All Core i5 Models

Core i5-6xx and 7xx Models (Desktop)

The second-generation Core i5 targeted to laptops, which use the Sandy Bridge microarchitecture, can use two different pinouts, BGA1023 or socket G2, and have an integrated dual-channel DDR3 memory controller supporting 1,066 MHz, 1,333 MHz, and 1,600 MHz DDR3 memories. They also have an integrated PCI Express 2.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). These processors also have an integrated DirectX 10.1 video controller running at 350 MHz with a 1.2 GHz “boost” clock on models with a TDP of 17 W, or 650 MHz with a 1.3 GHz “boost” clock on models with a TDP of 35 W, all with 12 processing cores (HD 3000 graphics engine).
All Core i5 mobile CPUs are dual-core processors supporting Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec	Model	Clock	Turbo Boost
SR0CS	2557M	1.7 GHz	2.7 GHz
SR044	2540M	2.6 GHz	3.3 GHz
SR046	2540M	2.6 GHz	3.3 GHz
SR03W	2537M	1.4 GHz	2.3 GHz
SR048	2520M	2.5 GHz	3.2 GHz
NA	2520M	2.5 GHz	3.2 GHz
SR02U	2510E	2.5 GHz	3.1 GHz
SR0D6	2467M	1.6 GHz	2.3 GHz
SR0CH	2450M	2.5 GHz	3.1 GHz
SR06Z	2450M	2.5 GHz	3.1 GHz
SR04Z	2450M	2.5 GHz	3.1 GHz
NA	2435M	2.4 GHz	3 GHz
NA	2435M	2.4 GHz	3 GHz
SR04W	2430M	2.4 GHz	3 GHz
NA	2430M	2.4 GHz	3 GHz
SR04B	2410M	2.3 GHz	2.9 GHz
SR04G	2410M	2.3 GHz	2.9 GHz

sSpec	Cores	HT	Video
SR0CS	2	Yes	HD 3000
SR044	2	Yes	HD 3000
SR046	2	Yes	HD 3000
SR03W	2	Yes	HD 3000
SR048	2	Yes	HD 3000
NA	2	Yes	HD 3000
SR02U	2	Yes	HD 3000
SR0D6	2	Yes	HD 3000
SR0CH	2	Yes	HD 3000
SR06Z	2	Yes	HD 3000
SR04Z	2	Yes	HD 3000
NA	2	Yes	HD 3000
NA	2	Yes	HD 3000
SR04W	2	Yes	HD 3000
NA	2	Yes	HD 3000
SR04B	2	Yes	HD 3000
SR04G	2	Yes	HD 3000

sSpec	Model	Video Clock	Video Boost	Tech.
SR0CS	2557M	350 MHz	1.2 GHz	32 nm
SR044	2540M	650 MHz	1.3 GHz	32 nm
SR046	2540M	650 MHz	1.3 GHz	32 nm
SR03W	2537M	350 MHz	1.2 GHz	32 nm
SR048	2520M	650 MHz	1.3 GHz	32 nm
NA	2520M	650 MHz	1.3 GHz	32 nm
SR02U	2510E	650 MHz	1.3 GHz	32 nm
SR0D6	2467M	350 MHz	1.2 GHz	32 nm
SR0CH	2450M	650 MHz	1.3 GHz	32 nm
SR06Z	2450M	650 MHz	1.3 GHz	32 nm
SR04Z	2450M	650 MHz	1.3 GHz	32 nm
NA	2435M	650 MHz	1.3 GHz	32 nm
NA	2435M	650 MHz	1.3 GHz	32 nm
SR04W	2430M	650 MHz	1.3 GHz	32 nm
NA	2430M	650 MHz	1.3 GHz	32 nm
SR04B	2410M	650 MHz	1.3 GHz	32 nm
SR04G	2410M	650 MHz	1.3 GHz	32 nm

sSpec	L3 Cache	TDP (W)	Max. Temp. (°C)*	Package
SR0CS	3 MiB	17	100	BGA1023
SR044	3 MiB	35	100	G2
SR046	3 MiB	35	100	BGA1023
SR03W	3 MiB	17	100	BGA1023
SR048	3 MiB	35	100	G2
NA	3 MiB	35	100	BGA1023
SR02U	3 MiB	35	100	G2
SR0D6	3 MiB	17	100	BGA1023
SR0CH	3 MiB	35	100	G2
SR06Z	3 MiB	35	100	BGA1023
SR04Z	3 MiB	35	100	BGA1023
NA	3 MiB	35	100	G2
NA	3 MiB	35	100	BGA1023
SR04W	3 MiB	35	100	G2
NA	3 MiB	35	100	BGA1023
SR04B	3 MiB	35	100	G2
SR04G	3 MiB	35	100	BGA1023

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

The Core i5-3xxx models are based on the Ivy Bridge microarchitecture and are also known as the third-generation Core i5 processors. They use the socket LGA1155, the same used by the second-generation Core i5 processors. The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). All models (except the “P” models) have an integrated DirectX 11 video controller with six (Intel HD 2500 graphics) or 12 (Intel HD 4000 graphics) processing units, running at 650 MHz with a “boost” clock of 1.25 GHz on 35xx models, 1.1 GHz on 34xx models or 1.05 GHz on 33xx models. Models with integrated video support three displays (previous generations support two).

sSpec	Model	Clock	Turbo Boost
SR0PM	3570K	3.4 GHz	3.8 GHz
SR0T7	3570	3.4 GHz	3.8 GHz
SR0P1	3570T	2.3 GHz	3.3 GHz
SR0T9	3570S	3.1 GHz	3.8 GHz
SR0P0	3550	3.3 GHz	3.7 GHz
SR0P3	3550S	3 GHz	3.7 GHz
SR0PP	3475S	2.9 GHz	3.6 GHz
SR0T8	3470	3.2 GHz	3.6 GHz
SR0RJ	3470T	2.9 GHz	3.6 GHz
SR0TA	3470S	2.9 GHz	3.6 GHz
SR0PF	3450	3.1 GHz	3.5 GHz
SR0P2	3450S	2.8 GHz	3.5 GHz
SR0WS	3350P	3.1 GHz	3.3 GHz
SR0RQ	3330	3 GHz	3.2 GHz
SR0RR	3330S	2.7 GHz	3.2 GHz

sSpec	Cores	HT	Video
SR0PM	4	No	HD 4000
SR0T7	4	No	HD 2500
SR0P1	4	No	HD 2500
SR0T9	4	No	HD 2500
SR0P0	4	No	HD 2500
SR0P3	4	No	HD 2500
SR0PP	4	No	HD 2500
SR0T8	4	No	HD 2500
SR0RJ	4	No	HD 2500
SR0TA	4	No	HD 2500
SR0PF	4	No	HD 2500
SR0P2	4	No	HD 2500
SR0WS	4	No	No
SR0RQ	4	No	HD 2500
SR0RR	4	No	HD 2500

sSpec	Model	Video Clock	Video Boost	Tech.
SR0PM	3570K	650 MHz	1.15 GHz	22 nm
SR0T7	3570	650 MHz	1.15 GHz	22 nm
SR0P1	3570T	650 MHz	1.15 GHz	22 nm
SR0T9	3570S	650 MHz	1.15 GHz	22 nm
SR0P0	3550	650 MHz	1.15 GHz	22 nm
SR0P3	3550S	650 MHz	1.1 GHz	22 nm
SR0PP	3475S	650 MHz	1.1 GHz	22 nm
SR0T8	3470	650 MHz	1.1 GHz	22 nm
SR0RJ	3470T	650 MHz	1.1 GHz	22 nm
SR0TA	3470S	650 MHz	1.1 GHz	22 nm
SR0PF	3450	650 MHz	1.1 GHz	22 nm
SR0P2	3450S	650 MHz	1.1 GHz	22 nm
SR0WS	3350P	No	1.05 GHz	22 nm
SR0RQ	3330	650 MHz	1.05 GHz	22 nm
SR0RR	3330S	650 MHz	1.05 GHz	22 nm

sSpec	L3 Cache	TDP (W)	Max. Temp. (°C)*	Voltage (V)
SR0PM	6 MiB	77	67.4	NA
SR0T7	6 MiB	77	67.4	NA
SR0P1	6 MiB	45	69.8	NA
SR0T9	6 MiB	65	69.1	NA
SR0P0	6 MiB	77	67.4	NA
SR0P3	6 MiB	65	69.1	NA
SR0PP	6 MiB	65	69.1	NA
SR0T8	6 MiB	77	67.4	NA
SR0RJ	6 MiB	35	65.0	NA
SR0TA	6 MiB	65	69.1	NA
SR0PF	6 MiB	77	67.4	NA
SR0P2	6 MiB	65	69.1	NA
SR0WS	6 MiB	69	67.4	NA
SR0RQ	6 MiB	77	67.4	NA
SR0RR	6 MiB	65	NA	NA

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

As their desktop counterparts, the Core i5-3xxx models targeted to mobile computers are based on the Ivy Bridge microarchitecture and are also known as the third-generation Core i5 processors. They can use either the BGA1023 pinout or the socket S2 pinout. The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3, DDR3L, and DDR3L-RS memories. They also have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is accomplished through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel). All models have an integrated DirectX 11 video controller with 12 execution units (Intel HD 4000 graphics). This is one of the main differences between the mobile and the desktop models, since desktop models use the Intel HD 2500 graphics (six execution units). On “M” models, the graphics engine works at 650 MHz with 1.2 GHz at “boost” mode, while on “U” models, the graphics engine works at 350 MHz with a “boost” mode of 1.15 GHz on 34xx models or 1.05 GHz on 33xx models. All models support three displays (previous generations support two).
Differently from the desktop models, mobile third-generation Core i5 processors are dual-core CPUs with Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec	Model	Clock	Turbo Boost
SR0N7	3427U	1.8 GHz	2.8 GHz
SR0MV	3360M	2.8 GHz	3.5 GHz
SR0MW	3360M	2.8 GHz	3.5 GHz
SR0MX	3320M	2.6 GHz	3.3 GHz
SR0MY	3320M	2.6 GHz	3.3 GHz
SR0N8	3317U	1.7 GHz	2.6 GHz
SR0MZ	3210M	2.5 GHz	3.1 GHz
NA	3210M	2.5 GHz	3.1 GHz

sSpec	Cores	HT	Video
SR0N7	2	Yes	HD 4000
SR0MV	2	Yes	HD 4000
SR0MW	2	Yes	HD 4000
SR0MX	2	Yes	HD 4000
SR0MY	2	Yes	HD 4000
SR0N8	2	Yes	HD 4000
SR0MZ	2	Yes	HD 4000
NA	2	Yes	HD 4000

sSpec	Model	Video Clock	Video Boost	Tech.
SR0N7	3427U	350 MHz	1.15 GHz	22 nm
SR0MV	3360M	650 MHz	1.2 GHz	22 nm
SR0MW	3360M	650 MHz	1.2 GHz	22 nm
SR0MX	3320M	650 MHz	1.2 GHz	22 nm
SR0MY	3320M	650 MHz	1.2 GHz	22 nm
SR0N8	3317U	350 MHz	1.05 GHz	22 nm
SR0MZ	3210M	650 MHz	1.2 GHz	22 nm
NA	3210M	650 MHz	1.2 GHz	22 nm

sSpec	L3 Cache	TDP (W)	Max. Temp. (°C)*	Package
SR0N7	3 MiB	17	105	BGA1023
SR0MV	3 MiB	35	105	G2
SR0MW	3 MiB	35	105	BGA1023
SR0MX	3 MiB	35	105	G2
SR0MY	3 MiB	35	105	BGA1023
SR0N8	3 MiB	17	105	BGA1023
SR0MZ	3 MiB	35	105	G2
NA	3 MiB	35	105	BGA1023

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.

Core i5-4xxx models are based on the Haswell microarchitecture and are also known as the fourth-generation Core i5 processors. They use a new socket, LGA1150, which is not compatible with motherboards developed for previous models.
The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).
These processors support AVX2 instructions, not available on previous models.
All models have an integrated DirectX 11.1 video controller, and two engines are available at the moment: HD 4600 (codenamed “GT2”, 20 processing units) and Iris Pro 5200 (codenamed “GT3e”, 40 processing units, and video memory integrated into the CPU).

sSpec	Model	Clock	Turbo Clock	Cores	HT	Video
SR14D	4670	3.4 GHz	3.8 GHz	4	No	HD 4600
SR14A	4670K	3.4 GHz	3.8 GHz	4	No	HD 4600
SR14K	4670S	3.1 GHz	3.8 GHz	4	No	HD 4600
NA	4670R	3.0 GHz	3.7 GHz	4	No	Iris Pro 5200
SR14P	4670T	2.3 GHz	3.3 GHz	4	No	HD 4600
SR14E	4570	3.2 GHz	3.6 GHz	4	No	HD 4600
SR14J	4570S	2.9 GHz	3.6 GHz	4	No	HD 4600
SR1CA	4570T	2.9 GHz	3.6 GHz	2	Sim	HD 4600
NA	4570R	2.7 GHz	3.2 GHz	4	No	Iris Pro 5200
SR14F	4440	3.1 GHz	3.3 GHz	4	No	HD 4600
SR14L	4440S	2.8 GHz	3.3 GHz	4	No	HD 4600
SR14G	4430	3.0 GHz	3.2 GHz	4	No	HD 4600
SR14M	4430S	2.7 GHz	3.2 GHz	4	No	HD 4600

sSpec	Model	Video Clock	Video Boost	Tech.	L3 Cache	TDP (W)	Max. Temp. (°C)*
SR14D	4670	350 MHz	1.2 GHz	22 nm	6 MiB	84	72.72
SR14A	4670K	350 MHz	1.2 GHz	22 nm	6 MiB	84	72.72
SR14K	4670S	350 MHz	1.2 GHz	22 nm	6 MiB	65	71.35
NA	4670R	200 MHz	1.3 GHz	22 nm	4 MiB	65	71.35
SR14P	4670T	350 MHz	1.2 GHz	22 nm	6 MiB	45	71.45
SR14E	4570	350 MHz	1.15 GHz	22 nm	6 MiB	84	72.72
SR14J	4570S	350 MHz	1.15 GHz	22 nm	6 MiB	65	71.35
SR1CA	4570T	200 MHz	1.15 GHz	22 nm	4 MiB	35	66.35
NA	4570R	200 MHz	1.15 GHz	22 nm	4 MiB	65	71.35
SR14F	4440	350 MHz	1.1 GHz	22 nm	6 MiB	84	NA
SR14L	4440S	350 MHz	1.1 GHz	22 nm	6 MiB	65	NA
SR14G	4430	350 MHz	1.1 GHz	22 nm	6 MiB	84	72.72
SR14M	4430S	350 MHz	1.1 GHz	22 nm	6 MiB	65	71.35

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

The fourth-generation Core i3 processors targeted to mobile computers are based on the Haswell microarchitecture.
These processors support AVX2 instructions, not available on previous models.
The “U” and “Y” models carry an integrated south bridge chip with a four-port USB 3.0 controller and a four-port SATA-600 controller. On these models, the PCI Express controller supports only one x4 connection or four x1 connections. On the other models, the PCI Express controller supports one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, which is listed as 5 GT/s by Intel).
Several graphics engines are available, all DirectX 11.1: HD 4200 (codenamed “GT1”, 10 processing units), HD 4400 (codenamed “GT2”, 20 processing units), HD 4600 (codenamed “GT2”, 20 processing units), HD 5000 (codenamed “GT3”, 40 processing units), and Iris 5100 (codenamed “GT3”, 40 processing units).
The integrated memory controller supports dual-channel architecture as well as 1,333 MHz and 1,600 MHz DDR3L and LPDDR3 (on models “U” and “Y”) memories.
Differently from the desktop models, mobile third-generation Core i5 processors are dual-core CPUs with Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec	Model	Clock	Turbo Clock	Cores	HT	Video
SR17Q	4402E	1.6 GHz	2.7 GHz	2	Yes	HD 4600
SR17M	4400E	2.7 GHz	3.3 GHz	2	Yes	HD 4600
SR16L	4350U	1.4 GHz	2.9 GHz	2	Yes	HD 5000
NA	4330M	2.8 GHz	3.5 GHz	2	Yes	HD 4600
NA	4302Y	1.6 GHz	2.3 GHz	2	Yes	HD 4200
NA	4300M	2.6 GHz	3.3 GHz	2	Yes	HD 4600
SR1ED	4300U	1.9 GHz	2.9 GHz	2	Yes	HD 4400
SR192	4300Y	1.6 GHz	2.3 GHz	2	Yes	HD 4200
SR189	4288U	2.6 GHz	3.1 GHz	2	Yes	Iris 5100
SR18A	4358U	2.4 GHz	2.9 GHz	2	Yes	Iris 5100
SR16M	4250U	1.3 GHz	2.6 GHz	2	Yes	HD 5000
SR191	4210Y	1.5 GHz	1.9 GHz	2	Yes	HD 4200
NA	4202Y	1.6 GHz	2.0 GHz	2	Yes	HD 4200
SR15G	4200H	2.8 GHz	3.4 GHz	2	Yes	HD 4600
SR1HA	4200M	2.5 GHz	3.1 GHz	2	Yes	HD 4600
SR170	4200U	1.6 GHz	2.6 GHz	2	Yes	HD 4400
SR18T	4200Y	1.4 GHz	1.9 GHz	2	Yes	HD 4200

sSpec	Model	Video Clock	Video Boost	Tech.	L3 Cache	TDP (W)	Max. Temp. (°C)*	Package
SR17Q	4402E	NA	NA	22 nm	3 MiB	25	100	FCBGA1364
SR17M	4400E	400 MHz	1 GHz	22 nm	3 MiB	37	100	FCBGA1364
SR16L	4350U	200 MHz	1.1 GHz	22 nm	3 MiB	15	100	FCBGA1168
NA	4330M	400 MHz	1.25 GHz	22 nm	3 MiB	37	100	NA
NA	4302Y	200 MHz	850 MHz	22 nm	3 MiB	11.5	100	NA
NA	4300M	400 MHz	1.25 GHz	22 nm	3 MiB	37	100	NA
SR1ED	4300U	200 MHz	1.1 GHz	22 nm	3 MiB	15	100	FCBGA1168
SR192	4300Y	200 MHz	850 MHz	22 nm	3 MiB	11.5	100	FCBGA1168
SR189	4288U	200 MHz	1.2 GHz	22 nm	3 MiB	28	100	FCBGA1168
SR18A	4358U	200 MHz	1.1 GHz	22 nm	3 MiB	28	100	FCBGA1168
SR16M	4250U	200 MHz	1 GHz	22 nm	3 MiB	15	100	FCBGA1168
SR191	4210Y	200 MHz	850 MHz	22 nm	3 MiB	11.5	100	FCBGA1168
NA	4202Y	200 MHz	850 MHz	22 nm	3 MiB	11.5	100	NA
SR15G	4200H	400 MHz	1.15 GHz	22 nm	3 MiB	47	100	FCBGA1364
SR1HA	4200M	400 MHz	1.15 GHz	22 nm	3 MiB	37	100	FCPGA946
SR170	4200U	200 MHz	1 GHz	22 nm	3 MiB	15	100	FCBGA1168
SR18T	4200Y	200 MHz	850 MHz	22 nm	3 MiB	11.5	100	FCBGA1168

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.