Second-Generation Core i7 Desktop Models
Contents
In the table below, we listed all second-generation Core i7 desktop processors, which are based on the Sandy Bridge microarchitecture.
The 3xxx models are based on socket LGA2011 and have an integrated memory controller supporting four channels as well as 1,066 MHz, 1,333 MHz, and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller with 40 lanes, available through two x16 ports and one x8 port. This way, the CPU can be directly connected to two PCI Express 3.0 x16 slots and one PCI Express 3.0 x8 slot. Each port can be “broken down,” so the CPU also has direct support for five PCI Express 3.0 x8 slots, for example. These models don’t have integrated video. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel).
The 2xxx models are based on socket LGA1155 and have a dual-channel memory controller supporting 1,066 MHz and 1,333 MHz DDR3 memories. They have an integrated PCI Express 2.0 controller supporting one x16 connection or two x8 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). These models have an integrated DirectX 10.1 video controller running at 850 MHz with a 1.35 GHz “boost” clock, with six (HD 2000) or 12 (HD 3000) processing cores. Models with integrated video support two displays.
The second-generation Core i7 desktop models are quad-core or six-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having eight or 12 cores. However, only half the cores are “real;” the other half is simulated.
| sSpec | Model | Clock | Turbo Boost | Cores | HT | Video | Video Clock | Video Boost | L3 Cache | Tech. | TDP (W) | Max. Temp. (°C)* | Socket |
| SR0KF | 3960X | 3.3 GHz | 3.9 GHz | 6 | Yes | No | No | No | 15 MiB | 32 nm | 130 | 66.8 | LGA2011 |
| SR0GW | 3960X | 3.3 GHz | 3.9 GHz | 6 | Yes | No | No | No | 15 MiB | 32 nm | 130 | 66.8 | LGA2011 |
| SR0KY | 3930K | 3.2 GHz | 3.8 GHz | 6 | Yes | No | No | No | 12 MiB | 32 nm | 130 | 66.8 | LGA2011 |
| SR0H9 | 3930K | 3.2 GHz | 3.8 GHz | 6 | Yes | No | No | No | 12 MiB | 32 nm | 130 | 66.8 | LGA2011 |
| SR0LD | 3820 | 3.6 GHz | 3.8 GHz | 4 | Yes | No | No | No | 10 MiB | 32 nm | 130 | 66.8 | LGA2011 |
| SR0DG | 2700K | 3.5 GHz | 3.9 GHz | 4 | Yes | HD 3000 | 850 MHz | 1.35 GHz | 8 MiB | 32 nm | 95 | 72.6 | LGA1155 |
| SR00E | 2600S | 2.80 GHz | 3.80 GHz | 4 | Yes | HD 2000 | 850 MHz | 1.35 GHz | 8 MiB | 32 nm | 65 | 69.1 | LGA1155 |
| SR00C | 2600K | 3.40 GHz | 3.80 GHz | 4 | Yes | HD 3000 | 850 MHz | 1.35 GHz | 8 MiB | 32 nm | 95 | 72.6 | LGA1155 |
| SR00B | 2600 | 3.40 GHz | 3.80 GHz | 4 | Yes | HD 2000 | 850 MHz | 1.35 GHz | 8 MiB | 32 nm | 95 | 72.6 | LGA1155 |
TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.
* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.
