350 MHz

1.15 GHz

22 nm

6 MiB

71.35

SR1CA

4570T

2.9 GHz

3.6 GHz

Sim

HD 4600

200 MHz

1.15 GHz

22 nm

4 MiB

66.35

4570R

2.7 GHz

3.2 GHz

Iris Pro 5200

200 MHz

1.15 GHz

22 nm

4 MiB

71.35

SR14F

4440

3.1 GHz

3.3 GHz

HD 4600

350 MHz

1.1 GHz

22 nm

6 MiB

SR14L

4440S

2.8 GHz

3.3 GHz

HD 4600

350 MHz

1.1 GHz

22 nm

6 MiB

SR14G

4430

3.0 GHz

3.2 GHz

HD 4600

350 MHz

1.1 GHz

22 nm

6 MiB

72.72

SR14M

4430S

2.7 GHz

3.2 GHz

HD 4600

350 MHz

1.1 GHz

22 nm

6 MiB

71.35

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.
[nextpage title=”Core i5-4xxx Models (Mobile)”]
The fourth-generation Core i3 processors targeted to mobile computers are based on the Haswell microarchitecture.
These processors support AVX2 instructions, not available on previous models.
The “U” and “Y” models carry an integrated south bridge chip with a four-port USB 3.0 controller and a four-port SATA-600 controller. On these models, the PCI Express controller supports only one x4 connection or four x1 connections. On the other models, the PCI Express controller supports one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).
Several graphics engines are available, all DirectX 11.1: HD 4200 (codenamed “GT1”, 10 processing units), HD 4400 (codenamed “GT2”, 20 processing units), HD 4600 (codenamed “GT2”, 20 processing units), HD 5000 (codenamed “GT3”, 40 processing units), and Iris 5100 (codenamed “GT3”, 40 processing units).
The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3L and LPDDR3 (on models “U” and “Y”) memories.
Differently from the desktop models, mobile third-generation Core i5 processors are dual-core CPUs with Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec

Model

Clock

Turbo Clock

Cores

Video

Video Clock

Video Boost

Tech.

L3 Cache

TDP (W)

Max. Temp. (°C)*

Package

SR17Q

4402E

1.6 GHz

2.7 GHz

Yes

HD 4600

22 nm

3 MiB

100

FCBGA1364

SR17M

4400E

2.7 GHz

3.3 GHz

Yes

HD 4600

400 MHz

1 GHz

22 nm

3 MiB

100

FCBGA1364

SR16L

4350U

1.4 GHz

2.9 GHz

Yes

HD 5000

200 MHz

1.1 GHz

22 nm

3 MiB

100

FCBGA1168

4330M

2.8 GHz

3.5 GHz

Yes

HD 4600

400 MHz

1.25 GHz

22 nm

3 MiB

100

4302Y

1.6 GHz

2.3 GHz

Yes

HD 4200

200 MHz

850 MHz

22 nm

3 MiB

11.5

100

4300M

2.6 GHz

3.3 GHz

Yes

HD 4600

400 MHz

1.25 GHz

22 nm

3 MiB

100

SR1ED

4300U

1.9 GHz

2.9 GHz

Yes

HD 4400

200 MHz

1.1 GHz

22 nm

3 MiB

100

FCBGA1168

SR192

4300Y

1.6 GHz

2.3 GHz

Yes

HD 4200

200 MHz

850 MHz

22 nm

3 MiB

11.5

100

FCBGA1168

SR189

4288U

2.6 GHz

3.1 GHz

Yes

Iris 5100

200 MHz

1.2 GHz

22 nm

3 MiB

100

FCBGA1168

SR18A

4358U

2.4 GHz

2.9 GHz

Yes

Iris 5100

200 MHz

1.1 GHz

22 nm

3 MiB

100

FCBGA1168

SR16M

4250U

1.3 GHz

2.6 GHz

Yes

HD 5000

200 MHz

1 GHz

22 nm

3 MiB

100

FCBGA1168

SR191

4210Y

1.5 GHz

1.9 GHz

Yes

HD 4200

200 MHz

850 MHz

22 nm

3 MiB

11.5

100

FCBGA1168

4202Y

1.6 GHz

2.0 GHz

Yes

HD 4200

200 MHz

850 MHz

22 nm

3 MiB

11.5

100

SR15G

4200H

2.8 GHz

3.4 GHz

Yes

HD 4600

400 MHz

1.15 GHz

22 nm

3 MiB

100

FCBGA1364

SR1HA

4200M

2.5 GHz

3.1 GHz

Yes

HD 4600

400 MHz

1.15 GHz

22 nm

3 MiB

100

FCPGA946

SR170

4200U

1.6 GHz

2.6 GHz

Yes

HD 4400

200 MHz

1 GHz

22 nm

3 MiB

100

FCBGA1168

SR18T

4200Y

1.4 GHz

1.9 GHz

Yes

HD 4200

200 MHz

850 MHz

22 nm

3 MiB

11.5

100

FCBGA1168

Last update on 2021-10-12 at 20:31 / Affiliate links / Images from Amazon Product Advertising API