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All Core i7 Models

These are a series of quick reference tables showing the main specs of all Core i7 models released to date. Updated to include “Haswell” models.

Home » All Core i7 Models

Third-Generation Core i7 Desktop Models

Contents

  • 1. Introduction
  • 2. First-Generation Core i7 Desktop Models
  • 3. First-Generation Core i7 Mobile Models
  • 4. Second-Generation Core i7 Desktop Models
  • 5. Second-Generation Core i7 Mobile Models
  • 6. Third-Generation Core i7 Desktop Models
  • 7. Third-Generation Core i7 Mobile Models
  • 8. Fourth-Generation Core i7 Desktop Models
  • 9. Fourth-Generation Core i7 Mobile Models

In the table below, we listed all third-generation Core i7 desktop processors, which are based on the Ivy Bridge microarchitecture. The models released so far are based on socket LGA1155 and have a dual-channel memory controller supporting 1,333 MHz and 1,600 MHz DDR3 memories. They have an integrated PCI Express 3.0 controller supporting one x16 connection, two x8 connections, one x8 connection or two x4 connections. Communication with the motherboard chipset is achieved through a DMI bus (2 GB/s each direction, listed as 5 GT/s by Intel). These models have an integrated DirectX 11 video controller running at 650 MHz with a 1.15 GHz “boost” clock, with 12 (HD 4000) processing cores. All models support three displays (previous generations support two).

The third-generation Core i7 desktop models are quad- or six-core CPUs using the Hyper-Threading technology. This means that the operating system will recognize all these CPUs as having either eight or twelve cores. However, only half the cores are “real;” the other half is simulated.

sSpec Model Clock Turbo Boost Cores HT Video Video Clock Video Boost L3 Cache Tech. TDP (W) Max. Temp. (°C)* Socket
SR1AS 4960X 3.6 GHz 4.0 GHz 6 Yes No – – 15 MiB 22 nm 130 66.8 LGA2011
SR1AT 4930K 3.4 GHz 3.9 GHz 6 Yes No – – 12 MiB 22 nm 130 66.8 LGA2011
SR1AU 4920K 3.7 GHz 3.9 GHz 4 Yes No – – 10 MiB 22 nm 130 88.8 LGA2011
SR0PL 3770K 3.5 GHz 3.9 GHz 4 Yes HD 4000 650 MHz 1.15 GHz 8 MiB 22 nm 77 67.4 LGA1155
SR0PK 3770 3.4 GHz 3.9 GHz 4 Yes HD 4000 650 MHz 1.15 GHz 8 MiB 22 nm 77 67.4 LGA1155
SR0PN 3770S 3.1 GHz 3.9 GHz 4 Yes HD 4000 650 MHz 1.15 GHz 8 MiB 22 nm 65 69.1 LGA1155
SR0PQ 3770T 2.5 GHz 3.7 GHz 4 Yes HD 4000 650 MHz 1.15 GHz 8 MiB 22 nm 45 69.8 LGA1155

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tcase, which is the maximum external temperature of the CPU. On some other models, the manufacturer lists Tjunction, which is the maximum internal temperature of the CPU. The two are not comparable.

Continue: Third-Generation Core i7 Mobile Models

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For Performance

  • PCI Express 3.0 vs. 2.0: Is There a Gaming Performance Gain?
  • Does dual-channel memory make difference on integrated video performance?
  • Overclocking Pros and Cons
  • All Core i7 Models
  • Understanding RAM Timings

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